Mitsutoshi Higashi

474 total citations
17 papers, 389 citations indexed

About

Mitsutoshi Higashi is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Mitsutoshi Higashi has authored 17 papers receiving a total of 389 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 8 papers in Biomedical Engineering and 2 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Mitsutoshi Higashi's work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (15 papers) and Nanofabrication and Lithography Techniques (6 papers). Mitsutoshi Higashi is often cited by papers focused on 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (15 papers) and Nanofabrication and Lithography Techniques (6 papers). Mitsutoshi Higashi collaborates with scholars based in Japan, France and Belgium. Mitsutoshi Higashi's co-authors include Masahiro Sunohara, Takashi Kurihara, Takashi Tokunaga, Kei Murayama, K. Hara, M. Assous, Jean Charbonnier, Yuichi Taguchi, Kenichi Mori and Vladimir Cherman and has published in prestigious journals such as Additional Conferences (Device Packaging HiTEC HiTEN & CICMT), IMAPSource Proceedings and Journal of Smart Processing.

In The Last Decade

Mitsutoshi Higashi

16 papers receiving 380 citations

Peers

Mitsutoshi Higashi

EEE

BE

AE

HA

ME

C. T. Wang Taiwan

Yoichiro Kurita Japan

A. Sharma United States

M. Matsuo Japan

S. Y. Hou Taiwan

M. J. Interrante United States

Bahareh Banijamali United States

Riko Radojcic United States

Josef Weber Germany

Xiaopeng Xu United States

C. T. Wang Taiwan

Mitsutoshi Higashi

338 ×0.9

EEE

62 ×0.6

BE

31 ×0.6

AE

48 ×1.1

HA

19 ×0.7

ME

Citations per year, relative to Mitsutoshi Higashi Mitsutoshi Higashi (= 1×) peers C. T. Wang

Countries citing papers authored by Mitsutoshi Higashi

Since Specialization

Citations

This map shows the geographic impact of Mitsutoshi Higashi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mitsutoshi Higashi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mitsutoshi Higashi more than expected).

Fields of papers citing papers by Mitsutoshi Higashi

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Mitsutoshi Higashi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mitsutoshi Higashi. The network helps show where Mitsutoshi Higashi may publish in the future.

Co-authorship network of co-authors of Mitsutoshi Higashi

This figure shows the co-authorship network connecting the top 25 collaborators of Mitsutoshi Higashi. A scholar is included among the top collaborators of Mitsutoshi Higashi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mitsutoshi Higashi. Mitsutoshi Higashi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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17 of 17 papers shown

1.

Cherman, Vladimir, Melina Lofrano, Mario González, et al.. (2018). Evaluation of Mechanical Stress Induced During IC Packaging. 2168–2173. 13 indexed citations

2.

Murayama, Kei, et al.. (2014). Study of electro-migration resistivity of micro bump using SnBi solder. 1166–1172. 7 indexed citations

3.

Li, Li, et al.. (2014). Cost and performance effective silicon interposer and Vertical Interconnect for 3D ASIC and memory integration. 1366–1371. 3 indexed citations

4.

Murayama, Kei, et al.. (2013). Electro-migration Behavior in Eutectic Sn-Bi Flip Chip Solder Joints with Cu-Pillar Electrodes. Journal of Smart Processing. 2(4). 178–185. 8 indexed citations

5.

Hara, K., et al.. (2013). Warpage behavior in 2.5D package using Si-interposer. 1–4. 3 indexed citations

6.

Sunohara, Masahiro, Kenichi Mori, Kei Murayama, et al.. (2013). Electrical and morphological characterization for high integrated silicon interposer and technology transfer from 200 mm to 300mm wafer. 334–341.

7.

Murayama, Kei, K. Hara, Masahiro Sunohara, et al.. (2013). Warpage control of silicon interposer for 2.5D package application. 879–884. 32 indexed citations

8.

Murayama, Kei, et al.. (2012). Electro-migration behavior in low temperature flip chip bonding. 608–614. 11 indexed citations

9.

Charbonnier, Jean, M. Assous, Masahiro Sunohara, et al.. (2012). High density 3D silicon interposer technology development and electrical characterization for high end applications. 1–7. 11 indexed citations

10.

Sunohara, Masahiro, Jean Charbonnier, M. Assous, et al.. (2012). Full Integration and Electrical Characterization of 3D Silicon Interposer Demonstrator Incorporating High Density TSVs and Interconnects. IMAPSource Proceedings. 2012(1). 984–990. 5 indexed citations

11.

Sunohara, Masahiro, et al.. (2011). Development of Si interposer with low inductance decoupling capacitor. 849–854. 13 indexed citations

12.

Murayama, Kei, et al.. (2011). Electro-migration Behavior in Micro-joints of Sn-57Bi solder and Cu Post Bumps. IMAPSource Proceedings. 2011(1). 997–1006. 11 indexed citations

13.

Murayama, Kei, et al.. (2010). TLP Bonding Technologies for Micro Joining and 3D Packaging. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1221–1252. 3 indexed citations

14.

Sunohara, Masahiro, et al.. (2010). Studies on electrical performance and thermal stress of a silicon interposer with TSVs. 1088–1093. 44 indexed citations

15.

Sunohara, Masahiro, et al.. (2009). Development of silicon module with TSVs and global wiring (L/S=0.8/0.8µm). j91 c. 25–31. 24 indexed citations

16.

Sunohara, Masahiro, Takashi Tokunaga, Takashi Kurihara, & Mitsutoshi Higashi. (2008). Silicon interposer with TSVs (Through Silicon Vias) and fine multilayer wiring. 847–852. 129 indexed citations

17.

Sunohara, Masahiro, et al.. (2008). A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect. 571–576. 72 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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