Pierric Gueguen
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 10
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- 3D IC and TSV technologies 16
- Electronic Packaging and Soldering Technologies 15
- Electrical and Thermal Properties of Materials 1
- Integrated Circuits and Semiconductor Failure Analysis 1
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- Copper Interconnects and Reliability 5
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- Microstructure and mechanical properties 1
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- Aluminum Alloy Microstructure Properties 1
- Co-authors
- L. Di CioccioL. ClavelierR. TaïbiM. RivoireL.L. ChapelonF. RieutordMarc ZussyDaniel Scevola
- Cited by
- Automotive EngineeringElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
- Journals
- Journal of The Electrochemical Society (2 papers)Thin Solid Films (2 papers)Microelectronics Reliability (1 paper)
- Partner nations
- FranceSwitzerlandCzechia
In The Last Decade
Pierric Gueguen
20 papers receiving 375 citations
Peers
Comparison fields: 5 of 25
- Automotive Engineering 80
- Electrical and Electronic Engineering 355
- Electronic, Optical and Magnetic Materials 96
- Hardware and Architecture 9
- Biomedical Engineering 58
Countries citing papers authored by Pierric Gueguen
This map shows the geographic impact of Pierric Gueguen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pierric Gueguen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pierric Gueguen more than expected).
Fields of papers citing papers by Pierric Gueguen
This network shows the impact of papers produced by Pierric Gueguen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pierric Gueguen. The network helps show where Pierric Gueguen may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Pierric Gueguen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 9 | |
| 2 | 2011 | 33 | |
| 3 | 2011 | 68 | |
| 4 | 2010 | 8 | |
| 5 | 2010 | 17 | |
| 6 | 2010 | 33 | |
| 7 | 2010 | 20 | |
| 8 | 2010 | 6 | |
| 9 | 2010 | 10 | |
| 10 | 2009 | 6 | |
| 11 | 2009 | 5 | |
| 12 | 2009 | 37 | |
| 13 | 2009 | 16 | |
| 14 | 2009 | 48 | |
| 15 | 2008 | 6 | |
| 16 | 2008 | 30 | |
| 17 | 2008 | 10 | |
| 18 | 2008 | 2 | |
| 19 | 1975 | 9 | |
| 20 | 1973 | 17 |
About Pierric Gueguen
Pierric Gueguen is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 20 papers that have together received 390 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (16 papers), Electronic Packaging and Soldering Technologies (15 papers), Additive Manufacturing and 3D Printing Technologies (10 papers), Copper Interconnects and Reliability (5 papers), Electrical and Thermal Properties of Materials (1 paper), Integrated Circuits and Semiconductor Failure Analysis (1 paper), Microstructure and mechanical properties (1 paper) and Aluminum Alloy Microstructure Properties (1 paper). The work is most often cited by research in Automotive Engineering (80 citations), Electrical and Electronic Engineering (355 citations) and Electronic, Optical and Magnetic Materials (96 citations). Pierric Gueguen has collaborated with scholars based in France, Switzerland and Czechia. Frequent co-authors include L. Di Cioccio, L. Clavelier, R. Taïbi, M. Rivoire, L.L. Chapelon, F. Rieutord, Marc Zussy, Daniel Scevola, Ionut Radu and D. Lafond. Their work appears in journals such as Journal of The Electrochemical Society, Thin Solid Films and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.