Riet Labie

1.8k total citations
58 papers, 1.2k citations indexed

About

Riet Labie is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Riet Labie has authored 58 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 57 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 9 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Riet Labie's work include Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (29 papers) and Silicon and Solar Cell Technologies (16 papers). Riet Labie is often cited by papers focused on Electronic Packaging and Soldering Technologies (37 papers), 3D IC and TSV technologies (29 papers) and Silicon and Solar Cell Technologies (16 papers). Riet Labie collaborates with scholars based in Belgium, Netherlands and France. Riet Labie's co-authors include Eric Beyne, Wouter Ruythooren, Bart Vandevelde, Jan Van Humbeeck, Ingrid De Wolf, Paresh Limaye, Bert Verlinden, Chukwudi Okoro, Kris Vanstreels and Dirk Vandepitte and has published in prestigious journals such as Journal of Applied Physics, Journal of Materials Science and Solar Energy Materials and Solar Cells.

In The Last Decade

Riet Labie

56 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Riet Labie Belgium	18	1.1k	273	189	165	152	58	1.2k
Seung Wook Yoon Singapore	23	1.4k 1.3×	405 1.5×	172 0.9×	176 1.1×	47 0.3×	100	1.5k
Wen Ding China	23	1.1k 1.0×	359 1.3×	435 2.3×	79 0.5×	69 0.5×	77	1.2k
Pascal Bevilacqua France	12	698 0.6×	210 0.8×	142 0.8×	102 0.6×	45 0.3×	54	879
Cyril Buttay France	21	1.6k 1.5×	515 1.9×	290 1.5×	109 0.7×	75 0.5×	91	2.0k
Zhe Huang China	18	573 0.5×	437 1.6×	188 1.0×	143 0.9×	53 0.3×	43	947
C. W. Tipton United States	14	797 0.7×	133 0.5×	182 1.0×	102 0.6×	63 0.4×	34	968
Vladimir Cherman Belgium	19	820 0.8×	351 1.3×	78 0.4×	189 1.1×	41 0.3×	107	1.1k
S. Inoue Japan	16	658 0.6×	162 0.6×	47 0.2×	89 0.5×	75 0.5×	59	892
Agata Skwarek Poland	17	627 0.6×	352 1.3×	48 0.3×	64 0.4×	59 0.4×	74	730
Olalla Varela Pedreira Belgium	17	859 0.8×	62 0.2×	408 2.2×	131 0.8×	167 1.1×	61	934

Countries citing papers authored by Riet Labie

Since Specialization

Citations

This map shows the geographic impact of Riet Labie's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Riet Labie with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Riet Labie more than expected).

Fields of papers citing papers by Riet Labie

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Riet Labie. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Riet Labie. The network helps show where Riet Labie may publish in the future.

Co-authorship network of co-authors of Riet Labie

This figure shows the co-authorship network connecting the top 25 collaborators of Riet Labie. A scholar is included among the top collaborators of Riet Labie based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Riet Labie. Riet Labie is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Simoen, Eddy, et al.. (2019). A DLTS Perspective on Electrically Active Defects in Plated Crystalline Silicon n⁺p Solar Cells. ECS Journal of Solid State Science and Technology. 8(11). P693–P698. 1 indexed citations

Labie, Riet, et al.. (2018). Detailed structural and electrical characterization of plated crystalline silicon solar cells. Solar Energy Materials and Solar Cells. 184. 57–66. 14 indexed citations

Nieuwenhuysen, Kris Van, Ivan Gordon, Twan Bearda, et al.. (2012). High-quality epitaxial foils, obtained by a layer transfer process, for integration in back-contacted solar cells processed on glass. 197. 1833–1836. 14 indexed citations

Russell, Richard, Loïc Tous, Harold Philipsen, et al.. (2012). A Simple Copper Metallisation Process for High Cell Efficiencies and Reliable Modules. EU PVSEC. 35 indexed citations

Dimčić, Biljana, Riet Labie, Joke De Messemaeker, et al.. (2012). Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures. Microelectronics Reliability. 52(9-10). 1971–1974. 13 indexed citations

Okoro, Chukwudi, Riet Labie, Kris Vanstreels, et al.. (2011). Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu. Journal of Materials Science. 46(11). 3868–3882. 69 indexed citations

Govaerts, Jonathan, Riet Labie, José Luis Hernández, et al.. (2011). The i-module approach: Towards improved performance and reliability of photovoltaic modules. 1–5. 2 indexed citations

Limaye, Paresh, A. Mercha, Herman Oprins, et al.. (2010). Design issues and cosiderations for low-cost 3D TSV IC technology. Lirias (KU Leuven). 148–149. 6 indexed citations

Labie, Riet, et al.. (2010). Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking. 1–5. 51 indexed citations

10.

Agarwal, Rahul, Wenqi Zhang, Paresh Limaye, et al.. (2010). Die-to-Wafer Bonding of Thin Dies using a 2-Step Approach; High Accuracy Placement, then Gang Bonding. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1254–1281. 2 indexed citations

11.

Okoro, Chukwudi, Cedric Huyghebaert, J. Van Olmen, et al.. (2010). Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration. AIP conference proceedings. 40 indexed citations

12.

Okoro, Chukwudi, Kris Vanstreels, Riet Labie, et al.. (2010). Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV. Journal of Micromechanics and Microengineering. 20(4). 45032–45032. 89 indexed citations

13.

Agarwal, Rahul, Wenqi Zhang, Paresh Limaye, et al.. (2010). Cu/Sn microbumps interconnect for 3D TSV chip stacking. 858–863. 87 indexed citations

14.

Yu, Yang, Riet Labie, Olivier Richard, et al.. (2009). The Impact of Back-Side Cu Contamination on 3D Stacking Architecture. Electrochemical and Solid-State Letters. 13(2). H39–H39. 4 indexed citations

15.

Labie, Riet, Wouter Ruythooren, Kris Baert, Eric Beyne, & Bart Swinnen. (2008). Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking. 19–21. 32 indexed citations

16.

Ruythooren, Wouter, A. Beltrán, & Riet Labie. (2007). Cu-Cu Bonding Alternative to Solder based Micro-Bumping. 315–318. 22 indexed citations

17.

Labie, Riet, et al.. (2006). A Modified Electromigration Test Structure for Flip Chip Interconnections. IEEE Transactions on Components and Packaging Technologies. 29(3). 508–511. 3 indexed citations

18.

Labie, Riet, Petar Ratchev, & Eric Beyne. (2005). Comparison of a Cu UBM versus a Co UBM for Sn Flip-Chip Bumps. 2. 449–451. 15 indexed citations

19.

Ratchev, Petar, Riet Labie, & Eric Beyne. (2005). Nanohardness study of CoSn/sub 2/ intermetallic layers formed between CO UBM and Sn flip-chip solder joints. 339–342. 15 indexed citations

20.

Labie, Riet, Eric Beyne, Robert Mertens, Petar Ratchev, & J. Van Humbeeck. (2004). Investigation of the reliability of Cu and Co UBM layers in thermal-cycling tests. 584–588. 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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