Lin Hou
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Biomedical Engineering
- Bioengineering top 5%
- Polymers and Plastics top 10%
- Topics
- 3D IC and TSV technologies (17 papers)Electronic Packaging and Soldering Technologies (14 papers)Nanofabrication and Lithography Techniques (4 papers)
- Journals
- Scientific ReportsSensors and Actuators B ChemicalInternational Journal of Biological Macromolecules
- Partner nations
- BelgiumChinaUnited States
In The Last Decade
Lin Hou
31 papers receiving 656 citations
Peers
Comparison fields: 5 of 58
- Electrical and Electronic Engineering 478
- Materials Chemistry 239
- Biomedical Engineering 194
- Bioengineering 126
- Polymers and Plastics 113
Countries citing papers authored by Lin Hou
This map shows the geographic impact of Lin Hou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lin Hou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lin Hou more than expected).
Fields of papers citing papers by Lin Hou
This network shows the impact of papers produced by Lin Hou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lin Hou. The network helps show where Lin Hou may publish in the future.
Co-authorship network of co-authors of Lin Hou
This figure shows the co-authorship network connecting the top 25 collaborators of Lin Hou. A scholar is included among the top collaborators of Lin Hou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Lin Hou. Lin Hou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 56 | |
| 4 | 24 | |
| 5 | 3 | |
| 6 | 8 | |
| 7 | 4 | |
| 8 | 6 | |
| 9 | 1 | |
| 10 | 16 | |
| 11 | 4 | |
| 12 | 170 | |
| 13 | 52 | |
| 14 | 80 | |
| 15 | 2 | |
| 16 | 4 | |
| 17 | 3D stacking using bump-less process for sub 10 µm pitches | 1 |
| 18 | 9 | |
| 19 | SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chips | 4 |
| 20 | 23 |
About Lin Hou
Lin Hou is a scholar working on Electrical and Electronic Engineering, Bioengineering and Electrochemistry, having authored 32 papers that have together received 668 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (14 papers) and Nanofabrication and Lithography Techniques (4 papers). The work is most often cited by research in Bioengineering (126 citations), Electrochemistry (64 citations) and Electrical and Electronic Engineering (478 citations). Lin Hou has collaborated with scholars based in Belgium, China and United States. Frequent co-authors include Wei Chen, Chunmei Zhang, Lei Li, Xiaokun Li, Xiaofeng Kang, Cheng Du, Chun-Mei Zhang, Chunfeng Cheng, Jaber Derakhshandeh and Eric Beyne. Their work appears in journals such as Scientific Reports, Sensors and Actuators B Chemical and International Journal of Biological Macromolecules.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.