Kwang-Yoo Byun
- Electrical and Electronic Engineering top 5%
- Biomedical Engineering
- Atomic and Molecular Physics, and Optics
- Electronic, Optical and Magnetic Materials
- Automotive Engineering top 10%
- Co-authors
- Min-Suk SuhTaigon SongHyungdong LeeSeung-Taek YangJun So PakKunwoo ParkJonghyun ChoJoohee Kim
- Topics
- 3D IC and TSV technologies (15 papers)Electronic Packaging and Soldering Technologies (10 papers)Advanced Surface Polishing Techniques (6 papers)
- Cited by
- Electrical and Electronic EngineeringAutomotive EngineeringElectronic, Optical and Magnetic Materials
- Journals
- Applied Physics LettersJournal of Electronic MaterialsIEEE Transactions on Components Packaging and Manufacturing Technology
- Partner nations
- South KoreaUnited StatesAustralia
In The Last Decade
Kwang-Yoo Byun
17 papers receiving 719 citations
Hit Papers
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 711
- Biomedical Engineering 84
- Atomic and Molecular Physics, and Optics 78
- Electronic, Optical and Magnetic Materials 64
- Automotive Engineering 61
Countries citing papers authored by Kwang-Yoo Byun
This map shows the geographic impact of Kwang-Yoo Byun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kwang-Yoo Byun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kwang-Yoo Byun more than expected).
Fields of papers citing papers by Kwang-Yoo Byun
This network shows the impact of papers produced by Kwang-Yoo Byun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kwang-Yoo Byun. The network helps show where Kwang-Yoo Byun may publish in the future.
Co-authorship network of co-authors of Kwang-Yoo Byun
This figure shows the co-authorship network connecting the top 25 collaborators of Kwang-Yoo Byun. A scholar is included among the top collaborators of Kwang-Yoo Byun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kwang-Yoo Byun. Kwang-Yoo Byun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 7 | |
| 3 | 95 | |
| 4 | 62 | |
| 5 | 3 | |
| 6 | 1 | |
| 7 | 7 | |
| 8 | 2 | |
| 9 | 5 | |
| 10 | 9 | |
| 11 | 134 | |
| 12 | High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)breakdown → | 373 |
| 13 | 9 | |
| 14 | 5 | |
| 15 | 1 | |
| 16 | 17 | |
| 17 | The Effect of Insulating Material on WLCSP Reliability with Various Solder Ball Layout | 1 |
| 18 | 3 |
About Kwang-Yoo Byun
Kwang-Yoo Byun is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 18 papers that have together received 736 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (10 papers) and Advanced Surface Polishing Techniques (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (711 citations), Automotive Engineering (61 citations) and Electronic, Optical and Magnetic Materials (64 citations). Kwang-Yoo Byun has collaborated with scholars based in South Korea, United States and Australia. Frequent co-authors include Min-Suk Suh, Taigon Song, Hyungdong Lee, Seung-Taek Yang, Jun So Pak, Kunwoo Park, Jonghyun Cho, Joohee Kim, Joungho Kim and Eakhwan Song. Their work appears in journals such as Applied Physics Letters, Journal of Electronic Materials and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.