John Slabbekoorn

537 total citations
57 papers, 401 citations indexed

About

John Slabbekoorn is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, John Slabbekoorn has authored 57 papers receiving a total of 401 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 19 papers in Biomedical Engineering and 10 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in John Slabbekoorn's work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (18 papers) and Advancements in Photolithography Techniques (13 papers). John Slabbekoorn is often cited by papers focused on 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (18 papers) and Advancements in Photolithography Techniques (13 papers). John Slabbekoorn collaborates with scholars based in Belgium, Netherlands and United States. John Slabbekoorn's co-authors include Eric Beyne, Andy Miller, Gerald Beyer, Lis K. Nanver, Alain Phommahaxay, Samuel Suhard, Michele Stucchi, Pieter Bex, Kenneth June Rebibis and H.W. van Zeijl and has published in prestigious journals such as JOM, Journal of Micromechanics and Microengineering and Materials Science and Engineering B.

In The Last Decade

John Slabbekoorn

51 papers receiving 371 citations

Peers

John Slabbekoorn
R. Yu United States
Vasarla Nagendra Sekhar Singapore
N. Bresson France
Lixi Wan China
E.B. Liao Singapore
M.K. Iyer Singapore
David Ho Singapore
M. J. Interrante United States
P. Coudrain France
M. Assous France
R. Yu United States
John Slabbekoorn
Citations per year, relative to John Slabbekoorn John Slabbekoorn (= 1×) peers R. Yu

Countries citing papers authored by John Slabbekoorn

Since Specialization
Citations

This map shows the geographic impact of John Slabbekoorn's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Slabbekoorn with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Slabbekoorn more than expected).

Fields of papers citing papers by John Slabbekoorn

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John Slabbekoorn. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Slabbekoorn. The network helps show where John Slabbekoorn may publish in the future.

Co-authorship network of co-authors of John Slabbekoorn

This figure shows the co-authorship network connecting the top 25 collaborators of John Slabbekoorn. A scholar is included among the top collaborators of John Slabbekoorn based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John Slabbekoorn. John Slabbekoorn is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Vanstreels, Kris, et al.. (2024). Thermal-Mechanical Analysis of Electroplated Copper for IC Packaging. 74. 1–7.
2.
3.
Brady, A. P., Ritwik Bhatia, John Slabbekoorn, et al.. (2023). Inorganic Capping Layers in RDL Technologies: Process Advantages and Reliability. JOM. 75(12). 5096–5102. 2 indexed citations
4.
Slabbekoorn, John, et al.. (2023). Ultra-Fine Pitch RDL (UFPRDL) using Polymer Dual Damascene processing. 1364–1368. 6 indexed citations
5.
Bhatia, Ritwik, Ganesh Sundaram, John Slabbekoorn, et al.. (2023). Inorganic capping layers in advanced photosensitive polymer based RDL processes: processing and reliability. 2040–2045. 3 indexed citations
6.
Stucchi, Michele, et al.. (2021). Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(7). 1073–1080. 17 indexed citations
7.
8.
Suhard, Samuel, Alain Phommahaxay, Koen Kennes, et al.. (2020). Demonstration of a collective hybrid die-to-wafer integration. 1315–1321. 12 indexed citations
9.
Hsieh, Robert, et al.. (2020). Process Window Enhancement of Via Holes for Fine Pitch RDL by Design Optimization. 1114–1119. 5 indexed citations
10.
Sun, Xiao, Hesheng Lin, Dimitrios Velenis, et al.. (2020). 3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network. Ghent University Academic Bibliography (Ghent University). 1–2. 5 indexed citations
11.
Phommahaxay, Alain, Samuel Suhard, Pieter Bex, et al.. (2019). Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems. 607–613. 34 indexed citations
12.
Derakhshandeh, Jaber, Lin Hou, Eric Beyne, et al.. (2016). 3D stacking using bump-less process for sub 10 µm pitches. 128–133. 1 indexed citations
13.
Huylenbroeck, Stefaan Van, Michele Stucchi, Yunlong Li, et al.. (2016). Small Pitch, High Aspect Ratio Via-Last TSV Module. 43–49. 29 indexed citations
14.
Derakhshandeh, Jaber, Lin Hou, Samuel Suhard, et al.. (2016). Die to wafer 3D stacking for below 10um pitch microbumps. 1–4. 9 indexed citations
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Velenis, Dimitrios, Stefaan Van Huylenbroeck, Anne Jourdain, et al.. (2014). Cost components for 3D system integration. 1–5. 6 indexed citations
17.
Derakhshandeh, Jaber, Daniel W. Schmid, John Slabbekoorn, et al.. (2014). Reflow process optimization for micro-bumps applications in 3D technology. 1–5. 13 indexed citations
18.
Nanver, Lis K., et al.. (2003). Electrical characterization of silicon diodes formed by laser annealing of implanted dopants. 119–130. 11 indexed citations
19.
Nanver, Lis K., et al.. (2002). Kelvin test structure for measuring contact resistance of shallow junctions. 241–245. 8 indexed citations
20.
Berg, P.M. van den, et al.. (2002). Low-ohmic contacts by excimer laser annealing of implanted polysilicon. 9. 102–105. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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