Deepak Goyal

479 total citations
31 papers, 313 citations indexed

About

Deepak Goyal is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Deepak Goyal has authored 31 papers receiving a total of 313 indexed citations (citations by other indexed papers that have themselves been cited), including 28 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 6 papers in Mechanics of Materials. Recurrent topics in Deepak Goyal's work include Integrated Circuits and Semiconductor Failure Analysis (14 papers), 3D IC and TSV technologies (14 papers) and Electronic Packaging and Soldering Technologies (13 papers). Deepak Goyal is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (14 papers), 3D IC and TSV technologies (14 papers) and Electronic Packaging and Soldering Technologies (13 papers). Deepak Goyal collaborates with scholars based in United States, United Kingdom and Malaysia. Deepak Goyal's co-authors include Yan Li, Pilin Liu, Terran Lane, Yongming Cai, Zhiyong Wang, Jeffrey S. Moore, J. W. Elmer, Yan Li, Dilworth Y. Parkinson and Holly D. Barth and has published in prestigious journals such as Journal of Visualized Experiments, Journal of Electronic Materials and Microelectronics Reliability.

In The Last Decade

Deepak Goyal

29 papers receiving 297 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Deepak Goyal United States 11 271 64 51 35 35 31 313
Han-Ku Cho South Korea 9 381 1.4× 28 0.4× 140 2.7× 17 0.5× 24 0.7× 111 421
Ritwik Chatterjee United States 16 909 3.4× 39 0.6× 108 2.1× 39 1.1× 85 2.4× 31 952
Naoya Hayashi Japan 11 438 1.6× 62 1.0× 165 3.2× 17 0.5× 9 0.3× 132 526
Daniel Corliss United States 8 212 0.8× 23 0.4× 72 1.4× 30 0.9× 18 0.5× 23 311
Katsuya Okumura Japan 12 374 1.4× 23 0.4× 98 1.9× 15 0.4× 21 0.6× 56 430
S. Kadomura Japan 11 499 1.8× 29 0.5× 79 1.5× 68 1.9× 170 4.9× 43 542
K.-D. Lang Germany 12 334 1.2× 58 0.9× 75 1.5× 43 1.2× 22 0.6× 60 398
Ki‐Ho Baik United States 10 399 1.5× 26 0.4× 177 3.5× 17 0.5× 21 0.6× 90 435
Yuansheng Ma United States 12 377 1.4× 42 0.7× 158 3.1× 12 0.3× 26 0.7× 41 436
John Slabbekoorn Belgium 13 373 1.4× 28 0.4× 88 1.7× 12 0.3× 69 2.0× 57 401

Countries citing papers authored by Deepak Goyal

Since Specialization
Citations

This map shows the geographic impact of Deepak Goyal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Deepak Goyal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Deepak Goyal more than expected).

Fields of papers citing papers by Deepak Goyal

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Deepak Goyal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Deepak Goyal. The network helps show where Deepak Goyal may publish in the future.

Co-authorship network of co-authors of Deepak Goyal

This figure shows the co-authorship network connecting the top 25 collaborators of Deepak Goyal. A scholar is included among the top collaborators of Deepak Goyal based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Deepak Goyal. Deepak Goyal is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Brand, Sebastian, et al.. (2025). Localization enhancement in quantitative thermal lock-in analysis using spatial phase evaluation. Microelectronics Reliability. 168. 115690–115690.
2.
Goyal, Deepak, et al.. (2023). Near-Field Synthetic Aperture Focusing Technique to Enhance the Inspection Capability of Multi-Layer HBM Stacks in Scanning Acoustic Microscopy. Proceedings - International Symposium for Testing and Failure Analysis. 84741. 448–451.
3.
4.
Li, Yan & Deepak Goyal. (2020). 3D Microelectronic Packaging. 12 indexed citations
5.
Goyal, Deepak, et al.. (2018). Investigation of Multiple Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(5). 725–734. 4 indexed citations
6.
7.
8.
Carlton, Holly D., J. W. Elmer, Yan Li, et al.. (2016). Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages. Journal of Visualized Experiments. 5 indexed citations
9.
Goyal, Deepak, et al.. (2016). Innovations in Fault Isolation Methods for 3D Packages with 10X Improvement in Accuracy. 755–765. 8 indexed citations
10.
Liu, Pilin, et al.. (2016). Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows. Journal of Electronic Materials. 46(3). 1674–1682. 3 indexed citations
11.
Liu, Pilin, et al.. (2015). Key parameters for fast Ni dissolution during electromigration of Sn0.7Cu solder joint. 99–105. 12 indexed citations
12.
Goyal, Deepak, et al.. (2015). A Review of Failure Analysis Methods for Advanced 3D Microelectronic Packages. Journal of Electronic Materials. 45(1). 116–124. 19 indexed citations
13.
Moore, Jeffrey S., et al.. (2012). Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature Reflows. IEEE Transactions on Device and Materials Reliability. 12(2). 494–500. 17 indexed citations
14.
15.
Cai, Yongming, et al.. (2010). Electro Optical Terahertz Pulse Reflectometry — an innovative fault isolation tool. 1309–1315. 19 indexed citations
16.
Goyal, Deepak, et al.. (2010). X-ray computed tomography for non-destructive failure analysis in microelectronics. 252–258. 17 indexed citations
17.
Liu, Pilin, et al.. (2009). Solder Joint Electromigration Mechanisms. 703–709. 1 indexed citations
18.
19.
Goyal, Deepak, et al.. (2002). Effect of package design and layout on BGA solder joint reliability of an organic C4 package. 1205–1214. 10 indexed citations
20.
Goyal, Deepak. (2000). X-Ray Tomography for Electronic Packages. Proceedings - International Symposium for Testing and Failure Analysis. 30842. 49–54. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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