Pieter Bex
Impact in
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- 3D IC and TSV technologies 39
- Electronic Packaging and Soldering Technologies 34
- Semiconductor Lasers and Optical Devices 4
-
- Additive Manufacturing and 3D Printing Technologies 10
- Co-authors
- Eric Beyne (39 shared papers)Gerald Beyer (31 shared papers)Alain Phommahaxay (24 shared papers)Koen Kennes (14 shared papers)Samuel Suhard (15 shared papers)Andy Miller (19 shared papers)John Slabbekoorn (7 shared papers)Serena Iacovo (3 shared papers)
- Journals
- Ghent University Academic Bibliography (Ghent University) (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2 papers)2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (1 paper)IMAPSource Proceedings (1 paper)TU/e Research Portal (1 paper)
- Partner nations
- BelgiumUnited StatesJapan
In The Last Decade
Pieter Bex
40 papers receiving 310 citations
Peers
Comparison fields: 5 of 21
- Automotive Engineering 82
- Electrical and Electronic Engineering 303
- Industrial and Manufacturing Engineering 24
- Biomedical Engineering 87
- Hardware and Architecture 11
Countries citing papers authored by Pieter Bex
This map shows the geographic impact of Pieter Bex's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pieter Bex with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pieter Bex more than expected).
Fields of papers citing papers by Pieter Bex
This network shows the impact of papers produced by Pieter Bex. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pieter Bex. The network helps show where Pieter Bex may publish in the future.
Co-authors
The 25 scholars most cited alongside Pieter Bex, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2019 | 34 | |
| 2 | 2012 | 31 | |
| 3 | 2020 | 18 | |
| 4 | 2020 | 18 | |
| 5 | 2023 | 16 | |
| 6 | 2021 | 14 | |
| 7 | 2021 | 14 | |
| 8 | 2020 | 12 | |
| 9 | 2020 | 12 | |
| 10 | 2022 | 11 | |
| 11 | 2012 | 9 | |
| 12 | 2016 | 9 | |
| 13 | 2024 | 9 | |
| 14 | 2016 | 9 | |
| 15 | 2015 | 9 | |
| 16 | 2017 | 9 | |
| 17 | 2019 | 8 | |
| 18 | 2018 | 7 | |
| 19 | 2022 | 7 | |
| 20 | 2019 | 7 |
About Pieter Bex
Pieter Bex is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Biomedical Engineering, Mechanical Engineering and Mechanics of Materials, having authored 44 papers that have together received 328 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (39 papers), Electronic Packaging and Soldering Technologies (34 papers), Additive Manufacturing and 3D Printing Technologies (10 papers), Nanofabrication and Lithography Techniques (6 papers), Semiconductor Lasers and Optical Devices (4 papers), Advanced Surface Polishing Techniques (4 papers), Copper Interconnects and Reliability (3 papers) and Adhesion, Friction, and Surface Interactions (3 papers). The work is most often cited by research in Automotive Engineering (82 citations), Electrical and Electronic Engineering (303 citations), Industrial and Manufacturing Engineering (24 citations), Biomedical Engineering (87 citations) and Hardware and Architecture (11 citations). Pieter Bex has collaborated with scholars based in Belgium, United States and Japan. Frequent co-authors include Eric Beyne, Gerald Beyer, Alain Phommahaxay, Koen Kennes, Samuel Suhard, Andy Miller, John Slabbekoorn, Serena Iacovo, Anne Jourdain and Fumihiro Inoue. Their work appears in journals such as Ghent University Academic Bibliography (Ghent University), 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), IMAPSource Proceedings and TU/e Research Portal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.