David De Roest

432 total citations
52 papers, 332 citations indexed

About

David De Roest is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, David De Roest has authored 52 papers receiving a total of 332 indexed citations (citations by other indexed papers that have themselves been cited), including 51 papers in Electrical and Electronic Engineering, 28 papers in Electronic, Optical and Magnetic Materials and 15 papers in Mechanics of Materials. Recurrent topics in David De Roest's work include Semiconductor materials and devices (34 papers), Copper Interconnects and Reliability (28 papers) and Metal and Thin Film Mechanics (15 papers). David De Roest is often cited by papers focused on Semiconductor materials and devices (34 papers), Copper Interconnects and Reliability (28 papers) and Metal and Thin Film Mechanics (15 papers). David De Roest collaborates with scholars based in Belgium, United States and Czechia. David De Roest's co-authors include Mikhaı̈l R. Baklanov, Patrick Verdonck, P. Maršík, Karen Maex, Gerald Beyer, Bart Nauwelaers, Els Van Besien, Naoto Tsuji, Adam Urbanowicz and Youssef Travaly and has published in prestigious journals such as IEEE Transactions on Electron Devices, Thin Solid Films and Physics Letters A.

In The Last Decade

David De Roest

47 papers receiving 320 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David De Roest Belgium 9 297 220 110 53 24 52 332
V. Arnal France 11 245 0.8× 192 0.9× 65 0.6× 59 1.1× 29 1.2× 44 297
Ennis T. Ogawa United States 10 303 1.0× 263 1.2× 67 0.6× 49 0.9× 27 1.1× 20 358
Shoumian Chen China 8 285 1.0× 101 0.5× 55 0.5× 62 1.2× 22 0.9× 61 325
H. Rathore United States 7 323 1.1× 244 1.1× 62 0.6× 43 0.8× 46 1.9× 15 367
Hualiang Shi United States 6 286 1.0× 222 1.0× 149 1.4× 51 1.0× 47 2.0× 12 335
Chen Wu Belgium 11 391 1.3× 290 1.3× 73 0.7× 93 1.8× 79 3.3× 37 460
E.T. Ogawa United States 9 484 1.6× 418 1.9× 62 0.6× 26 0.5× 38 1.6× 14 511
S. Luce United States 6 259 0.9× 146 0.7× 43 0.4× 40 0.8× 38 1.6× 11 300
R. Augur Netherlands 9 233 0.8× 171 0.8× 51 0.5× 49 0.9× 28 1.2× 27 269
E. Richard France 6 245 0.8× 201 0.9× 72 0.7× 83 1.6× 25 1.0× 21 296

Countries citing papers authored by David De Roest

Since Specialization
Citations

This map shows the geographic impact of David De Roest's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David De Roest with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David De Roest more than expected).

Fields of papers citing papers by David De Roest

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David De Roest. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David De Roest. The network helps show where David De Roest may publish in the future.

Co-authorship network of co-authors of David De Roest

This figure shows the co-authorship network connecting the top 25 collaborators of David De Roest. A scholar is included among the top collaborators of David De Roest based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David De Roest. David De Roest is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Tomczak, Yoann, et al.. (2023). Evaluation of TiN hardmask films to prevent line wiggling due to plasma-induced film stress. 8–8. 1 indexed citations
3.
Kikuchi, Yoshiaki, T. Chiarella, David De Roest, et al.. (2017). The Improvement of Subthreshold Slope and Transconductance of p-Type Bulk Si Field-Effect Transistors by Solid-Source Doping. IEEE Transactions on Electron Devices. 64(6). 2492–2497. 2 indexed citations
4.
Kikuchi, Yoshiaki, T. Chiarella, David De Roest, et al.. (2016). Electrical Characteristics of p-Type Bulk Si Fin Field-Effect Transistor Using Solid-Source Doping With 1-nm Phosphosilicate Glass. IEEE Electron Device Letters. 37(9). 1084–1087. 4 indexed citations
5.
Verdonck, Patrick, Els Van Besien, Kris Vanstreels, et al.. (2011). Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low-k Materials. Japanese Journal of Applied Physics. 50(5S1). 05EB05–05EB05. 7 indexed citations
6.
Maršík, P., et al.. (2011). Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance. Thin Solid Films. 519(11). 3619–3626. 24 indexed citations
7.
Croes, Kristof, Christopher J. Wilson, Melina Lofrano, et al.. (2009). Time and temperature dependence of early stage Stress-Induced-Voiding in Cu/low-k interconnects. 48. 457–463. 5 indexed citations
8.
Demuynck, S., C. Huffman, Maxime Darnon, et al.. (2008). Dielectric Reliability of 50 nm 1/2 Pitch Structures in Aurora<sup>&#174;</sup> LK. 1 indexed citations
9.
Tsuji, Naoto, et al.. (2007). A robust k∼2.3 SiCOH low-k film formed by porogen removal with UV-cure. Microelectronic Engineering. 84(11). 2575–2581. 26 indexed citations
10.
Nauwelaers, Bart, et al.. (2003). Influence of a Lossy Silicon Substrate on Conductance and Capacitance of Coupled Interconnects. Journal of Microwaves Optoelectronics and Electromagnetic Applications. 3(3). 49–53. 1 indexed citations
11.
Papanikolaou, Apostolos, Francky Catthoor, Henk Corporaal, et al.. (2003). Global interconnect trade-off for technology over memory modules to application level. DSpace - NTUA (National Technical University of Athens). 125–132. 10 indexed citations
12.
Nauwelaers, Bart, et al.. (2002). Accurate analytic expressions for frequency-dependent inductance and resistance of single on-chip interconnects on conductive silicon substrate. Physics Letters A. 293(3-4). 195–198. 6 indexed citations
13.
Donaton, R. A., Francesca Iacopi, Mikhaı̈l R. Baklanov, et al.. (2002). Physical and electrical characterization of silsesquioxane-based ultra-low k dielectric films. 93–95. 3 indexed citations
14.
Roest, David De, S. Vandenberghe, Michele Stucchi, et al.. (2002). Some measurement results for frequency-dependent inductance of IC interconnects on a lossy silicon substrate. IEEE Electron Device Letters. 23(2). 103–104. 1 indexed citations
15.
Nauwelaers, Bart, et al.. (2001). NEW ANALYTIC FORMULAS FOR SERIES MUTUAL IMPEDANCE COMPONENT CALCULATIONS OF COUPLED INTERCONNECTS ON LOSSY SILICON SUBSTRATE. 2(3). 1–16. 1 indexed citations
16.
Roest, David De, R. A. Donaton, Michele Stucchi, Karen Maex, & Bart Nauwelaers. (2001). Simulations and measurements of capacitance in dielectric stacks and consequences for integration. Microelectronic Engineering. 55(1-4). 29–35. 2 indexed citations
17.
Nauwelaers, Bart, et al.. (2001). CAD-oriented analytic formulas for self and mutual capacitance of interconnects on an Si-SiO2 substrate. 1 indexed citations
18.
Nauwelaers, Bart, et al.. (2001). Analytic model for self and mutual frequency-dependent impedance of multiconductor interconnects on lossy silicon substrates. 628–633. 2 indexed citations
19.
Donaton, R. A., Erik Sleeckx, Marc Schaekers, et al.. (2000). Characterization and Integration in Cu Damascene Structures of AURORA, an Inorganic Low-k Dielectric. MRS Proceedings. 612. 1 indexed citations
20.
Iacopi, Francesca, R. A. Donaton, Herbert Struyf, et al.. (2000). Studies on XLK film characterization and integration in copper damascene processes. 287–293. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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