Petar Ratchev
Impact in
- Mechanical Engineering top 5%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Aerospace Engineering top 5%
- Aluminum Alloy Microstructure Properties
Papers in
-
- Aluminum Alloys Composites Properties 21
- Advanced Welding Techniques Analysis 5
-
- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 8
- Co-authors
- Bert Verlinden (20 shared papers)P. Van Houtte (8 shared papers)Peter De Smet (10 shared papers)Eric Beyne (10 shared papers)Bart Vandevelde (7 shared papers)Ingrid De Wolf (9 shared papers)Serguei Stoukatch (5 shared papers)Bart Swinnen (1 shared paper)
- Journals
- Microelectronics Reliability (4 papers)Materials Science and Engineering A (3 papers)Acta Materialia (3 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)Microelectronic Engineering (2 papers)
- Partner nations
- BelgiumUnited StatesNetherlands
In The Last Decade
Petar Ratchev
46 papers receiving 993 citations
Peers
Comparison fields: 5 of 40
- Mechanical Engineering 641
- Aerospace Engineering 390
- Materials Chemistry 432
- Electrical and Electronic Engineering 463
- Mechanics of Materials 185
Countries citing papers authored by Petar Ratchev
This map shows the geographic impact of Petar Ratchev's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Petar Ratchev with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Petar Ratchev more than expected).
Fields of papers citing papers by Petar Ratchev
This network shows the impact of papers produced by Petar Ratchev. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Petar Ratchev. The network helps show where Petar Ratchev may publish in the future.
Co-authors
The 25 scholars most cited alongside Petar Ratchev, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 46 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1998 | 143 | |
| 2 | 2006 | 92 | |
| 3 | 2005 | 80 | |
| 4 | 1995 | 66 | |
| 5 | 1996 | 55 | |
| 6 | 2004 | 49 | |
| 7 | 1999 | 45 | |
| 8 | 2004 | 37 | |
| 9 | 2003 | 34 | |
| 10 | 2004 | 34 | |
| 11 | 2004 | 31 | |
| 12 | 2001 | 29 | |
| 13 | 1998 | 25 | |
| 14 | 2005 | 24 | |
| 15 | 1994 | 23 | |
| 16 | 1996 | 21 | |
| 17 | 2007 | 19 | |
| 18 | 1995 | 18 | |
| 19 | 2005 | 15 | |
| 20 | 2005 | 15 |
About Petar Ratchev
Petar Ratchev is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Aerospace Engineering, Mechanics of Materials and Materials Chemistry, having authored 46 papers that have together received 1.0k indexed citations. Recurring topics across this work include Aluminum Alloys Composites Properties (21 papers), Electronic Packaging and Soldering Technologies (17 papers), Aluminum Alloy Microstructure Properties (16 papers), 3D IC and TSV technologies (8 papers), Metallurgy and Material Forming (7 papers), Advanced Welding Techniques Analysis (5 papers), Magnesium Alloys: Properties and Applications (5 papers) and Metal and Thin Film Mechanics (4 papers). The work is most often cited by research in Mechanical Engineering (641 citations), Aerospace Engineering (390 citations), Materials Chemistry (432 citations), Electrical and Electronic Engineering (463 citations) and Mechanics of Materials (185 citations). Petar Ratchev has collaborated with scholars based in Belgium, United States and Netherlands. Frequent co-authors include Bert Verlinden, P. Van Houtte, Peter De Smet, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Serguei Stoukatch, Bart Swinnen, J. Van Humbeeck and Paresh Limaye. Their work appears in journals such as Microelectronics Reliability, Materials Science and Engineering A, Acta Materialia, IEEE Transactions on Components and Packaging Technologies and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.