Tailong Shi

489 total citations · 1 hit paper
15 papers, 367 citations indexed

About

Tailong Shi is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry. According to data from OpenAlex, Tailong Shi has authored 15 papers receiving a total of 367 indexed citations (citations by other indexed papers that have themselves been cited), including 10 papers in Electrical and Electronic Engineering, 4 papers in Biomedical Engineering and 3 papers in Materials Chemistry. Recurrent topics in Tailong Shi's work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Tailong Shi is often cited by papers focused on 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (6 papers) and Electromagnetic Compatibility and Noise Suppression (5 papers). Tailong Shi collaborates with scholars based in China, United States and Japan. Tailong Shi's co-authors include Jianbing Zhang, Kao Xiong, Jing Liu, Jiang Tang, Peilin Liu, Mingyu Li, Haisheng Song, Long Chen, Tong Wu and Wei Wei and has published in prestigious journals such as Nature Communications, Materials Chemistry and Physics and Nature Electronics.

In The Last Decade

Tailong Shi

14 papers receiving 349 citations

Hit Papers

A near-infrared colloidal quantum dot imager with monolit... 2022 2026 2023 2024 2022 50 100 150 200
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. A near-infrared colloidal quantum dot imager with monolithically integrated readout circuitry
    2022 212 citations Jing Liu, Peilin Liu et al. Nature Electronics profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Tailong Shi China 7 309 201 84 30 26 15 367
Yoshiya Hagimoto Taiwan 9 375 1.2× 166 0.8× 65 0.8× 33 1.1× 11 0.4× 32 407
Matthias Wietstruck Germany 11 419 1.4× 89 0.4× 147 1.8× 16 0.5× 15 0.6× 95 478
Czang-Ho Lee Canada 14 557 1.8× 352 1.8× 178 2.1× 22 0.7× 35 1.3× 48 603
Yajun Xia China 10 276 0.9× 68 0.3× 86 1.0× 16 0.5× 46 1.8× 27 327
Zhuocheng Zhang United States 14 438 1.4× 282 1.4× 95 1.1× 45 1.5× 45 1.7× 33 532
P.J. George India 11 280 0.9× 202 1.0× 59 0.7× 29 1.0× 16 0.6× 30 343
Daniel Costa Brazil 9 209 0.7× 258 1.3× 46 0.5× 70 2.3× 29 1.1× 27 325
Jae‐Hong Jeon South Korea 13 559 1.8× 338 1.7× 59 0.7× 45 1.5× 67 2.6× 74 586
You Jin Ji South Korea 8 175 0.6× 182 0.9× 59 0.7× 26 0.9× 11 0.4× 16 269
Chuan Chen China 8 240 0.8× 58 0.3× 156 1.9× 60 2.0× 20 0.8× 18 334

Countries citing papers authored by Tailong Shi

Since Specialization
Citations

This map shows the geographic impact of Tailong Shi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tailong Shi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tailong Shi more than expected).

Fields of papers citing papers by Tailong Shi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tailong Shi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tailong Shi. The network helps show where Tailong Shi may publish in the future.

Co-authorship network of co-authors of Tailong Shi

This figure shows the co-authorship network connecting the top 25 collaborators of Tailong Shi. A scholar is included among the top collaborators of Tailong Shi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tailong Shi. Tailong Shi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

15 of 15 papers shown
1.
Shi, Tailong, et al.. (2025). A strategy for regulating the residual stress of electroplated Cu film based on customized grain characteristics. Materials Chemistry and Physics. 345. 131304–131304. 1 indexed citations
2.
Chen, Hongfei, Tailong Shi, Liyi Li, et al.. (2025). Atomic layer deposition of TiO 2 /TiN/Ru/Cu multi-layer on the glass surface for glass–metal adhesion enhancement. Materials Science in Semiconductor Processing. 204. 110283–110283. 1 indexed citations
3.
Shi, Tailong, et al.. (2024). A Study on Regulating the Residual Stress of Electroplated Cu by Manipulating the Nanotwin Directions. Micromachines. 15(11). 1370–1370. 2 indexed citations
4.
5.
Liu, Jing, Tailong Shi, Kao Xiong, et al.. (2023). Flexible and broadband colloidal quantum dots photodiode array for pixel-level X-ray to near-infrared image fusion. Nature Communications. 14(1). 5352–5352. 65 indexed citations
6.
7.
Liu, Jing, Peilin Liu, Tailong Shi, et al.. (2022). A near-infrared colloidal quantum dot imager with monolithically integrated readout circuitry. Nature Electronics. 5(7). 443–451. 212 indexed citations breakdown →
8.
Ravichandran, Siddharth, Tailong Shi, Atom O. Watanabe, et al.. (2019). First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave Applications. IMAPSource Proceedings. 2019(1). 202–7. 2 indexed citations
9.
Ravichandran, Siddharth, Shuhei Yamada, Tailong Shi, et al.. (2019). Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications. Journal of Microelectronics and Electronic Packaging. 16(3). 124–135. 17 indexed citations
10.
Ravichandran, Siddharth, Shuhei Yamada, Tailong Shi, et al.. (2018). Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications. IMAPSource Proceedings. 2018(1). 331–336. 10 indexed citations
11.
Zhu, Yabo, et al.. (2018). Electrospinning Preparation of La-Doped SnO2 Hollow Nanofibers: An Improvement of Their Gas Sensing Properties. Journal of Nanoscience and Nanotechnology. 18(10). 6965–6970. 7 indexed citations
12.
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14.
Shi, Tailong, Vanessa Smet, Yoichiro Sato, et al.. (2017). First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration. 41–46. 13 indexed citations
15.
Shi, Tailong, Bruce C. S. Chou, Ting‐Chia Huang, et al.. (2016). Design, Demonstration and Characterization of Ultra-Thin Low-Warpage Glass BGA Packages for Smart Mobile Application Processor. 1465–1470. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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