Lin Hou

785 total citations
32 papers, 668 citations indexed

About

Lin Hou is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Lin Hou has authored 32 papers receiving a total of 668 indexed citations (citations by other indexed papers that have themselves been cited), including 24 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Lin Hou's work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (14 papers) and Nanofabrication and Lithography Techniques (4 papers). Lin Hou is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (14 papers) and Nanofabrication and Lithography Techniques (4 papers). Lin Hou collaborates with scholars based in Belgium, China and United States. Lin Hou's co-authors include Wei Chen, Chunmei Zhang, Lei Li, Xiaokun Li, Xiaofeng Kang, Cheng Du, Chun-Mei Zhang, Chunfeng Cheng, Jaber Derakhshandeh and Eric Beyne and has published in prestigious journals such as Scientific Reports, Sensors and Actuators B Chemical and International Journal of Biological Macromolecules.

In The Last Decade

Lin Hou

31 papers receiving 656 citations

Peers

Lin Hou

EEE

BIOEN

Imran Syakir Mohamad Malaysia

Saraswathi Kailasa India

In‐Jun Park South Korea

Chul Jae Lee South Korea

Ranjith Divigalpitiya Canada

Yifan Pan China

P. Gomathi India

Zejie Zhu China

Leandro Sacco Netherlands

Imran Syakir Mohamad Malaysia

Lin Hou

260 ×0.5

EEE

256 ×1.1

266 ×1.4

96 ×0.8

BIOEN

113 ×1.0

Citations per year, relative to Lin Hou Lin Hou (= 1×) peers Imran Syakir Mohamad

Countries citing papers authored by Lin Hou

Since Specialization

Citations

This map shows the geographic impact of Lin Hou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lin Hou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lin Hou more than expected).

Fields of papers citing papers by Lin Hou

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Lin Hou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lin Hou. The network helps show where Lin Hou may publish in the future.

Co-authorship network of co-authors of Lin Hou

This figure shows the co-authorship network connecting the top 25 collaborators of Lin Hou. A scholar is included among the top collaborators of Lin Hou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Lin Hou. Lin Hou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Miao, Yaping, Xinyan Zhang, Haiyang Zhang, et al.. (2025). The influencing mechanism of thermo-oxidative aging of waste cotton textiles on mechanical properties of their regenerated fibers. International Journal of Biological Macromolecules. 306(Pt 2). 141509–141509. 3 indexed citations

Hou, Lin, A. Leśniewska, Shuo Kang, et al.. (2023). Dielectric Breakdown of Low Temperature Deposited SiCN Layers. 1 indexed citations

Luo, Yu, Yaping Miao, Haomin Wang, et al.. (2023). Laser-induced Janus graphene/poly(p-phenylene benzobisoxazole) fabrics with intrinsic flame retardancy as flexible sensors and breathable electrodes for fire-fighting field. Nano Research. 16(5). 7600–7608. 56 indexed citations

Liu, Hongxia, Wei Fan, Yaping Miao, et al.. (2022). Closed-loop recycling of colored regenerated cellulose fibers from the dyed cotton textile waste. Cellulose. 30(4). 2597–2610. 24 indexed citations

Derakhshandeh, Jaber, Fumihiro Inoue, Vladimir Cherman, et al.. (2021). A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps. 1119–1124. 3 indexed citations

Hou, Lin, et al.. (2020). A Novel Intermetallic Compound Insertion Bonding to Improve Throughput for Sequential 3-D Stacking. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(4). 669–678. 8 indexed citations

Zhang, Yubo, Jinliang Ning, Lin Hou, et al.. (2020). Magnetic oxygen in transition metal oxides: A case study of Ba2CoO4. Journal of Physics and Chemistry of Solids. 150. 109803–109803. 4 indexed citations

Hou, Lin, Jaber Derakhshandeh, Melina Lofrano, et al.. (2020). A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking. Lirias (KU Leuven). 1442–1447. 6 indexed citations

Derakhshandeh, Jaber, Lin Hou, Kris Vanstreels, et al.. (2020). ELD NiB for microbumps passivation and wirebonding. 1–6. 1 indexed citations

10.

Hou, Lin, Nele Moelans, Jaber Derakhshandeh, Ingrid De Wolf, & Eric Beyne. (2019). Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering. Scientific Reports. 9(1). 14862–14862. 16 indexed citations

11.

Hou, Lin, Jaber Derakhshandeh, Eric Beyne, & Ingrid De Wolf. (2019). A Novel Resistance Measurement Methodology for $In~Situ$ UBM/Solder Interfacial Reaction Monitoring. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(1). 30–38. 4 indexed citations

12.

Hou, Lin, Chunmei Zhang, Lei Li, et al.. (2018). CO gas sensors based on p-type CuO nanotubes and CuO nanocubes: Morphology and surface structure effects on the sensing performance. Talanta. 188. 41–49. 170 indexed citations

13.

Zhang, Chun-Mei, Lin Hou, Chunfeng Cheng, et al.. (2018). Nitrogen and Phosphorus Co‐doped Hollow Carbon Spheres as Efficient Metal‐Free Electrocatalysts for the Oxygen Reduction Reaction. ChemElectroChem. 5(14). 1891–1898. 52 indexed citations

14.

Zhang, Chun-Mei, Ruizhong Zhang, Xiaohui Gao, et al.. (2018). Small Naked Pt Nanoparticles Confined in Mesoporous Shell of Hollow Carbon Spheres for High-Performance Nonenzymatic Sensing of H₂O₂ and Glucose. ACS Omega. 3(1). 96–105. 80 indexed citations

15.

Hou, Lin, Jaber Derakhshandeh, Jeroen De Coster, et al.. (2017). A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks. 1–3. 2 indexed citations

16.

Kajihara, Masanori, Jaber Derakhshandeh, Lin Hou, et al.. (2017). Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn. 55. 1–3. 4 indexed citations

17.

Derakhshandeh, Jaber, Lin Hou, Eric Beyne, et al.. (2016). 3D stacking using bump-less process for sub 10 µm pitches. 128–133. 1 indexed citations

18.

Derakhshandeh, Jaber, Lin Hou, Samuel Suhard, et al.. (2016). Die to wafer 3D stacking for below 10um pitch microbumps. 1–4. 9 indexed citations

19.

Hou, Lin, Jaber Derakhshandeh, Silvia Armini, et al.. (2016). SAMs (self-assembled monolayers) passivation of cobalt microbumps for 3D stacking of Si chips. Lirias (KU Leuven). 4 indexed citations

20.

Derakhshandeh, Jaber, Lin Hou, N. Heylen, et al.. (2016). 3D Stacking Using Bump-Less Process for Sub 10um Pitch Interconnects. 128–133. 23 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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