Kris Vanstreels

2.5k total citations
105 papers, 1.9k citations indexed

About

Kris Vanstreels is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, Kris Vanstreels has authored 105 papers receiving a total of 1.9k indexed citations (citations by other indexed papers that have themselves been cited), including 85 papers in Electrical and Electronic Engineering, 65 papers in Electronic, Optical and Magnetic Materials and 46 papers in Mechanics of Materials. Recurrent topics in Kris Vanstreels's work include Copper Interconnects and Reliability (65 papers), Semiconductor materials and devices (52 papers) and Metal and Thin Film Mechanics (43 papers). Kris Vanstreels is often cited by papers focused on Copper Interconnects and Reliability (65 papers), Semiconductor materials and devices (52 papers) and Metal and Thin Film Mechanics (43 papers). Kris Vanstreels collaborates with scholars based in Belgium, United States and Netherlands. Kris Vanstreels's co-authors include Mikhaı̈l R. Baklanov, Patrick Verdonck, Adam Urbanowicz, Ingrid De Wolf, Bart Vandevelde, Mario González, Eric Beyne, Riet Labie, Junwei Yang and Salvador Eslava and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials.

In The Last Decade

Kris Vanstreels

100 papers receiving 1.8k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kris Vanstreels Belgium 21 1.2k 723 443 406 354 105 1.9k
Junhua Gao China 25 1.1k 0.9× 246 0.3× 632 1.4× 206 0.5× 139 0.4× 87 1.9k
Tingting Feng China 26 1.6k 1.3× 682 0.9× 794 1.8× 484 1.2× 53 0.1× 112 2.3k
Seungmin Hyun South Korea 26 1.3k 1.0× 755 1.0× 905 2.0× 743 1.8× 148 0.4× 85 2.4k
Deok‐kee Kim South Korea 31 2.0k 1.6× 645 0.9× 1.3k 3.0× 342 0.8× 140 0.4× 168 2.9k
Sangheon Lee South Korea 25 1.4k 1.2× 164 0.2× 643 1.5× 177 0.4× 86 0.2× 93 1.9k
Jun‐Seok Ha South Korea 26 987 0.8× 764 1.1× 1.5k 3.3× 507 1.2× 114 0.3× 157 2.5k
Hongtao Cao China 36 2.6k 2.1× 522 0.7× 1.6k 3.5× 532 1.3× 139 0.4× 158 3.7k
Chen Yang China 22 964 0.8× 617 0.9× 569 1.3× 395 1.0× 64 0.2× 100 1.7k
Yanan Li China 16 627 0.5× 315 0.4× 388 0.9× 722 1.8× 54 0.2× 34 1.5k
Huali Yang China 30 1.8k 1.5× 889 1.2× 1.0k 2.3× 850 2.1× 56 0.2× 123 3.3k

Countries citing papers authored by Kris Vanstreels

Since Specialization
Citations

This map shows the geographic impact of Kris Vanstreels's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kris Vanstreels with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kris Vanstreels more than expected).

Fields of papers citing papers by Kris Vanstreels

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kris Vanstreels. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kris Vanstreels. The network helps show where Kris Vanstreels may publish in the future.

Co-authorship network of co-authors of Kris Vanstreels

This figure shows the co-authorship network connecting the top 25 collaborators of Kris Vanstreels. A scholar is included among the top collaborators of Kris Vanstreels based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kris Vanstreels. Kris Vanstreels is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Vanstreels, Kris, Oguzhan Orkut Okudur, Mario González, & Eric Beyne. (2025). Quantitative assessment of adhesion strength in hybrid bonded interfaces with varying metal contact density. Microelectronic Engineering. 300. 112384–112384.
2.
Vanstreels, Kris, et al.. (2024). Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging. 74. 1–7.
3.
González, Mario, et al.. (2023). Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation. Microelectronic Engineering. 271-272. 111947–111947. 9 indexed citations
4.
Soulié, Jean-Philippe, Kiroubanand Sankaran, Kris Vanstreels, et al.. (2022). Properties of ultrathin molybdenum films for interconnect applications. Materialia. 24. 101511–101511. 36 indexed citations
5.
Murdoch, Gayle, Zsolt Tökei, Sara Paolillo, et al.. (2020). Semidamascene Interconnects for 2nm node and Beyond. 4–6. 19 indexed citations
6.
Armini, Silvia, Thomas Berger, Mikhail Krishtab, et al.. (2017). On the mechanical and electrical properties of self-assembly-based organosilicate porous films. Journal of Materials Chemistry C. 5(33). 8599–8607. 8 indexed citations
7.
Popovici, M., Benjamin Groven, Kristof Marcoen, et al.. (2017). Atomic Layer Deposition of Ruthenium Thin Films from (Ethylbenzyl) (1-Ethyl-1,4-cyclohexadienyl) Ru: Process Characteristics, Surface Chemistry, and Film Properties. Chemistry of Materials. 29(11). 4654–4666. 45 indexed citations
8.
Wen, Liang, Christoph Adelmann, Olalla Varela Pedreira, et al.. (2016). Ruthenium metallization for advanced interconnects. 34–36. 46 indexed citations
9.
Armini, Silvia, Kris Vanstreels, Johan Meersschaut, et al.. (2016). Laser anneal of oxycarbosilane low-k film. Ghent University Academic Bibliography (Ghent University). 156–158.
10.
Krishtab, Mikhail, et al.. (2015). Improvement of cohesion strength in ULK OSG materials by pore structure adjustment. Microelectronic Engineering. 137. 75–78. 5 indexed citations
11.
Krishtab, Mikhail, Kris Vanstreels, Stefan De Gendt, & Mikhaı̈l R. Baklanov. (2015). Post-etch template removal strategy for reduction of plasma induced damage in spin-on OSG low-k dielectrics. 2. 103–106. 2 indexed citations
12.
Vanstreels, Kris, Ingrid De Wolf, Houman Zahedmanesh, et al.. (2014). In-situ scanning electron microscopy study of fracture events during back-end-of-line microbeam bending tests. Applied Physics Letters. 105(21). 13 indexed citations
13.
Vanstreels, Kris, et al.. (2012). Intrinsic effect of porosity on mechanical and fracture properties of nanoporous ultralow-k dielectrics. Applied Physics Letters. 101(12). 123109–123109. 27 indexed citations
14.
Okoro, Chukwudi, Riet Labie, Kris Vanstreels, et al.. (2011). Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu. Journal of Materials Science. 46(11). 3868–3882. 69 indexed citations
15.
Verdonck, Patrick, Els Van Besien, Kris Vanstreels, et al.. (2011). Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low-k Materials. Japanese Journal of Applied Physics. 50(5S1). 05EB05–05EB05. 7 indexed citations
16.
Sree, Sreeprasanth Pulinthanathu, Jolien Dendooven, D. Smeets, et al.. (2011). Spacious and mechanically flexible mesoporous silica thin film composed of an open network of interlinked nanoslabs. Journal of Materials Chemistry. 21(21). 7692–7692. 23 indexed citations
17.
Smirnov, Evgeny, Kris Vanstreels, Patrick Verdonck, et al.. (2011). Evaluation of a New Advanced Low-k Material. Japanese Journal of Applied Physics. 50(5S1). 05EB03–05EB03. 11 indexed citations
18.
Urbanowicz, Adam, et al.. (2010). Mechanism of k-value Reduction of PECVD Low-k Films Treated with He/H2 Ash Plasma. Lirias (KU Leuven). 2 indexed citations
19.
Vanstreels, Kris, et al.. (2010). Fabrication of porogen residue free ultra low-k PECVD material by subsequent H2-afterglow plasma treatment and UV curing. 65–71. 1 indexed citations
20.
Vanstreels, Kris, et al.. (2008). Microstructural evolution of cu interconnect under AC, pulsed DC and DC current stress. Document Server@UHasselt (UHasselt).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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