Kwang-Yoo Byun

917 total citations · 1 hit paper
18 papers, 736 citations indexed

About

Kwang-Yoo Byun is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Kwang-Yoo Byun has authored 18 papers receiving a total of 736 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 3 papers in Mechanics of Materials. Recurrent topics in Kwang-Yoo Byun's work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Surface Polishing Techniques (6 papers). Kwang-Yoo Byun is often cited by papers focused on 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Surface Polishing Techniques (6 papers). Kwang-Yoo Byun collaborates with scholars based in South Korea, United States and Australia. Kwang-Yoo Byun's co-authors include Min-Suk Suh, Jonghyun Cho, Joohee Kim, Seung-Taek Yang, Taigon Song, Hyungdong Lee, Eakhwan Song, Jun So Pak, Kunwoo Park and Joungho Kim and has published in prestigious journals such as Applied Physics Letters, Journal of Electronic Materials and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Kwang-Yoo Byun

17 papers receiving 719 citations

Hit Papers

High-Frequency Scalable Electrical Model and Analysis of ... 2011 2026 2016 2021 2011 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
    2011 373 citations Joohee Kim, Jun So Pak et al. IEEE Transactions on Components Packaging and Manufacturing Technology profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kwang-Yoo Byun South Korea 8 711 84 78 64 61 18 736
Min-Suk Suh South Korea 9 684 1.0× 57 0.7× 81 1.0× 47 0.7× 43 0.7× 20 709
M. J. Interrante United States 6 463 0.7× 71 0.8× 47 0.6× 52 0.8× 77 1.3× 7 487
M. J. Wolf Germany 13 540 0.8× 126 1.5× 45 0.6× 49 0.8× 82 1.3× 41 606
Yu-Min Lin Taiwan 15 621 0.9× 55 0.7× 61 0.8× 76 1.2× 73 1.2× 68 649
J. Van Olmen Belgium 11 478 0.7× 113 1.3× 62 0.8× 87 1.4× 38 0.6× 31 499
Tapobrata Bandyopadhyay United States 11 753 1.1× 137 1.6× 33 0.4× 65 1.0× 71 1.2× 12 791
Stefaan Van Huylenbroeck Belgium 14 645 0.9× 81 1.0× 98 1.3× 56 0.9× 52 0.9× 83 660
H. Gan United States 8 583 0.8× 51 0.6× 45 0.6× 199 3.1× 34 0.6× 15 608
Cong Li China 17 834 1.2× 175 2.1× 42 0.5× 65 1.0× 80 1.3× 81 887
Masahiro Sunohara Japan 12 550 0.8× 141 1.7× 27 0.3× 33 0.5× 83 1.4× 18 578

Countries citing papers authored by Kwang-Yoo Byun

Since Specialization
Citations

This map shows the geographic impact of Kwang-Yoo Byun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kwang-Yoo Byun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kwang-Yoo Byun more than expected).

Fields of papers citing papers by Kwang-Yoo Byun

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kwang-Yoo Byun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kwang-Yoo Byun. The network helps show where Kwang-Yoo Byun may publish in the future.

Co-authorship network of co-authors of Kwang-Yoo Byun

This figure shows the co-authorship network connecting the top 25 collaborators of Kwang-Yoo Byun. A scholar is included among the top collaborators of Kwang-Yoo Byun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kwang-Yoo Byun. Kwang-Yoo Byun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Son, Hwa–Young, et al.. (2013). A Study on the Effectiveness of Underfill in the High Bandwidth Memory with TSV. IMAPSource Proceedings. 2013(1). 810–813. 2 indexed citations
2.
Jiang, Tengfei, Chenglin Wu, Peng Su, et al.. (2013). Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction. 641–647. 7 indexed citations
3.
Kim, Byoung‐Joon, Sung-Hwan Hwang, Arief Suriadi Budiman, et al.. (2012). Microstructure Evolution and Defect Formation in Cu Through-Silicon Vias (TSVs) During Thermal Annealing. Journal of Electronic Materials. 41(4). 712–719. 62 indexed citations
4.
Jiang, Tengfei, Suk-Kyu Ryu, Qiu Zhao, et al.. (2012). Measurement and analysis of thermal stresses in 3-D integrated structures containing through-silicon-vias. 11. 1–3. 3 indexed citations
5.
Ryu, Suk-Kyu, Tengfei Jiang, Kuan Lu, et al.. (2012). Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique. Applied Physics Letters. 100(4). 41901–41901. 95 indexed citations
6.
7.
Jiang, Tengfei, Suk-Kyu Ryu, Qiu Zhao, et al.. (2012). Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias. 11. 1–3. 1 indexed citations
8.
Jiang, Tengfei, Suk-Kyu Ryu, Qiu Zhao, et al.. (2012). Thermal stress characteristics and impact on device keep-out zone for 3-D ICs containing through-silicon-vias. 11. 103–104. 2 indexed citations
9.
Choi, Min‐Jae, et al.. (2012). Microstructure and stress characterization around TSV using in-situ PIT-in-SEM. 781–786. 5 indexed citations
10.
Byun, Kwang-Yoo, et al.. (2011). Interfacial reliability and micropartial stress analysis between TSV and CPB through NIT and MSA. 1436–1443. 9 indexed citations
11.
Cho, Jonghyun, Eakhwan Song, Ki-Hyun Yoon, et al.. (2011). Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(2). 220–233. 134 indexed citations
12.
Kim, Joohee, Jun So Pak, Jonghyun Cho, et al.. (2011). High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV). IEEE Transactions on Components Packaging and Manufacturing Technology. 1(2). 181–195. 373 indexed citations breakdown →
13.
Lee, Jang-Hee, et al.. (2009). Electromigration Characteristics of Flip Chip Sn-3.5Ag Solder Bumpsunder Highly Accelerated Conditions. Journal of the Korean Physical Society. 54(5(1)). 1784–1792. 9 indexed citations
14.
Lee, Jang-Hee, et al.. (2008). Size effect on electromigration reliability of pb-free flip chip solder bump. 2030–2034. 5 indexed citations
15.
16.
17.
Kim, Jonghoon, et al.. (2006). The Effect of Insulating Material on WLCSP Reliability with Various Solder Ball Layout. Journal of the Microelectronics and Packaging Society. 13(4). 1–7. 1 indexed citations
18.
Jeon, Insu, et al.. (2002). The effect of ultrasonic power on bonding pad and IMD layers in ultrasonic wire bonding. 22. 235–242. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Min-Suk Suh Breakdown of academic impact, for papers by M. J. Interrante Breakdown of academic impact, for papers by M. J. Wolf Breakdown of academic impact, for papers by Yu-Min Lin Breakdown of academic impact, for papers by J. Van Olmen Breakdown of academic impact, for papers by Tapobrata Bandyopadhyay Breakdown of academic impact, for papers by Stefaan Van Huylenbroeck Breakdown of academic impact, for papers by H. Gan Breakdown of academic impact, for papers by Cong Li Breakdown of academic impact, for papers by Masahiro Sunohara
Rankless by CCL
2026