Bart Vandevelde
About
In The Last Decade
Bart Vandevelde
175 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 70
- Electrical and Electronic Engineering 2.1k
- Biomedical Engineering 806
- Mechanical Engineering 627
- Mechanics of Materials 264
- Electronic, Optical and Magnetic Materials 252
Countries citing papers authored by Bart Vandevelde
This map shows the geographic impact of Bart Vandevelde's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bart Vandevelde with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bart Vandevelde more than expected).
Fields of papers citing papers by Bart Vandevelde
This network shows the impact of papers produced by Bart Vandevelde. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bart Vandevelde. The network helps show where Bart Vandevelde may publish in the future.
Co-authorship network of co-authors of Bart Vandevelde
This figure shows the co-authorship network connecting the top 25 collaborators of Bart Vandevelde. A scholar is included among the top collaborators of Bart Vandevelde based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bart Vandevelde. Bart Vandevelde is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 0 | |
| 3 | 1 | |
| 4 | 5 | |
| 5 | 5 | |
| 6 | 6 | |
| 7 | 6 | |
| 8 | 4 | |
| 9 | 30 | |
| 10 | Thermal analysis of hot spots in advanced 3D-stacked structures | 23 |
| 11 | 2 | |
| 12 | Ultra-thin chip package (UTCP) for flexible electronics applications | 1 |
| 13 | UTCP: 60 µm thick bendable package | 3 |
| 14 | 2 | |
| 15 | 12 | |
| 16 | Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages | 5 |
| 17 | 1 | |
| 18 | Semi-analytical model for calculation of induced strains in solder joints of underfilled flip chip assemblies | 3 |
| 19 | Thermal Modelling of the Polymer Stud Grid Array (PSGA) Packages | 3 |
| 20 | Thermal modelling of the polymer stud grid array (PSGATM) steady-state analysis | 6 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.