Veerle Simons

947 citations

25 papers · 413 indexed · h-index 11

Electrical and Electronic Engineering top 10%
- Semiconductor materials and devices 12
- 3D IC and TSV technologies 8
- Silicon and Solar Cell Technologies 5
- Integrated Circuits and Semiconductor Failure Analysis 5
- Advancements in Semiconductor Devices and Circuit Design 5
- Thin-Film Transistor Technologies 4
- Electronic Packaging and Soldering Technologies 4
Radiation
Hardware and Architecture
Atomic and Molecular Physics, and Optics
Biomedical Engineering
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability 3

Co-authors: A. De Keersgieter G. Groeseneken R. Degraeve B. Kaczer Ingrid De Wolf Vladimir Cherman Eric Beyne Ann Witvrouw
Cited by: Electrical and Electronic Engineering Radiation Hardware and Architecture
Journals: Medical Physics (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)Journal of Physics Condensed Matter (1 paper)
Partner nations: Belgium Lithuania Norway

In The Last Decade

Veerle Simons

25 papers receiving 405 citations

Peers

Countries citing papers authored by Veerle Simons

Since Specialization

Citations

This map shows the geographic impact of Veerle Simons's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Veerle Simons with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Veerle Simons more than expected).

Fields of papers citing papers by Veerle Simons

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Veerle Simons. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Veerle Simons. The network helps show where Veerle Simons may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Veerle Simons, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Veerle Simons Line = papers co-authored together Veerle Simons links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure Olalla Varela Pedreira,Amber Rathor,Maria de Lourdes Dias Marques Mussa,Ph. Roussel,Adli A. Saleh,Veerle Simons,Houman Zahedmanesh,Ivan Ciofi,Kristof Croes	2024	1
2	Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors Optical Fiber Communication Conference (OFC) 2022 ·Kristof Croes,Veerle Simons,Lee Hy,Philippe Roussel,純司中島,Faiber Cabezas Cedeño,J. Franco,P. Absil	2022	2
3	Electromigration Performance Improvement of Metal Heaters for Si Photonic Ring Modulators IEEE Transactions on Device and Materials Reliability ·Maria de Lourdes Dias Marques Mussa,Kristof Croes,Faiber Cabezas Cedeño,Herman Oprins,Veerle Simons,Olalla Varela Pedreira,Yoojin Ban,Joris Van Campenhout,Ingrid De Wolf	2022	8
4	(Invited) Determining Si Composition in SiGe Alloys with < 1% Si Concentrations Using Raman Spectroscopy ECS Transactions ·Ingrid De Wolf,Veerle Simons,Srinivasan Ashwyn Srinivasan,Peter Verheyen,Roger Loo	2018	2
5	A spectroscopic study of the chromatic properties of GafChromic™EBT3 films Medical Physics ·須田耕一,Wouter Crijns,Veerle Simons,Ingrid De Wolf,Tom Depuydt,Frederik Maes,Karin Haustermans,Jan D’hooge,Emiliano D’Agostino,Martine Wevers,H. Pfeiffer,Koen Van Den Abeele	2016	35
6	Thermal compression bonding of 20 μm pitch micro bumps with pre-applied underfill - Process and reliability Teng Wang,Joke De Messemaeker,Vladimir Cherman,L.A. Dolgikh,S Májek,G Moggi,Veerle Simons,Стресса У Женщин,A. Leśniewska,Olalla Varela Pedreira,C Baratta,Kenneth June Rebibis,Eric Beyne	2015	4
7	Effects of packaging on mechanical stress in 3D-ICs Lirias (KU Leuven) ·Vladimir Cherman,Melina Lofrano,Veerle Simons,Mario González,Geert Van der Plas,Joeri De Vos,Nogués Mr,康祐吉田,M Gaudissart,Gerald Beyer,Antonio Manna,Ingrid De Wolf,Eric Beyne	2015	10
8	3D stacking induced mechanical stress effects Vladimir Cherman,Geert Van der Plas,Joeri De Vos,Alojz Ivankoviç,Melina Lofrano,Veerle Simons,Mario González,Kris Vanstreels,Nogués Mr,康祐吉田,Wei Guo,Gerald Beyer,Antonio Manna,Ingrid De Wolf,Eric Beyne	2014	26
9	Raman spectroscopy study of stress in 3D-stacked chips and correlation with FEM and electrical measurements Ingrid De Wolf,Melina Lofrano,Veerle Simons,Vladimir Cherman,Joeri De Vos,Geert Van der Plas,Eric Beyne	2014	6
10	A study of blister formation in ALD Al<inf>2</inf>O<inf>3</inf> grown on silicon Bart Vermang,Hans Goverde,Veerle Simons,Ingrid De Wolf,Johan Meersschaut,Shuji Tanaka,Joachim John,Jef Poortmans,R. Mertens	2012	14
11	Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's Christopher J. Wilson,Ingrid De Wolf,Bart Vandevelde,Joke De Messemaeker,J. M. Ablett,A. Redolfi,Veerle Simons,Eric Beyne,Kristof Croes	2012	6
12	In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs Ingrid De Wolf,Veerle Simons,Vladimir Cherman,Riet Labie,Bart Vandevelde,Eric Beyne	2012	30
13	Impact of thinning and packaging on a deep submicron CMOS product G.F.S.,Okta Sari Windi Astuti,S. Gu,Raúl de Jesús Vázquez Sánchez,Chuanjun Dan,S. Karagöz,Wouter Ruythooren,Youjun Yang,Ingrid De Wolf,Ricardo Cotrin Teixeira,Mireia Bargalló González,Veerle Simons,乡禾,Made Emy Andayani Citra,Hans M�ller,Dorey Lg	2009	7
14	Highly reliable and extremely stable SiGe micro-mirrors 李方萍,Pedro Juvêncio de Souza,Joshua Yuvaraj,Myriam Willegems,S. Locorotondo,Werner Boullart,Kris Baert,Ann Witvrouw,L. Haspeslagh,Agnes Verbist,Bert Du Bois,Nathalie Colas,B. Eyckens,Patricio Canepa Fernández,Ingrid De Wolf,Veerle Simons	2007	14
15	Computer Aided Design of Ka-band Waveguide Hybrid Junctions for Power Combining Architectures in Interplanetary Spacecraft Zenodo (CERN European Organization for Nuclear Research) ·Veerle Simons	2006	1
16	Analysis of the Leakage Current Origin in Thin Strain Relaxed Buffer Substrates Journal of The Electrochemical Society ·Geert Eneman,Eddy Simoen,Romain Delhougne,Peter Verheyen,Veerle Simons,Roger Loo,Matty Caymax,Cor Claeys,Wilfried Vandervorst,K. De Meyer	2006	12
17	Defect analysis of strained silicon on thin strain-relaxed buffer layers for high mobility transistors Journal of Physics Condensed Matter ·Geert Eneman,Eddy Simoen,Romain Delhougne,E. Gaubas,Veerle Simons,Philippe Roussel,Peter Verheyen,A. Lauwers,Roger Loo,Wilfried Vandervorst,K. De Meyer,Cor Claeys	2005	11
18	On the Electrical Activity of Misfit and Threading Dislocations in p-n Junctions Fabricated in Thin Strain-Relaxed Buffer Layers Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena ·Eddy Simoen,Geert Eneman,S. Shamuilia,Veerle Simons,E. Gaubas,Romain Delhougne,Roger Loo,K. De Meyer,Cor Claeys	2005	3
19	Creep as a reliability problem in MEMS Microelectronics Reliability ·R. A. Gomes,Ann Witvrouw,Petar Ratchev,Anne Jourdain,Veerle Simons,H. A. C. Tilmans,Jaap M. J. den Toonder,Robert Puers,Varela Patiño P	2004	34
20	Determination of stress in shallow trench isolation for deep submicron MOS devices by UV Raman spectroscopy K. F. Dombrowski,A. Fischer,B. Dietrich,Ingrid De Wolf,Н.И. Письменный,Sylvie Pochet,Veerle Simons,R. Rooyackers,G. Badenes,Weymouth Spence,J. van Landuyt	2003	8

About Veerle Simons

Veerle Simons is a scholar working on Electrical and Electronic Engineering, Biophysics, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics and Mechanics of Materials, having authored 25 papers that have together received 413 indexed citations. Recurring topics across this work include Semiconductor materials and devices (12 papers), 3D IC and TSV technologies (8 papers), Silicon and Solar Cell Technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Thin-Film Transistor Technologies (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and Copper Interconnects and Reliability (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (357 citations), Radiation (27 citations), Hardware and Architecture (12 citations), Atomic and Molecular Physics, and Optics (51 citations) and Biomedical Engineering (68 citations). Veerle Simons has collaborated with scholars based in Belgium, Lithuania and Norway. Frequent co-authors include A. De Keersgieter, G. Groeseneken, R. Degraeve, B. Kaczer, Ingrid De Wolf, Vladimir Cherman, Eric Beyne, Ann Witvrouw, Bart Vandevelde and Riet Labie. Their work appears in journals such as Medical Physics, IEEE Transactions on Device and Materials Reliability, Journal of Physics Condensed Matter, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

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