J.S. Reid

1.2k total citations
22 papers, 1.1k citations indexed

About

J.S. Reid is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, J.S. Reid has authored 22 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 14 papers in Electronic, Optical and Magnetic Materials and 10 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in J.S. Reid's work include Semiconductor materials and devices (17 papers), Copper Interconnects and Reliability (14 papers) and Semiconductor materials and interfaces (10 papers). J.S. Reid is often cited by papers focused on Semiconductor materials and devices (17 papers), Copper Interconnects and Reliability (14 papers) and Semiconductor materials and interfaces (10 papers). J.S. Reid collaborates with scholars based in United States. J.S. Reid's co-authors include E. Kolawa, M.−A. Nicolet, Jen‐Sue Chen, Xin Sun, M‐A. Nicolet, R. Ruiz, P.J. Pokela, F. Cardone, Yosi Shacham‐Diamand and M. Angyal and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Applied Surface Science.

In The Last Decade

J.S. Reid

22 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J.S. Reid United States 16 806 655 564 277 243 22 1.1k
K. P. Rodbell United States 13 682 0.8× 633 1.0× 290 0.5× 180 0.6× 205 0.8× 32 950
P. M. Fryer United States 13 886 1.1× 559 0.9× 297 0.5× 430 1.6× 219 0.9× 20 1.1k
Brad J. Burrow United States 9 490 0.6× 285 0.4× 307 0.5× 234 0.8× 134 0.6× 12 668
E. K. Broadbent United States 15 551 0.7× 224 0.3× 256 0.5× 341 1.2× 166 0.7× 30 761
J. M. Molarius Finland 14 458 0.6× 232 0.4× 526 0.9× 130 0.5× 392 1.6× 46 816
Mao‐Chieh Chen Taiwan 17 608 0.8× 413 0.6× 221 0.4× 177 0.6× 164 0.7× 61 717
Miki Moriyama Japan 14 427 0.5× 247 0.4× 179 0.3× 162 0.6× 222 0.9× 26 611
A. Gröne Germany 8 621 0.8× 416 0.6× 79 0.1× 313 1.1× 192 0.8× 11 845
E. Sakuma Poland 18 977 1.2× 239 0.4× 104 0.2× 255 0.9× 275 1.1× 37 1.2k
Sergey Grachev France 15 298 0.4× 190 0.3× 307 0.5× 164 0.6× 415 1.7× 45 759

Countries citing papers authored by J.S. Reid

Since Specialization
Citations

This map shows the geographic impact of J.S. Reid's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J.S. Reid with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J.S. Reid more than expected).

Fields of papers citing papers by J.S. Reid

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J.S. Reid. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J.S. Reid. The network helps show where J.S. Reid may publish in the future.

Co-authorship network of co-authors of J.S. Reid

This figure shows the co-authorship network connecting the top 25 collaborators of J.S. Reid. A scholar is included among the top collaborators of J.S. Reid based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J.S. Reid. J.S. Reid is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Sun, Xin, J.S. Reid, E. Kolawa, M.−A. Nicolet, & R. Ruiz. (1997). Reactively sputtered Ti-Si-N films. II. Diffusion barriers for Al and Cu metallizations on Si. Journal of Applied Physics. 81(2). 664–671. 57 indexed citations
2.
Sun, Xin, J.S. Reid, E. Kolawa, & M.−A. Nicolet. (1997). Reactively sputtered Ti-Si-N films I. Physical properties. Journal of Applied Physics. 81(2). 656–663. 97 indexed citations
3.
Angyal, M., Yosi Shacham‐Diamand, J.S. Reid, & M.−A. Nicolet. (1995). Performance of tantalum-silicon-nitride diffusion barriers between copper and silicon dioxide. Applied Physics Letters. 67(15). 2152–2154. 37 indexed citations
4.
Parmeter, J. E., G. A. Petersen, Christopher A. Apblett, et al.. (1995). Characterization of thin copper films grown via chemical vapor deposition using liquid coinjection of trimethylvinylsilane and (hexafluoroacetylacetonate) Cu (trimethylvinylsilane). Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 13(1). 130–136. 17 indexed citations
5.
Reid, J.S., et al.. (1995). W-B-N diffusion barriers for Si/Cu metallizations. Thin Solid Films. 262(1-2). 218–223. 39 indexed citations
6.
McLane, G. F., et al.. (1995). Reactive ion etching of Ta-Si-N diffusion barriersin CHF 3 +O 2. Electronics Letters. 31(7). 591–592. 1 indexed citations
7.
Dauksher, William J., Douglas J. Resnick, K. D. Cummings, et al.. (1995). Method for fabricating a low stress x-ray mask using annealable amorphous refractory compounds. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 13(6). 3103–3108. 35 indexed citations
8.
McLane, G. F., et al.. (1994). Dry Etching of Ta-Si-N Diffusion Barrier Material in Cf4+02 Gas Mixtures. MRS Proceedings. 337. 1 indexed citations
9.
Reid, J.S., Xin Sun, E. Kolawa, & M.−A. Nicolet. (1994). Ti-Si-N diffusion barriers between silicon and copper. IEEE Electron Device Letters. 15(8). 298–300. 75 indexed citations
10.
McLane, G. F., et al.. (1994). Reactive ion etching of Ta–Si–N diffusion barriers in CF4+O2. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 12(4). 2352–2355. 5 indexed citations
11.
Kolawa, E., Xin Sun, J.S. Reid, et al.. (1993). Amorphous W40Re40B20 diffusion barriers for <Si>/Al and <Si>/Cu metallizations. Thin Solid Films. 236(1-2). 301–305. 15 indexed citations
12.
Sun, Xin, et al.. (1993). Properties of reactively sputter-deposited TaN thin films. Thin Solid Films. 236(1-2). 347–351. 119 indexed citations
13.
Kolawa, E., J.S. Reid, & Jen‐Sue Chen. (1993). <title>Amorphous metallic alloys: a new advance in thin-film diffusion barriers for copper metallization</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 1805. 11–17. 3 indexed citations
14.
Pokela, P.J., E. Kolawa, R. Ruiz, J.S. Reid, & M.‐A. Nicolet. (1992). Thermal stability and the failure mechanism of the Al/W76N24/Au metallization. Thin Solid Films. 208(1). 33–37. 2 indexed citations
15.
Reid, J.S., et al.. (1992). Ta-Si-N and Si3N4 Encapsulants for InP. MRS Proceedings. 260. 2 indexed citations
16.
Reid, J.S., E. Kolawa, & M.−A. Nicolet. (1992). Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems. Journal of materials research/Pratt's guide to venture capital sources. 7(9). 2424–2428. 20 indexed citations
17.
Kolawa, E., P.J. Pokela, J.S. Reid, Jen‐Sue Chen, & M.−A. Nicolet. (1991). Amorphous Ta-Si-N diffusion barriers in Si/Al and Si/Cu metallizations. Applied Surface Science. 53. 373–376. 38 indexed citations
18.
Kolawa, E., Jen‐Sue Chen, J.S. Reid, P.J. Pokela, & M‐A. Nicolet. (1991). Tantalum-based diffusion barriers in Si/Cu VLSI metallizations. Journal of Applied Physics. 70(3). 1369–1373. 195 indexed citations
19.
Kolawa, E., P.J. Pokela, J.S. Reid, et al.. (1991). Sputtered Ta-Si-N diffusion barriers in Cu metallizations for Si. IEEE Electron Device Letters. 12(6). 321–323. 65 indexed citations
20.
Pokela, P.J., et al.. (1991). Thermal oxidation of amorphous ternary Ta36Si14N50 thin films. Journal of Applied Physics. 70(5). 2828–2832. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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