Herman Oprins
- Electrical and Electronic Engineering top 5%
- Mechanical Engineering top 5%
- Materials Chemistry
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics top 10%
- Co-authors
- Eric BeyneVladimir ChermanMartine BaelmansIngrid De WolfTiwei WeiBart VandeveldeGeert Van der PlasC. Torregiani
- Topics
- 3D IC and TSV technologies (55 papers)Electronic Packaging and Soldering Technologies (36 papers)Heat Transfer and Optimization (21 papers)
- Journals
- Journal of Applied PhysicsIEEE Transactions on Power ElectronicsInternational Journal of Heat and Mass Transfer
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Herman Oprins
120 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 50
- Electrical and Electronic Engineering 987
- Mechanical Engineering 423
- Materials Chemistry 190
- Electronic, Optical and Magnetic Materials 161
- Condensed Matter Physics 157
Countries citing papers authored by Herman Oprins
This map shows the geographic impact of Herman Oprins's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Herman Oprins with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Herman Oprins more than expected).
Fields of papers citing papers by Herman Oprins
This network shows the impact of papers produced by Herman Oprins. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Herman Oprins. The network helps show where Herman Oprins may publish in the future.
Co-authorship network of co-authors of Herman Oprins
This figure shows the co-authorship network connecting the top 25 collaborators of Herman Oprins. A scholar is included among the top collaborators of Herman Oprins based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Herman Oprins. Herman Oprins is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 2 | |
| 6 | 3 | |
| 7 | 15 | |
| 8 | 1 | |
| 9 | 2 | |
| 10 | 1 | |
| 11 | 7 | |
| 12 | 4 | |
| 13 | 2 | |
| 14 | 14 | |
| 15 | 14 | |
| 16 | 5 | |
| 17 | 4 | |
| 18 | 6 | |
| 19 | 30 | |
| 20 | Thermal analysis of hot spots in advanced 3D-stacked structures | 23 |
About Herman Oprins
Herman Oprins is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Condensed Matter Physics, having authored 128 papers that have together received 1.4k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (55 papers), Electronic Packaging and Soldering Technologies (36 papers) and Heat Transfer and Optimization (21 papers). The work is most often cited by research in Electrical and Electronic Engineering (987 citations), Condensed Matter Physics (157 citations) and Mechanical Engineering (423 citations). Herman Oprins has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Eric Beyne, Vladimir Cherman, Martine Baelmans, Ingrid De Wolf, Tiwei Wei, Bart Vandevelde, Geert Van der Plas, C. Torregiani, Michele Stucchi and Steve Stoffels. Their work appears in journals such as Journal of Applied Physics, IEEE Transactions on Power Electronics and International Journal of Heat and Mass Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.