Mario González

3.1k total citations
161 papers, 2.5k citations indexed

About

Mario González is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Mario González has authored 161 papers receiving a total of 2.5k indexed citations (citations by other indexed papers that have themselves been cited), including 120 papers in Electrical and Electronic Engineering, 60 papers in Biomedical Engineering and 23 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Mario González's work include 3D IC and TSV technologies (74 papers), Electronic Packaging and Soldering Technologies (69 papers) and Advanced Sensor and Energy Harvesting Materials (26 papers). Mario González is often cited by papers focused on 3D IC and TSV technologies (74 papers), Electronic Packaging and Soldering Technologies (69 papers) and Advanced Sensor and Energy Harvesting Materials (26 papers). Mario González collaborates with scholars based in Belgium, United States and Netherlands. Mario González's co-authors include Jan Vanfleteren, Fabrice Axisa, Bart Vandevelde, Dominique Brosteaux, Ingrid De Wolf, Frederick Bossuyt, Eric Beyne, Mathieu Vanden Bulcke, Yung‐Yu Hsu and Kris Vanstreels and has published in prestigious journals such as Applied Physics Letters, Langmuir and Journal of Materials Science.

In The Last Decade

Mario González

153 papers receiving 2.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Mario González Belgium 24 1.4k 1.4k 658 477 327 161 2.5k
Je Hoon Oh South Korea 29 1.4k 1.0× 989 0.7× 442 0.7× 545 1.1× 363 1.1× 110 2.5k
Jungmin Kim South Korea 25 648 0.5× 1.5k 1.0× 548 0.8× 465 1.0× 210 0.6× 156 2.4k
Bart Vandevelde Belgium 25 806 0.6× 2.1k 1.5× 627 1.0× 191 0.4× 264 0.8× 179 2.6k
Yongqing Duan China 26 1.7k 1.2× 1.5k 1.0× 506 0.8× 513 1.1× 74 0.2× 48 2.7k
Shutao Qiao United States 15 1.6k 1.1× 825 0.6× 306 0.5× 637 1.3× 151 0.5× 24 2.3k
Rui Guo China 28 2.4k 1.7× 1.0k 0.7× 862 1.3× 524 1.1× 105 0.3× 68 3.0k
Taisong Pan China 30 1.6k 1.1× 1.1k 0.7× 361 0.5× 650 1.4× 100 0.3× 114 2.8k
Yiin‐Kuen Fuh Taiwan 25 2.2k 1.5× 875 0.6× 903 1.4× 1.1k 2.3× 172 0.5× 140 3.0k
Eric J. Markvicka United States 17 2.5k 1.8× 631 0.4× 1.1k 1.6× 773 1.6× 144 0.4× 40 3.1k
Guanggui Cheng China 24 996 0.7× 647 0.5× 549 0.8× 474 1.0× 122 0.4× 189 1.9k

Countries citing papers authored by Mario González

Since Specialization
Citations

This map shows the geographic impact of Mario González's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mario González with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mario González more than expected).

Fields of papers citing papers by Mario González

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Mario González. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mario González. The network helps show where Mario González may publish in the future.

Co-authorship network of co-authors of Mario González

This figure shows the co-authorship network connecting the top 25 collaborators of Mario González. A scholar is included among the top collaborators of Mario González based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mario González. Mario González is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Vanstreels, Kris, Oguzhan Orkut Okudur, Mario González, & Eric Beyne. (2025). Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density. Microelectronic Engineering. 300. 112384–112384.
2.
Vanstreels, Kris, et al.. (2024). Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging. 74. 1–7.
3.
Bex, Pieter, Mario González, Steven Brems, et al.. (2024). Overlay Scaling Error Reduction for Hybrid Die-to-Wafer Bonding. 1–6. 1 indexed citations
4.
González, Mario, Fernando Salazar, Alejandro Trejo, et al.. (2023). Exploring the electronic and mechanical properties of lithium-decorated silicon carbide nanowires for energy storage. Journal of Energy Storage. 62. 106840–106840. 12 indexed citations
5.
González, Mario, et al.. (2023). Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation. Microelectronic Engineering. 271-272. 111947–111947. 9 indexed citations
6.
Okudur, Oguzhan Orkut, Mario González, G. Van den bosch, & M. Rosmeulen. (2023). Scaling-friendly approaches to minimize the magnitude and asymmetry of wafer warpage during 3-D NAND fabrication. Microelectronics Reliability. 145. 114996–114996. 5 indexed citations
7.
Karmarkar, Aditya P., Xiaopeng Xu, Wei Guo, et al.. (2019). Modeling Copper Plastic Deformation and Liner Viscoelastic Flow Effects on Performance and Reliability in Through Silicon Via (TSV) Fabrication Processes. IEEE Transactions on Device and Materials Reliability. 19(4). 642–653. 13 indexed citations
8.
González, Mario, Kristof Croes, Ingrid De Wolf, et al.. (2016). Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging. 13 indexed citations
9.
10.
Wang, Teng, et al.. (2013). Wafer reconstruction: An alternative 3D integration process flow. 415–419. 5 indexed citations
11.
González, Mario, Bart Vandevelde, Antonio Manna, Bart Swinnen, & Eric Beyne. (2013). Thermo mechanical challenges for processing and packaging stacked ultrathin wafers. 7–12. 4 indexed citations
12.
Okoro, Chukwudi, Riet Labie, Kris Vanstreels, et al.. (2011). Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu. Journal of Materials Science. 46(11). 3868–3882. 69 indexed citations
13.
González, Mario, Bart Vandevelde, Wim Christiaens, et al.. (2010). Thermo-mechanical analysis of flexible and stretchable systems. Ghent University Academic Bibliography (Ghent University). 1–7. 4 indexed citations
14.
González, Mario, Fabrice Axisa, Mathieu Vanden Bulcke, et al.. (2008). Design of metal interconnects for stretchable electronic circuits. Microelectronics Reliability. 48(6). 825–832. 341 indexed citations
15.
Baets, Johan De, Fabrice Axisa, Dominique Brosteaux, et al.. (2007). Stretchable conductor technology for elastic electronic systems. Ghent University Academic Bibliography (Ghent University). 3 indexed citations
16.
Axisa, Fabrice, Dominique Brosteaux, Frederick Bossuyt, et al.. (2007). Low Cost, Biocompatible Elastic and Conformable Electronic Technologies using Mid in Stretchable Polymer. Conference proceedings. 2007. 6592–6595. 3 indexed citations
17.
Bulcke, Mathieu Vanden, et al.. (2006). Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier. PubMed. 2006. 2811–2815. 5 indexed citations
18.
González, Mario, et al.. (2006). A Study on the 0-Level Package Design of a High Accuracy Silicon MEMS Resonator. 1. 1082–1087. 1 indexed citations
19.
Vandevelde, Bart, Mario González, Eric Beyne, Dirk Vandepitte, & Martine Baelmans. (2004). Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages. Lirias (KU Leuven). 5 indexed citations
20.
González, Mario, et al.. (2004). Finite element analysis of an improved wafer level package using silicone under bump (SUB) layers. 163–168. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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