Melina Lofrano
- Electrical and Electronic Engineering top 10%
- Electronic, Optical and Magnetic Materials
- Biomedical Engineering
- Automotive Engineering
- Mechanics of Materials
- Co-authors
- Eric BeyneMario GonzálezVladimir ChermanGerald BeyerKristof CroesBart VandeveldeGeert Van der PlasChristopher J. Wilson
- Topics
- 3D IC and TSV technologies (37 papers)Electronic Packaging and Soldering Technologies (29 papers)Copper Interconnects and Reliability (19 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringAutomotive Engineering
- Partner nations
- BelgiumUnited StatesUnited Kingdom
In The Last Decade
Melina Lofrano
51 papers receiving 342 citations
Peers
Comparison fields: 5 of 21
- Electrical and Electronic Engineering 332
- Electronic, Optical and Magnetic Materials 107
- Biomedical Engineering 52
- Automotive Engineering 38
- Mechanics of Materials 33
Countries citing papers authored by Melina Lofrano
This map shows the geographic impact of Melina Lofrano's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Melina Lofrano with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Melina Lofrano more than expected).
Fields of papers citing papers by Melina Lofrano
This network shows the impact of papers produced by Melina Lofrano. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Melina Lofrano. The network helps show where Melina Lofrano may publish in the future.
Co-authorship network of co-authors of Melina Lofrano
This figure shows the co-authorship network connecting the top 25 collaborators of Melina Lofrano. A scholar is included among the top collaborators of Melina Lofrano based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Melina Lofrano. Melina Lofrano is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 2 | |
| 3 | 2 | |
| 4 | 18 | |
| 5 | 4 | |
| 6 | 7 | |
| 7 | 3 | |
| 8 | 5 | |
| 9 | 10 | |
| 10 | 6 | |
| 11 | 2 | |
| 12 | 1 | |
| 13 | 1 | |
| 14 | 13 | |
| 15 | 14 | |
| 16 | 26 | |
| 17 | 3 | |
| 18 | 12 | |
| 19 | 3 | |
| 20 | 5 |
About Melina Lofrano
Melina Lofrano is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Automotive Engineering, having authored 55 papers that have together received 359 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (37 papers), Electronic Packaging and Soldering Technologies (29 papers) and Copper Interconnects and Reliability (19 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (107 citations), Electrical and Electronic Engineering (332 citations) and Automotive Engineering (38 citations). Melina Lofrano has collaborated with scholars based in Belgium, United States and United Kingdom. Frequent co-authors include Eric Beyne, Mario González, Vladimir Cherman, Gerald Beyer, Kristof Croes, Bart Vandevelde, Geert Van der Plas, Christopher J. Wilson, Zsolt Tökei and Ingrid De Wolf. Their work appears in journals such as Thin Solid Films, Japanese Journal of Applied Physics and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.