Deepak Goyal
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in ⓘ
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- 3D IC and TSV technologies 14
- Integrated Circuits and Semiconductor Failure Analysis 14
- Electronic Packaging and Soldering Technologies 13
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- Advanced X-ray and CT Imaging 5
- Co-authors
- Yan Li (2 shared papers)Pilin Liu (8 shared papers)Terran Lane (1 shared paper)Yongming Cai (2 shared papers)Zhiyong Wang (1 shared paper)Jeffrey S. Moore (1 shared paper)J. W. Elmer (3 shared papers)Holly D. Barth (2 shared papers)
- Journals
- Journal of Electronic Materials (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Microelectronics Reliability (1 paper)Journal of Visualized Experiments (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)
- Partner nations
- United StatesUnited KingdomCosta Rica
In The Last Decade
Deepak Goyal
29 papers receiving 297 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 271
- Structural Biology 4
- Industrial and Manufacturing Engineering 28
- Hardware and Architecture 17
- Electronic, Optical and Magnetic Materials 35
Countries citing papers authored by Deepak Goyal
This map shows the geographic impact of Deepak Goyal's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Deepak Goyal with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Deepak Goyal more than expected).
Fields of papers citing papers by Deepak Goyal
This network shows the impact of papers produced by Deepak Goyal. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Deepak Goyal. The network helps show where Deepak Goyal may publish in the future.
Co-authors
The 22 scholars most cited alongside Deepak Goyal, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 31 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 50 | |
| 2 | 2017 | 36 | |
| 3 | 3D Microelectronic Packaging From Fundamentals to Applications | 2017 | 24 |
| 4 | 2011 | 20 | |
| 5 | 2010 | 19 | |
| 6 | 2015 | 19 | |
| 7 | 2012 | 17 | |
| 8 | 2010 | 17 | |
| 9 | 2015 | 12 | |
| 10 | 2020 | 12 | |
| 11 | 2002 | 10 | |
| 12 | 2008 | 10 | |
| 13 | 2016 | 8 | |
| 14 | 2012 | 8 | |
| 15 | 2014 | 7 | |
| 16 | 2003 | 6 | |
| 17 | 2016 | 5 | |
| 18 | 2000 | 5 | |
| 19 | 2014 | 5 | |
| 20 | 2018 | 4 |
About Deepak Goyal
Deepak Goyal is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanics of Materials, Mechanical Engineering and Hardware and Architecture, having authored 31 papers that have together received 313 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Integrated Circuits and Semiconductor Failure Analysis (14 papers), Electronic Packaging and Soldering Technologies (13 papers), Advanced X-ray and CT Imaging (5 papers), Thermography and Photoacoustic Techniques (4 papers), Copper Interconnects and Reliability (4 papers), VLSI and Analog Circuit Testing (4 papers) and Ultrasonics and Acoustic Wave Propagation (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (271 citations), Structural Biology (4 citations), Industrial and Manufacturing Engineering (28 citations), Hardware and Architecture (17 citations) and Electronic, Optical and Magnetic Materials (35 citations). Deepak Goyal has collaborated with scholars based in United States, United Kingdom and Costa Rica. Frequent co-authors include Yan Li, Pilin Liu, Terran Lane, Yongming Cai, Zhiyong Wang, Jeffrey S. Moore, J. W. Elmer, Holly D. Barth, Yan Li and Dilworth Y. Parkinson. Their work appears in journals such as Journal of Electronic Materials, IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Journal of Visualized Experiments and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.