Herman Oprins

2.2k total citations
128 papers, 1.4k citations indexed

About

Herman Oprins is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Herman Oprins has authored 128 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 101 papers in Electrical and Electronic Engineering, 30 papers in Mechanical Engineering and 20 papers in Automotive Engineering. Recurrent topics in Herman Oprins's work include 3D IC and TSV technologies (55 papers), Electronic Packaging and Soldering Technologies (36 papers) and Heat Transfer and Optimization (21 papers). Herman Oprins is often cited by papers focused on 3D IC and TSV technologies (55 papers), Electronic Packaging and Soldering Technologies (36 papers) and Heat Transfer and Optimization (21 papers). Herman Oprins collaborates with scholars based in Belgium, United States and Netherlands. Herman Oprins's co-authors include Eric Beyne, Vladimir Cherman, Martine Baelmans, Ingrid De Wolf, Tiwei Wei, Bart Vandevelde, Geert Van der Plas, C. Torregiani, Michele Stucchi and Steve Stoffels and has published in prestigious journals such as Journal of Applied Physics, IEEE Transactions on Power Electronics and International Journal of Heat and Mass Transfer.

In The Last Decade

Herman Oprins

120 papers receiving 1.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Herman Oprins Belgium 20 987 423 190 161 157 128 1.4k
Georgios Kampitsis Switzerland 16 908 0.9× 608 1.4× 202 1.1× 100 0.6× 166 1.1× 33 1.7k
X. Jordà Spain 20 1.6k 1.6× 300 0.7× 258 1.4× 154 1.0× 287 1.8× 175 1.9k
Remco van Erp Switzerland 13 398 0.4× 592 1.4× 224 1.2× 82 0.5× 142 0.9× 29 1.1k
Yvan Avenas France 19 1.4k 1.5× 466 1.1× 119 0.6× 36 0.2× 75 0.5× 77 1.8k
Hervé Morel France 18 1.5k 1.5× 354 0.8× 220 1.2× 105 0.7× 89 0.6× 126 1.7k
Cyril Buttay France 21 1.6k 1.6× 515 1.2× 384 2.0× 290 1.8× 115 0.7× 91 2.0k
J. Nicolics Austria 16 538 0.5× 176 0.4× 211 1.1× 136 0.8× 103 0.7× 138 853
Vanessa Smet United States 16 1.7k 1.7× 316 0.7× 193 1.0× 108 0.7× 25 0.2× 92 1.9k
Yunfei En China 19 1.4k 1.4× 127 0.3× 164 0.9× 151 0.9× 237 1.5× 177 1.6k
Frank Altmann Germany 19 695 0.7× 60 0.1× 177 0.9× 83 0.5× 170 1.1× 121 1.2k

Countries citing papers authored by Herman Oprins

Since Specialization
Citations

This map shows the geographic impact of Herman Oprins's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Herman Oprins with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Herman Oprins more than expected).

Fields of papers citing papers by Herman Oprins

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Herman Oprins. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Herman Oprins. The network helps show where Herman Oprins may publish in the future.

Co-authorship network of co-authors of Herman Oprins

This figure shows the co-authorship network connecting the top 25 collaborators of Herman Oprins. A scholar is included among the top collaborators of Herman Oprins based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Herman Oprins. Herman Oprins is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dai, Yun, Odysseas Zografos, Herman Oprins, et al.. (2025). Iterative Layout-Aware Power, Thermal, and IR-Drop Co-Optimization: Ensuring Convergency in 3D-ICs. IEEE Journal on Emerging and Selected Topics in Circuits and Systems. 15(4). 648–658.
2.
Vermeersch, Bjorn, Herman Oprins, Melina Lofrano, et al.. (2025). Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(8). 1708–1716. 2 indexed citations
3.
Oprins, Herman, et al.. (2024). Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement. Fluids. 9(3). 69–69. 1 indexed citations
4.
Vermeersch, Bjorn, Halil Kükner, Gioele Mirabelli, et al.. (2024). Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). 1–2. 2 indexed citations
5.
Oprins, Herman, et al.. (2024). Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(7). 1180–1188. 3 indexed citations
6.
Soulié, Jean-Philippe, Kiroubanand Sankaran, Benoît Van Troeye, et al.. (2024). Selecting alternative metals for advanced interconnects. Journal of Applied Physics. 136(17). 15 indexed citations
7.
8.
Oprins, Herman, et al.. (2023). Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 31(12). 1896–1904. 7 indexed citations
9.
Oprins, Herman, et al.. (2023). Electro-Absorption Modulator Thermo-Optical Self-Heating Analysis. Journal of Lightwave Technology. 41(18). 6000–6006. 9 indexed citations
10.
Oprins, Herman, et al.. (2022). Thermal Performance Analysis of Mempool RISC-V Multicore SoC. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30(11). 1668–1676. 2 indexed citations
11.
Nie, Lei, Lipeng Zhong, Qimin Shi, et al.. (2022). Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards. Materials Today Communications. 31. 103482–103482. 14 indexed citations
12.
Guralnik, Benny, Ole Hansen, Henrik H. Henrichsen, et al.. (2021). 3ω correction method for eliminating resistance measurement error due to Joule heating. Review of Scientific Instruments. 92(9). 94711–94711. 14 indexed citations
13.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2020). Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications. 1422–1429. 8 indexed citations
14.
Cherman, Vladimir, et al.. (2019). High heat flux dissipation via interposer active micro-cooling. Japanese Journal of Applied Physics. 58(SB). SBBB11–SBBB11. 5 indexed citations
15.
Croes, Kristof, Christoph Adelmann, Christopher Wilson, et al.. (2018). Interconnect metals beyond copper: reliability challenges and opportunities. 5.3.1–5.3.4. 63 indexed citations
16.
Zhang, Lei, et al.. (2018). High Heat Flux Dissipation Via Interposer Active Micro-Cooling. 1 indexed citations
17.
Limaye, Paresh, A. Mercha, Herman Oprins, et al.. (2010). Design issues and cosiderations for low-cost 3D TSV IC technology. Lirias (KU Leuven). 148–149. 6 indexed citations
18.
Torregiani, C., Herman Oprins, Bart Vandevelde, Eric Beyne, & Ingrid De Wolf. (2009). Compact thermal modeling of hot spots in advanced 3D-stacked ICs. 131–136. 30 indexed citations
19.
Torregiani, C., Bart Vandevelde, Herman Oprins, Eric Beyne, & Ingrid De Wolf. (2009). Thermal analysis of hot spots in advanced 3D-stacked structures. 56–60. 23 indexed citations
20.
Gillon, Renaud, et al.. (2008). Practical chip-centric electro-thermal simulations. 220–223. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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