Melina Lofrano

508 total citations
55 papers, 359 citations indexed

About

Melina Lofrano is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Melina Lofrano has authored 55 papers receiving a total of 359 indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 10 papers in Biomedical Engineering. Recurrent topics in Melina Lofrano's work include 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (29 papers) and Copper Interconnects and Reliability (19 papers). Melina Lofrano is often cited by papers focused on 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (29 papers) and Copper Interconnects and Reliability (19 papers). Melina Lofrano collaborates with scholars based in Belgium, United States and United Kingdom. Melina Lofrano's co-authors include Eric Beyne, Mario González, Vladimir Cherman, Gerald Beyer, Kristof Croes, Bart Vandevelde, Geert Van der Plas, Christopher J. Wilson, Zsolt Tökei and Ingrid De Wolf and has published in prestigious journals such as Thin Solid Films, Japanese Journal of Applied Physics and IEEE Electron Device Letters.

In The Last Decade

Melina Lofrano

51 papers receiving 342 citations

Peers

Melina Lofrano

EEE

EOMM

M. H. Lim United States

Min-Suk Suh South Korea

Srikrishna Sitaraman United States

Rozalia Beica United States

Scott Pollard United States

John Slabbekoorn Belgium

Chao-Tsung Ma Taiwan

Vasarla Nagendra Sekhar Singapore

Masaya Kawano Singapore

Patrick Justison United States

M. H. Lim United States

Melina Lofrano

372 ×1.1

EEE

51 ×0.5

EOMM

52 ×1.0

27 ×0.7

21 ×0.6

Citations per year, relative to Melina Lofrano Melina Lofrano (= 1×) peers M. H. Lim

Countries citing papers authored by Melina Lofrano

Since Specialization

Citations

This map shows the geographic impact of Melina Lofrano's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Melina Lofrano with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Melina Lofrano more than expected).

Fields of papers citing papers by Melina Lofrano

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Melina Lofrano. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Melina Lofrano. The network helps show where Melina Lofrano may publish in the future.

Co-authorship network of co-authors of Melina Lofrano

This figure shows the co-authorship network connecting the top 25 collaborators of Melina Lofrano. A scholar is included among the top collaborators of Melina Lofrano based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Melina Lofrano. Melina Lofrano is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Vermeersch, Bjorn, Herman Oprins, Melina Lofrano, et al.. (2025). Thermal Modeling and Analysis of Equivalent Thermal Properties for Advanced BEOL Stacks. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(8). 1708–1716. 2 indexed citations

Sinha, Siddhartha, Koen Kennes, A. Urueña, et al.. (2024). Hetero-Integration of InP Chiplets on a 300 mm RF Silicon Interposer for mm-Wave Applications. 1–4. 2 indexed citations

Vermeersch, Bjorn, Odysseas Zografos, Melina Lofrano, et al.. (2024). Multiscale Thermal Impact of BSPDN: SoC Hotspot Challenges and Partial Mitigation. 1–4. 2 indexed citations

Lofrano, Melina, Gioele Mirabelli, Sheng Yang, et al.. (2022). Power, Performance, Area and Thermal Analysis of 2D and 3D ICs at A14 Node Designed with Back-side Power Delivery Network. 2022 International Electron Devices Meeting (IEDM). 23.4.1–23.4.4. 18 indexed citations

Diaz-Fortuny, J., et al.. (2022). Towards Complete Recovery of Circuit Degradation by Annealing With On-Chip Heaters. IEEE Electron Device Letters. 44(2). 201–204. 4 indexed citations

Chang, Xinyue, Herman Oprins, Melina Lofrano, et al.. (2022). Thermal analysis of advanced back-end-of-line structures and the impact of design parameters. Lirias (KU Leuven). 1–8. 7 indexed citations

Derakhshandeh, Jaber, Fumihiro Inoue, Vladimir Cherman, et al.. (2021). A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps. 1119–1124. 3 indexed citations

Leśniewska, A., Olalla Varela Pedreira, Melina Lofrano, et al.. (2021). Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. 1–6. 5 indexed citations

Inoue, Fumihiro, Jaber Derakhshandeh, Melina Lofrano, & Eric Beyne. (2020). Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration. Japanese Journal of Applied Physics. 60(2). 26502–26502. 10 indexed citations

10.

Hou, Lin, Jaber Derakhshandeh, Melina Lofrano, et al.. (2020). A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking. Lirias (KU Leuven). 1442–1447. 6 indexed citations

11.

Derakhshandeh, Jaber, Pieter Bex, Melina Lofrano, et al.. (2020). Process development and characterization of 3D multi-die stacking. 1–6. 2 indexed citations

12.

Cherman, Vladimir, Melina Lofrano, Mario González, et al.. (2019). High spatial resolution measurements of thermo-mechanical stress effects in flip-chip packages. 1–6. 1 indexed citations

13.

Croes, Kristof, Vladimir Cherman, Melina Lofrano, et al.. (2018). Stress mitigation of 3D-stacking/packaging induced stresses. Lirias (KU Leuven). 4D.3–1. 1 indexed citations

14.

Cherman, Vladimir, Melina Lofrano, Mario González, et al.. (2018). Evaluation of Mechanical Stress Induced During IC Packaging. 2168–2173. 13 indexed citations

15.

Vandevelde, Bart, Alojz Ivankoviç, Bjorn Debecker, et al.. (2014). Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectronics Reliability. 54(6-7). 1200–1205. 14 indexed citations

16.

Cherman, Vladimir, Geert Van der Plas, Joeri De Vos, et al.. (2014). 3D stacking induced mechanical stress effects. 309–315. 26 indexed citations

17.

Jansen, Roelof, Xavier Rottenberg, Melina Lofrano, et al.. (2011). A CMOS-compatible 24MHz poly-SiGe MEMS oscillator with low-power heating for frequency stabilization over temperature. 1–5. 3 indexed citations

18.

Jansen, Roelof, Steve Stoffels, Xavier Rottenberg, et al.. (2011). Optimal T-support anchoring for bar-type BAW resonators. 2. 609–612. 12 indexed citations

19.

Croes, Kristof, et al.. (2010). Electromigration and stress-induced-voiding in dual damascene Cu/low-k interconnects: a complex balance between vacancy and stress gradients. 591–598. 3 indexed citations

20.

Croes, Kristof, Christopher J. Wilson, Melina Lofrano, et al.. (2009). Time and temperature dependence of early stage Stress-Induced-Voiding in Cu/low-k interconnects. 48. 457–463. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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