Lee Smith

1.1k citations

64 papers · 830 indexed · h-index 18

Electrical and Electronic Engineering top 5%
- Advancements in Semiconductor Devices and Circuit Design 44
- Semiconductor materials and devices 38
- Silicon Carbide Semiconductor Technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 8
- Electronic Packaging and Soldering Technologies 6
Biomedical Engineering
- Nanowire Synthesis and Applications 5
Structural Biology
Hardware and Architecture
Atomic and Molecular Physics, and Optics
- Quantum and electron transport phenomena 9
- Semiconductor Quantum Structures and Devices 5

Co-authors: Victor Moroz Krishna C. Saraswat Munkang Choi Geert Eneman F. Nouri Suyog Gupta Qiang Lü Dipankar Pramanik
Cited by: Electrical and Electronic Engineering Biomedical Engineering Structural Biology
Journals: IEEE Transactions on Electron Devices (8 papers)IEEE Electron Device Letters (4 papers)Journal of Computational Electronics (3 papers)
Partner nations: United States Switzerland Belgium

In The Last Decade

Lee Smith

58 papers receiving 774 citations

Peers

Countries citing papers authored by Lee Smith

Since Specialization

Citations

This map shows the geographic impact of Lee Smith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lee Smith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lee Smith more than expected).

Fields of papers citing papers by Lee Smith

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Lee Smith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lee Smith. The network helps show where Lee Smith may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Lee Smith, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Lee Smith Line = papers co-authored together Lee Smith links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Epitaxial aluminum layer on antimonide heterostructures for exploring Josephson junction effects Materials Science and Engineering B ·Wei Pan,Keshab Sapkota,Ping Lü,Aaron J. Muhowski,Haim Hagay,V. A. Vityazev,陈元滨,Josep González,Denis Mamaluy,Samuel D. Hawkins,John F. Klem,Lee Smith,Amanda Luiza dos Santos Pereira,Corinna Laube,Zhi Jiang,Enrico Rossi	2025	0
2	Performance analysis of p-type silicon nanowire FETs with silicon-germanium cladding M. Frey,H.R. Lee,Frederik Ole Heinz,Enmanuel Norberto Garza Collazo,Lee Smith,Victor Moroz	2016	2
3	Band-to-band tunneling off-state leakage in Ge fins and nanowires: Effect of quantum confinement Geert Eneman,Anne S. Verhulst,A. De Keersgieter,A. Mocuta,Nadine Collaert,Aaron Thean,Lee Smith,Victor Moroz	2016	1
4	EUV telecentricity and shadowing errors impact on process margins Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Rodrigo Augusto Fernandes [UNIFESP] Estevão,Erik R. Hosler,В.А. Щепачёв,D. Neff,Lee Smith,David J. Pritchard	2015	10
5	Modeling and optimization of group IV and III–V FinFETs and nano-wires Victor Moroz,Lee Smith,P.K. Madke,Munkang Choi,Sazan S. Abdullah,Ushna Seher,Yunqiang Zhang,Xi–Wei Lin,Jamil Kawa,Castrillón Restrepo	2014	21
6	Efficient 3D Monte Carlo simulation of orientation and stress effects in FinFETs F. M. Bufler,Frederik Ole Heinz,Lee Smith	2013	7
7	Fast simulation of spin transfer torque devices in a general purpose TCAD device simulator Frederik Ole Heinz,Lee Smith	2013	5
8	Carrier-Mobility Enhancement via Strain Engineering in Future Thin-Body MOSFETs IEEE Electron Device Letters ·Nuo Xu,Byron Ho,F. Andrieu,Lee Smith,Bich-Yen Nguyen,O. Weber,T. Poiroux,Olivier Faynot,Tsu‐Jae King Liu	2012	22
9	TCAD: Present state and future challenges Sazan S. Abdullah,Victor Moroz,Ricardo Borges,Lee Smith	2010	10
10	Surface Mount Assembly and Board Level Reliability for High Density PoP (Package-On-Package) Utilizing Through Mold Via Interconnect Technology Curtis Zwenger,Lee Smith,Van Tiem Nguyen	2008	8
11	Application of through mold via (TMV) as PoP base package Pokam Njoko R.,Kiwook Lee,Viktor Krchnˇák,MARIANA DEPOLLO DALBEN,Kwangho Kim,A. Syvanen,Jae-Dong Kim,恵水田,Christopher N. Scanlan,Koós Bálint György,Curtis Zwenger,Lee Smith,Kamble B. Venkatrao,Robert Darveaux	2008	35
12	Bringing Manufacturing into Design via Process-Dependent SPICE Models 誉之佐藤,Fernando Joel Scariot,Xi–Wei Lin,Victor Moroz,Lee Smith,J. H. Rademacker,Erika Yohana Martinez Forero,Dipankar Pramanik	2006	8
13	Stress-Aware Design Methodology Victor Moroz,Lee Smith,Xi–Wei Lin,Dipankar Pramanik,A. Zsenei	2006	26
14	Ink Jet Printed Metals and Conducting Polymers Technical programs and proceedings ·Calvin J. Curtis,WangKai Jin,Maikel F. A. M. van Hest,Alex Miedaner,Triveni Abburi,David S. Ginley,Lee Smith,Andrew Leenheer,R. T. Collins	2005	2
15	Direct write contacts for solar cells OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·WangKai Jin,Maikel F. A. M. van Hest,A. Miedaner,Calvin J. Curtis,J. Alleman,Matthew S. Dabney,Erik C. Garnett,Sean E. Shaheen,Lee Smith,R. T. Collins,J. I. Hanoka,Andrew M. Gabor,David S. Ginley	2005	13
16	The Impact of Layout on Stress-Enhanced Transistor Performance Victor Moroz,Geert Eneman,Arnelle Y. Quiambao,F. Nouri,A. Hilse,Lee Smith,M. Jurczak,Dipankar Pramanik,Kamil Masood	2005	30
17	Tests On Photoconductive Semiconductor Switches For Subnanosecond Risetime, Multimegavolt pulseral-applications OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·Olamide Asifat,Lee Smith,C. Han,Michael D. Abdalla,F.J. Zutavern,Bang-Sik Rho,M.W. O'Malley	2005	2
18	Overcoming the key barriers in 35 μm pitch wire bond packaging: probe, mold, and substrate solutions and trade-offs Bob Chylak,Simon Y. Tang,Lee Smith,D. Norvell	2003	2
19	Direct-Write Printing of Silver Metallizations on Silicon Solar Cells MRS Proceedings ·Calvin J. Curtis,T. Rivkin,A. Miedaner,J. Alleman,John D. Perkins,Lee Smith,David S. Ginley	2002	5
20	A high-density, high-performance EEPROM cell IEEE Transactions on Electron Devices ·進木上,A. G. Arakelyan,Lee Smith	1982	7

About Lee Smith

Lee Smith is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Biomedical Engineering, Automotive Engineering and Hardware and Architecture, having authored 64 papers that have together received 830 indexed citations. Recurring topics across this work include Advancements in Semiconductor Devices and Circuit Design (44 papers), Semiconductor materials and devices (38 papers), Silicon Carbide Semiconductor Technologies (11 papers), Quantum and electron transport phenomena (9 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers), Electronic Packaging and Soldering Technologies (6 papers), Semiconductor Quantum Structures and Devices (5 papers) and Nanowire Synthesis and Applications (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (794 citations), Biomedical Engineering (189 citations), Structural Biology (6 citations), Hardware and Architecture (26 citations) and Atomic and Molecular Physics, and Optics (111 citations). Lee Smith has collaborated with scholars based in United States, Switzerland and Belgium. Frequent co-authors include Victor Moroz, Krishna C. Saraswat, Munkang Choi, Geert Eneman, F. Nouri, Suyog Gupta, Qiang Lü, Dipankar Pramanik, M. Jurczak and K. De Meyer. Their work appears in journals such as IEEE Transactions on Electron Devices, IEEE Electron Device Letters, Journal of Computational Electronics, Solid-State Electronics and Materials Science and Engineering B.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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