M. Fayolle

706 total citations
41 papers, 505 citations indexed

About

M. Fayolle is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, M. Fayolle has authored 41 papers receiving a total of 505 indexed citations (citations by other indexed papers that have themselves been cited), including 37 papers in Electrical and Electronic Engineering, 22 papers in Electronic, Optical and Magnetic Materials and 13 papers in Materials Chemistry. Recurrent topics in M. Fayolle's work include Copper Interconnects and Reliability (21 papers), Semiconductor materials and devices (20 papers) and Carbon Nanotubes in Composites (12 papers). M. Fayolle is often cited by papers focused on Copper Interconnects and Reliability (21 papers), Semiconductor materials and devices (20 papers) and Carbon Nanotubes in Composites (12 papers). M. Fayolle collaborates with scholars based in France, Switzerland and Ireland. M. Fayolle's co-authors include G. Passemard, S. Maı̂trejean, Jean Dijon, Hanako Okuno, O. Louveau, Florence Fusalba, J. Cluzel, A. Fournier, Hélène Le Poche and P. D. Szkutnik and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Diamond and Related Materials.

In The Last Decade

M. Fayolle

40 papers receiving 485 citations

Peers

Countries citing papers authored by M. Fayolle

Since Specialization

Citations

This map shows the geographic impact of M. Fayolle's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Fayolle with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Fayolle more than expected).

Fields of papers citing papers by M. Fayolle

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Fayolle. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Fayolle. The network helps show where M. Fayolle may publish in the future.

Co-authorship network of co-authors of M. Fayolle

This figure shows the co-authorship network connecting the top 25 collaborators of M. Fayolle. A scholar is included among the top collaborators of M. Fayolle based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Fayolle. M. Fayolle is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Study of Ti-Rich and Al-Rich Contact Metallization for AlGaN/GaN HEMT Power Devices 2014 ·ECS Transactions ·(unknown), M. Fayolle, (unknown), E. Blanquet, (unknown)	3
2	CNT integration on different materials suitable for VLSI interconnects 2010 ·Comptes Rendus Physique ·Hanako Okuno, A. Fournier, Etienne Quesnel, (unknown), Hélène Le Poche, M. Fayolle, Jean Dijon	4
3	Carbon nanotubes for interconnects in future integrated circuits: The challenge of the density 2009 ·Diamond and Related Materials ·Jean Dijon, A. Fournier, P. D. Szkutnik, Hanako Okuno, (unknown), M. Fayolle	50
4	An application of carbon nanotubes for integrated circuit interconnects 2008 ·Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·(unknown), Luis E. F. Foa Torres, Hélène Le Poche, M. Fayolle, Stephan Roche, S. Maı̂trejean, S. Roualdès, A. Ayral	2
5	Challenges for 3D IC integration: bonding quality and thermal management 2007 ·Patrick Leduc, N. Sillon, S. Maı̂trejean, (unknown), G. Passemard, F. de Crécy, M. Fayolle, Barbara Charlet, T. Enot, Marc Zussy, (unknown), (unknown), N. Kernevez	69
6	Measuring the diffusion of Ti and Cu in low-k materials for microelectronic devices by EELS, EFTEM and EDX 2006 ·Journal of Physics Conference Series ·Jean‐Paul Barnes, D. Lafond, C. Guedj, M. Fayolle, (unknown), S. Maı̂trejean, David Tormey, N. Possémé, P. Bayle‐Guillemaud, Amal Chabli	2
7	Pore Sealing of a Porous Dielectric by Using a Thin PECVD a-SiC:H Conformal Liner 2005 ·Journal of The Electrochemical Society ·V. Jousseaume, M. Fayolle, C. Guedj, Paul‐Henri Haumesser, (unknown), Floran Pierre, R. Pantel, H. Feldis, G. Passemard	17
8	Analysis of resistivity in nano-interconnect: full range (4.2-300 K) temperature characterization 2004 ·(unknown), L. Arnaud, Thierry Mourier, M. Fayolle, (unknown), G. Reimbold	7
9	Influence of dielectric layers on electromigration results in Cu interconnects 2004 ·L. Arnaud, (unknown), (unknown), M. Fayolle, G. Reimbold	1
10	Porous dielectric dual damascene patterning issues for 65 nm node: can architecture bring a solution? 2004 ·M. Assous, Julia Simon, Lucile Broussous, (unknown), M. Fayolle, O. Louveau, (unknown), (unknown), H. Feldis, D. Louis, J. Torrès	4
11	Porous low k pore sealing process study for 65 nm and below technologies 2004 ·Thierry Mourier, V. Jousseaume, Florence Fusalba, (unknown), P. Maury, G. Passemard, Paul‐Henri Haumesser, S. Maı̂trejean, (unknown), R. Pantel, F. Pierre, M. Fayolle, H. Feldis	5
12	Characterization of photoresist poisoning induced by a post etch stripping step 2003 ·(unknown), O. Louveau, (unknown), M. Fayolle, N. Rochat, D. Louis, Lucile Broussous	4
13	Integration of Cu/SiOC in dual damascene interconnect for 0.1 μm technology using a new SiC material as dielectric barrier 2003 ·M. Fayolle, J. Torrès, G. Passemard, Florence Fusalba, (unknown), D. Louis, L. Arnaud, (unknown), J. Cluzel, H. Feldis, M. Rivoire, O. Louveau, Thierry Mourier, Lucile Broussous	4
14	A new damascene architecture for high-performance metal–insulator–metal capacitors integration 2003 ·Microelectronic Engineering ·A. Farcy, J. Torrès, V. Arnal, M. Fayolle, H. Feldis, Fabrice Jourdan, M. Assous, (unknown), (unknown)	15
15	Challenges of back end of the line for sub 65 nm generation 2003 ·Microelectronic Engineering ·M. Fayolle, G. Passemard, O. Louveau, Florence Fusalba, J. Cluzel	42
16	Copper dual damascene integration using organic low k material: construction architecture comparison 2002 ·Y. Morand, M. Assous, (unknown), (unknown), (unknown), M. Fayolle, D. Louis, G. Passemard, A. Roman, (unknown), (unknown)	1
17	Integration of copper with an organic low-k dielectric in 0.12-μm node interconnect 2002 ·Microelectronic Engineering ·M. Fayolle, G. Passemard, M. Assous, D. Louis, (unknown), Y. Gobil, J. Cluzel, L. Arnaud	18
18	Multilevel test structures for metal CMP integration application to Cu/SiO/sub 2/ damascene interconnect 2002 ·M. Fayolle, (unknown), Y. Morand	2
19	Hybrid deep UV–e-beam lithography for the fabrication of dual damascene structures 2001 ·Microelectronic Engineering ·L. Mollard, S. Tedesco, B. Dal’zotto, (unknown), L. Pain, (unknown), C. Comboroure, Y. Morand, M. Fayolle	0
20	0.35μm CMOS Technology with Chemical Mechanical Polishing for Three Metallization Levels Planarization 1994 ·(unknown), C. Arena, S. Deleonibus, (unknown), M. Fayolle, Y. Gobil, (unknown), M. Heitzmann, (unknown), F. Martín, Y. Morand, (unknown), (unknown)	1

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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