Vincent Fiori
- Electrical and Electronic Engineering
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Mechanics of Materials
- Topics
- 3D IC and TSV technologies (32 papers)Electronic Packaging and Soldering Technologies (28 papers)Integrated Circuits and Semiconductor Failure Analysis (12 papers)
- Cited by
- Electrical and Electronic EngineeringStructural BiologyElectronic, Optical and Magnetic Materials
- Partner nations
- FranceSwitzerlandIndia
In The Last Decade
Vincent Fiori
47 papers receiving 307 citations
Peers
Comparison fields: 5 of 23
- Electrical and Electronic Engineering 292
- Biomedical Engineering 71
- Electronic, Optical and Magnetic Materials 52
- Mechanical Engineering 45
- Mechanics of Materials 38
Countries citing papers authored by Vincent Fiori
This map shows the geographic impact of Vincent Fiori's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Vincent Fiori with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Vincent Fiori more than expected).
Fields of papers citing papers by Vincent Fiori
This network shows the impact of papers produced by Vincent Fiori. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Vincent Fiori. The network helps show where Vincent Fiori may publish in the future.
Co-authorship network of co-authors of Vincent Fiori
This figure shows the co-authorship network connecting the top 25 collaborators of Vincent Fiori. A scholar is included among the top collaborators of Vincent Fiori based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Vincent Fiori. Vincent Fiori is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 18 | |
| 2 | 0 | |
| 3 | 4 | |
| 4 | 11 | |
| 5 | 2 | |
| 6 | 1 | |
| 7 | 11 | |
| 8 | 7 | |
| 9 | 12 | |
| 10 | 0 | |
| 11 | Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications | 2 |
| 12 | 2 | |
| 13 | 3 | |
| 14 | 1 | |
| 15 | 31 | |
| 16 | 7 | |
| 17 | 12 | |
| 18 | 8 | |
| 19 | 7 | |
| 20 | 13 |
About Vincent Fiori
Vincent Fiori is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Automotive Engineering, having authored 50 papers that have together received 321 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (32 papers), Electronic Packaging and Soldering Technologies (28 papers) and Integrated Circuits and Semiconductor Failure Analysis (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (292 citations), Structural Biology (6 citations) and Electronic, Optical and Magnetic Materials (52 citations). Vincent Fiori has collaborated with scholars based in France, Switzerland and India. Frequent co-authors include S. Orain, C. Tavernier, Tong Yan Tee, C. Ortolland, A. Farcy, Ο. Thomas, H. Jaouen, S. Escoubas, S. Chéramy and S. Lhostis. Their work appears in journals such as Applied Physics Letters, IEEE Transactions on Electron Devices and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.