Pieter Bex

495 total citations
44 papers, 328 citations indexed

About

Pieter Bex is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Pieter Bex has authored 44 papers receiving a total of 328 indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Electrical and Electronic Engineering, 10 papers in Automotive Engineering and 10 papers in Biomedical Engineering. Recurrent topics in Pieter Bex's work include 3D IC and TSV technologies (39 papers), Electronic Packaging and Soldering Technologies (34 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Pieter Bex is often cited by papers focused on 3D IC and TSV technologies (39 papers), Electronic Packaging and Soldering Technologies (34 papers) and Additive Manufacturing and 3D Printing Technologies (10 papers). Pieter Bex collaborates with scholars based in Belgium, United States and Japan. Pieter Bex's co-authors include Eric Beyne, Gerald Beyer, Alain Phommahaxay, Koen Kennes, Samuel Suhard, Andy Miller, John Slabbekoorn, Serena Iacovo, Anne Jourdain and Fumihiro Inoue and has published in prestigious journals such as TU/e Research Portal, Ghent University Academic Bibliography (Ghent University) and 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).

In The Last Decade

Pieter Bex

40 papers receiving 310 citations

Peers

Pieter Bex

EEE

IME

EOMM

Bongsub Lee United States

Vasarla Nagendra Sekhar Singapore

R. Kahle Germany

Hsiang‐Hung Chang Taiwan

T. Enot France

S. Voges Germany

Chai Tai Chong Singapore

Curtis Zwenger United States

A. Jouve France

Woo-Sung Han South Korea

Bongsub Lee United States

Pieter Bex

340 ×1.1

EEE

78 ×0.9

78 ×1.0

22 ×0.9

IME

62 ×2.7

EOMM

Citations per year, relative to Pieter Bex Pieter Bex (= 1×) peers Bongsub Lee

Countries citing papers authored by Pieter Bex

Since Specialization

Citations

This map shows the geographic impact of Pieter Bex's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Pieter Bex with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Pieter Bex more than expected).

Fields of papers citing papers by Pieter Bex

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Pieter Bex. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Pieter Bex. The network helps show where Pieter Bex may publish in the future.

Co-authorship network of co-authors of Pieter Bex

This figure shows the co-authorship network connecting the top 25 collaborators of Pieter Bex. A scholar is included among the top collaborators of Pieter Bex based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Pieter Bex. Pieter Bex is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kennes, Koen, Pieter Bex, Lin Ye, et al.. (2025). Impact of Temporary Substrates & Adhesives on Die-to-Wafer Overlay. 1934–1938. 1 indexed citations

Bex, Pieter, Mario González, Steven Brems, et al.. (2024). Overlay Scaling Error Reduction for Hybrid Die-to-Wafer Bonding. 1–6. 1 indexed citations

Bex, Pieter, Alain Phommahaxay, Koen Kennes, et al.. (2024). Optimized Die Preparation and Handling for High Yield Hybrid Die to Wafer Bonding. IMAPSource Proceedings. 2023(Symposium). 2 indexed citations

Sun, Xiao, John Slabbekoorn, Siddhartha Sinha, et al.. (2022). Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 7–11. 7 indexed citations

Derakhshandeh, Jaber, Fumihiro Inoue, Vladimir Cherman, et al.. (2021). A study on IMC morphology and integration flow for low temperature and high throughput TCB down to $10\mu \mathrm{m}$ pitch microbumps. 1119–1124. 3 indexed citations

Suhard, Samuel, Koen Kennes, Pieter Bex, et al.. (2021). Demonstration of a collective hybrid die-to-wafer integration using glass carrier. 2064–2070. 14 indexed citations

Suhard, Samuel, Alain Phommahaxay, Koen Kennes, et al.. (2020). Demonstration of a collective hybrid die-to-wafer integration. 1315–1321. 12 indexed citations

Sun, Xiao, Hesheng Lin, Dimitrios Velenis, et al.. (2020). 3D Heterogeneous Package Integration of Air/Magnetic Core Inductor: 89%-Efficiency Buck Converter with Backside Power Delivery Network. Ghent University Academic Bibliography (Ghent University). 1–2. 5 indexed citations

Derakhshandeh, Jaber, Pieter Bex, Melina Lofrano, et al.. (2020). Process development and characterization of 3D multi-die stacking. 1–6. 2 indexed citations

10.

Kennes, Koen, Alain Phommahaxay, Samuel Suhard, et al.. (2020). Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer. 296–302. 18 indexed citations

11.

Derakhshandeh, Jaber, Vladimir Cherman, Fumihiro Inoue, et al.. (2020). 10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process. 617–622. 18 indexed citations

12.

Phommahaxay, Alain, Samuel Suhard, Pieter Bex, et al.. (2019). Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems. 607–613. 34 indexed citations

13.

Phommahaxay, Alain, Pieter Bex, John Slabbekoorn, et al.. (2019). Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up. 340–345. 8 indexed citations

14.

Beyne, Eric, Alain Phommahaxay, Pieter Bex, et al.. (2018). HIGH DENSITY AND HIGH BANDWIDTH CHIP-TO-CHIP CONNECTIONS WITH 20μm PITCH FLIP-CHIP ON FAN-OUT WAFER LEVEL PACKAGE. TU/e Research Portal. 1–5. 7 indexed citations

15.

Hou, Lin, Jaber Derakhshandeh, Jeroen De Coster, et al.. (2017). A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks. 1–3. 2 indexed citations

16.

Wang, Teng, Lan Peng, Alain Phommahaxay, et al.. (2016). On the feasibility of die-to-wafer inorganic dielectric bonding. 1–5. 5 indexed citations

17.

Derakhshandeh, Jaber, Lin Hou, Samuel Suhard, et al.. (2016). Die to wafer 3D stacking for below 10um pitch microbumps. 1–4. 9 indexed citations

18.

Phommahaxay, Alain, Anne Jourdain, W. Spieß, et al.. (2012). Process characterization of thin wafer debonding with thermoplastic materials. 1–4. 9 indexed citations

19.

Phommahaxay, Alain, Anne Jourdain, Pieter Bex, et al.. (2012). Evolution of temporary wafer (de)bonding technology towards low temperature processes for enhanced 3D integration. 229–233. 5 indexed citations

20.

Phommahaxay, Alain, Anne Jourdain, Gabriel Magariños, et al.. (2012). Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. 1–4. 31 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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