Vladimir Cherman

1.8k total citations
107 papers, 1.1k citations indexed

About

Vladimir Cherman is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Vladimir Cherman has authored 107 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 83 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 19 papers in Automotive Engineering. Recurrent topics in Vladimir Cherman's work include 3D IC and TSV technologies (70 papers), Electronic Packaging and Soldering Technologies (51 papers) and Heat Transfer and Optimization (18 papers). Vladimir Cherman is often cited by papers focused on 3D IC and TSV technologies (70 papers), Electronic Packaging and Soldering Technologies (51 papers) and Heat Transfer and Optimization (18 papers). Vladimir Cherman collaborates with scholars based in Belgium, United States and France. Vladimir Cherman's co-authors include Eric Beyne, Herman Oprins, Ingrid De Wolf, Tiwei Wei, Martine Baelmans, Geert Van der Plas, Bart Vandevelde, Gerald Beyer, Mario González and Joeri De Vos and has published in prestigious journals such as IEEE Transactions on Power Electronics, International Journal of Heat and Mass Transfer and Applied Thermal Engineering.

In The Last Decade

Vladimir Cherman

104 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Vladimir Cherman Belgium 19 820 351 189 131 123 107 1.1k
D. Pinjala Singapore 19 877 1.1× 475 1.4× 269 1.4× 150 1.1× 113 0.9× 84 1.3k
Yvan Avenas France 19 1.4k 1.8× 466 1.3× 137 0.7× 89 0.7× 51 0.4× 77 1.8k
Vanessa Smet United States 16 1.7k 2.0× 316 0.9× 107 0.6× 124 0.9× 30 0.2× 92 1.9k
Aric Shorey United States 19 539 0.7× 374 1.1× 683 3.6× 72 0.5× 233 1.9× 84 1.1k
V. Kripesh Singapore 23 1.6k 1.9× 388 1.1× 272 1.4× 234 1.8× 39 0.3× 104 1.7k
Martin Corfield United Kingdom 13 334 0.4× 467 1.3× 78 0.4× 241 1.8× 34 0.3× 35 783
R. Polastre United States 21 1.8k 2.2× 493 1.4× 339 1.8× 286 2.2× 98 0.8× 42 2.2k
Yalong Sun China 25 383 0.5× 1.2k 3.4× 177 0.9× 158 1.2× 345 2.8× 37 1.5k
Seung Wook Yoon Singapore 23 1.4k 1.7× 405 1.2× 176 0.9× 137 1.0× 16 0.1× 100 1.5k
Serguei Stoukatch Belgium 13 645 0.8× 90 0.3× 234 1.2× 92 0.7× 48 0.4× 54 787

Countries citing papers authored by Vladimir Cherman

Since Specialization
Citations

This map shows the geographic impact of Vladimir Cherman's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vladimir Cherman with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vladimir Cherman more than expected).

Fields of papers citing papers by Vladimir Cherman

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Vladimir Cherman. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vladimir Cherman. The network helps show where Vladimir Cherman may publish in the future.

Co-authorship network of co-authors of Vladimir Cherman

This figure shows the co-authorship network connecting the top 25 collaborators of Vladimir Cherman. A scholar is included among the top collaborators of Vladimir Cherman based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vladimir Cherman. Vladimir Cherman is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Vermeersch, Bjorn, Herman Oprins, Melina Lofrano, et al.. (2025). Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(8). 1708–1716. 2 indexed citations
2.
Oprins, Herman, et al.. (2024). Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement. Fluids. 9(3). 69–69. 1 indexed citations
3.
Oprins, Herman, et al.. (2024). Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(7). 1180–1188. 3 indexed citations
4.
5.
6.
Oprins, Herman, Vladimir Cherman, Bjorn Vermeersch, et al.. (2024). Experimental Thermal Characterization of Thin Film low-k Dielectric Materials. 1–8. 3 indexed citations
7.
Oprins, Herman, et al.. (2023). Micro-Scale Jet Cooling: A Numerical Study on Improvement Options. 1–10. 4 indexed citations
8.
Derakhshandeh, Jaber, Eric Beyne, Gerald Beyer, et al.. (2022). Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1108–1113. 7 indexed citations
9.
Derakhshandeh, Jaber, Fumihiro Inoue, Vladimir Cherman, et al.. (2021). A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps. 1119–1124. 3 indexed citations
10.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2020). Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications. 1422–1429. 8 indexed citations
11.
Cherman, Vladimir, et al.. (2019). High heat flux dissipation via interposer active micro-cooling. Japanese Journal of Applied Physics. 58(SB). SBBB11–SBBB11. 5 indexed citations
12.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2019). First Demonstration of a Low Cost/Customizable Chip Level 3D Printed Microjet Hotspot-Targeted Cooler for High Power Applications. Lirias. 126–134. 6 indexed citations
13.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2018). NOZZLE ARRAY SCALING EFFECTS ON THE THERMAL/HYDRAULIC PERFORMANCE OF LIQUID JET IMPINGEMENT COOLERS FOR HIGH PERFORMANCE ELECTRONIC APPLICATIONS. International Heat Transfer Conference 16. 4 indexed citations
14.
Zhang, Lei, et al.. (2018). High Heat Flux Dissipation Via Interposer Active Micro-Cooling. 1 indexed citations
15.
Hou, Lin, Jaber Derakhshandeh, Jeroen De Coster, et al.. (2017). A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks. 1–3. 2 indexed citations
16.
Wei, Tiwei, Herman Oprins, Vladimir Cherman, et al.. (2017). High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler. Lirias (KU Leuven). 32.5.1–32.5.4. 27 indexed citations
17.
Oprins, Herman, Vladimir Cherman, Soon-Wook Kim, et al.. (2016). Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding. Journal of Electronic Packaging. 139(1). 10 indexed citations
18.
Manna, Antonio, Wei Guo, Stefaan Van Huylenbroeck, et al.. (2013). Study of 3D process impact on advanced CMOS devices. European Microelectronics and Packaging Conference. 1–7. 4 indexed citations
19.
Tsuchiya, Yoshishige, Faezeh Arab Hassani, C. Dupré, et al.. (2012). Double-gate suspended silicon nanowire transistors with tunable threshold voltage for chemical/biological sensing applications. Explore Bristol Research. 1–4. 1 indexed citations
20.
Pham, Nga, Vladimir Cherman, Bart Vandevelde, et al.. (2011). Zero-level packaging for (RF-)MEMS implementing TSVs and metal bonding. 1588–1595. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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