Rozalia Beica

1.0k total citations
25 papers, 321 citations indexed

About

Rozalia Beica is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Rozalia Beica has authored 25 papers receiving a total of 321 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 7 papers in Automotive Engineering and 7 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Rozalia Beica's work include 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Copper Interconnects and Reliability (7 papers). Rozalia Beica is often cited by papers focused on 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Copper Interconnects and Reliability (7 papers). Rozalia Beica collaborates with scholars based in United States, China and United Kingdom. Rozalia Beica's co-authors include Tom Ritzdorf, Xi Cao, Eric Kuah, Sze Pei Lim, Kai Wu, Nelson Fan, Margie Li, K. H. Tan, Cheng-Ta Ko and John H. Lau and has published in prestigious journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, ECS Transactions and ArXiv.org.

In The Last Decade

Rozalia Beica

22 papers receiving 276 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Rozalia Beica United States 8 305 60 47 38 27 25 321
Ying Ying Lim Singapore 9 262 0.9× 69 1.1× 24 0.5× 33 0.9× 17 0.6× 39 305
Chao-Tsung Ma Taiwan 9 323 1.1× 41 0.7× 47 1.0× 85 2.2× 35 1.3× 28 378
N. Bresson France 11 341 1.1× 47 0.8× 35 0.7× 37 1.0× 47 1.7× 36 365
Satoru Kuramochi Japan 11 262 0.9× 33 0.6× 73 1.6× 20 0.5× 12 0.4× 39 305
K. Vandersmissen Belgium 12 391 1.3× 78 1.3× 159 3.4× 27 0.7× 75 2.8× 27 417
H.Y. Li Singapore 10 304 1.0× 77 1.3× 35 0.7× 44 1.2× 11 0.4× 35 328
Geraldine Jamieson Belgium 11 319 1.0× 49 0.8× 125 2.7× 17 0.4× 81 3.0× 26 345
Jang‐Hi Im United States 9 419 1.4× 106 1.8× 74 1.6× 49 1.3× 40 1.5× 16 448
Melina Lofrano Belgium 11 332 1.1× 52 0.9× 107 2.3× 38 1.0× 32 1.2× 55 359
C. Chappaz France 7 275 0.9× 43 0.7× 99 2.1× 37 1.0× 13 0.5× 17 301

Countries citing papers authored by Rozalia Beica

Since Specialization
Citations

This map shows the geographic impact of Rozalia Beica's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rozalia Beica with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rozalia Beica more than expected).

Fields of papers citing papers by Rozalia Beica

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Rozalia Beica. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rozalia Beica. The network helps show where Rozalia Beica may publish in the future.

Co-authorship network of co-authors of Rozalia Beica

This figure shows the co-authorship network connecting the top 25 collaborators of Rozalia Beica. A scholar is included among the top collaborators of Rozalia Beica based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rozalia Beica. Rozalia Beica is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Lau, John H., W. Kai, Nelson Fan, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers. 20. 594–600. 3 indexed citations
3.
Rice, Richard, M. Gerber, Patricia MacLeod, et al.. (2018). System-level Trade-offs and Optimization for Data-Driven Applications. IMAPSource Proceedings. 2018(1). 23–28. 1 indexed citations
4.
Ramalingam, Suresh, Alireza Kaviani, Subhasish Mitra, et al.. (2018). Future Interconnect Materials and System Integration Strategies for Data-Intensive Applications. 1–5. 2 indexed citations
5.
Lau, John H., Ming Li, Lei Yang, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(10). 1729–1737. 40 indexed citations
6.
Li, Ming, John H. Lau, Nelson Fan, et al.. (2017). Characterizations of Fan-out Wafer-Level Packaging. IMAPSource Proceedings. 2017(1). 557–562. 5 indexed citations
7.
Beica, Rozalia, et al.. (2017). Advanced Materials and Interconnect Technologies for Next Generation Smart Devices. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2017(DPC). 1–26. 1 indexed citations
8.
Kumar, Santosh, et al.. (2016). Current status and future prospects of panel level packaging. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2016(DPC). 707–750. 1 indexed citations
9.
Beica, Rozalia, et al.. (2016). 2.5D / 3D IC Landscape: Market and Technology Trends. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2016(DPC). 260–305. 2 indexed citations
10.
Beica, Rozalia, et al.. (2015). The Growth of Advanced Packaging: An Overview of the Latest Technology Developments, Applications and Market Trends. IMAPSource Proceedings. 2015(1). 1–5. 6 indexed citations
11.
Beica, Rozalia. (2015). 3D integration: Applications and market trends. TS5.1.1–TS5.1.7. 23 indexed citations
12.
Ivankoviç, Alojz, et al.. (2015). 2.5D Interposers and Advanced Organic Substrates Landscape: Technology and Market Trends. IMAPSource Proceedings. 2015(1). 41–45. 5 indexed citations
13.
Beica, Rozalia, et al.. (2014). 3D technology applications market trends & key challenges. 78–81. 10 indexed citations
14.
Beica, Rozalia, et al.. (2014). (Invited) 3D Packaging Technologies and Applications, Latest Challenges and Supply Chain Activities. ECS Transactions. 61(6). 11–16. 6 indexed citations
15.
Beica, Rozalia. (2013). Flip chip market and technology trends. European Microelectronics and Packaging Conference. 1–4. 7 indexed citations
16.
Beica, Rozalia, et al.. (2010). Advanced TSV Copper Electrodeposition for 3D Interconnect Applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 774–802. 1 indexed citations
17.
Beica, Rozalia, et al.. (2009). High-Speed Cu-TSV for 5:1 iTSV Applications. ECS Transactions. 18(1). 689–694. 1 indexed citations
18.
Chen, Chun‐Wei, Robert Plass, Edward W. Ng, et al.. (2008). Development of thick negative photoresists for electroplating applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4 indexed citations
19.
Beica, Rozalia, et al.. (2008). Through silicon via copper electrodeposition for 3D integration. 577–583. 103 indexed citations
20.
Wang, Kai, et al.. (2004). Soft gold electroplating from a non-cyanide bath for electronic applications. 242–246. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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