Mitsutoshi Higashi
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Automotive Engineering
- Hardware and Architecture top 10%
- Mechanical Engineering
- Co-authors
- Masahiro SunoharaTakashi KuriharaTakashi TokunagaKei MurayamaK. HaraM. AssousJean CharbonnierYuichi Taguchi
- Topics
- 3D IC and TSV technologies (17 papers)Electronic Packaging and Soldering Technologies (15 papers)Nanofabrication and Lithography Techniques (6 papers)
- Journals
- Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)IMAPSource ProceedingsJournal of Smart Processing
In The Last Decade
Mitsutoshi Higashi
16 papers receiving 380 citations
Peers
Comparison fields: 5 of 21
- Electrical and Electronic Engineering 382
- Biomedical Engineering 98
- Automotive Engineering 50
- Hardware and Architecture 44
- Mechanical Engineering 28
Countries citing papers authored by Mitsutoshi Higashi
This map shows the geographic impact of Mitsutoshi Higashi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mitsutoshi Higashi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mitsutoshi Higashi more than expected).
Fields of papers citing papers by Mitsutoshi Higashi
This network shows the impact of papers produced by Mitsutoshi Higashi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mitsutoshi Higashi. The network helps show where Mitsutoshi Higashi may publish in the future.
Co-authorship network of co-authors of Mitsutoshi Higashi
This figure shows the co-authorship network connecting the top 25 collaborators of Mitsutoshi Higashi. A scholar is included among the top collaborators of Mitsutoshi Higashi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mitsutoshi Higashi. Mitsutoshi Higashi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 13 | |
| 2 | 7 | |
| 3 | 3 | |
| 4 | 8 | |
| 5 | 3 | |
| 6 | 0 | |
| 7 | 32 | |
| 8 | 11 | |
| 9 | 11 | |
| 10 | 5 | |
| 11 | 13 | |
| 12 | 11 | |
| 13 | 3 | |
| 14 | 44 | |
| 15 | 24 | |
| 16 | 129 | |
| 17 | 72 |
About Mitsutoshi Higashi
Mitsutoshi Higashi is a scholar working on General Materials Science, Electrical and Electronic Engineering and Biomedical Engineering, having authored 17 papers that have together received 389 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (17 papers), Electronic Packaging and Soldering Technologies (15 papers) and Nanofabrication and Lithography Techniques (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (382 citations), Hardware and Architecture (44 citations) and Automotive Engineering (50 citations). Mitsutoshi Higashi has collaborated with scholars based in Japan, France and Belgium. Frequent co-authors include Masahiro Sunohara, Takashi Kurihara, Takashi Tokunaga, Kei Murayama, K. Hara, M. Assous, Jean Charbonnier, Yuichi Taguchi, Kenichi Mori and Vladimir Cherman. Their work appears in journals such as Additional Conferences (Device Packaging HiTEC HiTEN & CICMT), IMAPSource Proceedings and Journal of Smart Processing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.