Rozalia Beica
- Electrical and Electronic Engineering
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Automotive Engineering
- Atomic and Molecular Physics, and Optics
- Topics
- 3D IC and TSV technologies (23 papers)Electronic Packaging and Soldering Technologies (13 papers)Copper Interconnects and Reliability (7 papers)
- Cited by
- Electrical and Electronic EngineeringAutomotive EngineeringElectronic, Optical and Magnetic Materials
- Journals
- IEEE Transactions on Components Packaging and Manufacturing TechnologyECS TransactionsArXiv.org
- Partner nations
- United StatesChinaUnited Kingdom
In The Last Decade
Rozalia Beica
22 papers receiving 276 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 305
- Biomedical Engineering 60
- Electronic, Optical and Magnetic Materials 47
- Automotive Engineering 38
- Atomic and Molecular Physics, and Optics 27
Countries citing papers authored by Rozalia Beica
This map shows the geographic impact of Rozalia Beica's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Rozalia Beica with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Rozalia Beica more than expected).
Fields of papers citing papers by Rozalia Beica
This network shows the impact of papers produced by Rozalia Beica. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Rozalia Beica. The network helps show where Rozalia Beica may publish in the future.
Co-authorship network of co-authors of Rozalia Beica
This figure shows the co-authorship network connecting the top 25 collaborators of Rozalia Beica. A scholar is included among the top collaborators of Rozalia Beica based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Rozalia Beica. Rozalia Beica is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 5 | |
| 3 | 3 | |
| 4 | 2 | |
| 5 | 40 | |
| 6 | 5 | |
| 7 | 1 | |
| 8 | 1 | |
| 9 | 2 | |
| 10 | 23 | |
| 11 | 6 | |
| 12 | 5 | |
| 13 | 1 | |
| 14 | 10 | |
| 15 | Flip chip market and technology trends | 7 |
| 16 | 1 | |
| 17 | 1 | |
| 18 | 4 | |
| 19 | 103 | |
| 20 | 7 |
About Rozalia Beica
Rozalia Beica is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 25 papers that have together received 321 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (23 papers), Electronic Packaging and Soldering Technologies (13 papers) and Copper Interconnects and Reliability (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (305 citations), Automotive Engineering (38 citations) and Electronic, Optical and Magnetic Materials (47 citations). Rozalia Beica has collaborated with scholars based in United States, China and United Kingdom. Frequent co-authors include Tom Ritzdorf, Eric Kuah, Margie Li, Cheng-Ta Ko, John H. Lau, Kai Wu, Sze Pei Lim, K. H. Tan, Nelson Fan and Xi Cao. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, ECS Transactions and ArXiv.org.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.