M. Shinosky

481 total citations
22 papers, 319 citations indexed

About

M. Shinosky is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials. According to data from OpenAlex, M. Shinosky has authored 22 papers receiving a total of 319 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 19 papers in Electronic, Optical and Magnetic Materials and 4 papers in Mechanics of Materials. Recurrent topics in M. Shinosky's work include Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (19 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). M. Shinosky is often cited by papers focused on Semiconductor materials and devices (21 papers), Copper Interconnects and Reliability (19 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). M. Shinosky collaborates with scholars based in United States, South Korea and Germany. M. Shinosky's co-authors include Fen Chen, J. Aitken, F. Chen, P. McLaughlin, O. Martı́nez, D. Harmon, J. Gambino, Chunyan Tian, Kai Zhao and C.-C. Yang and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

M. Shinosky

22 papers receiving 310 citations

Peers

Countries citing papers authored by M. Shinosky

Since Specialization

Citations

This map shows the geographic impact of M. Shinosky's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Shinosky with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Shinosky more than expected).

Fields of papers citing papers by M. Shinosky

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Shinosky. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Shinosky. The network helps show where M. Shinosky may publish in the future.

Co-authorship network of co-authors of M. Shinosky

This figure shows the co-authorship network connecting the top 25 collaborators of M. Shinosky. A scholar is included among the top collaborators of M. Shinosky based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Shinosky. M. Shinosky is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Layout dependence of gate dielectric TDDB in HKMG FinFET technology 2016 ·Wen Liu, Ernest Y. Wu, F Guarin, (unknown), (unknown), D. Badami, M. Shinosky, (unknown)	6
2	A method for rapid screening of various low-k TDDB models 2015 ·Fen Chen, (unknown), M. Shinosky, (unknown), (unknown), (unknown), R. Muralidhar	4
3	Diagnostic electromigration reliability evaluation with a local sensing structure 2015 ·Fen Chen, Erik McCullen, C. Christiansen, M. Shinosky, (unknown), (unknown), (unknown), (unknown), (unknown)	4
4	Breakdown data generation and in-die deconvolution methodology to address BEOL and MOL dielectric breakdown challenges 2015 ·Microelectronics Reliability ·F. Chen, (unknown), M. Shinosky, Kai Zhao, (unknown), Xiaohu Liu, Chunyan Tian	18
5	New breakdown data generation and analytics methodology to address BEOL and mol dielectric TDDB process development and technology qualification challenges 2014 ·Fen Chen, (unknown), M. Shinosky, (unknown), (unknown), R. Bolam, C. Christiansen, Kai Zhao, (unknown), Chunyan Tian, (unknown)	31
6	Temperature and field interrelation study of low-k TDDB for Cu interconnects with and without liner - New insights to the roles of Cu for a competing breakdown process 2013 ·Fen Chen, M. Shinosky, J. Aitken, C.-C. Yang, D. C. Edelstein	9
7	New electrical testing structures and analysis method for MOL and BEOL process diagnostics and TDDB reliability assessment 2013 ·Fen Chen, S. Mittl, M. Shinosky, (unknown), J. Aitken, Yanfeng Wang, (unknown), W.K. Henson, D. Mocuta	14
8	Invasion percolation model for abnormal time-dependent dielectric breakdown characteristic of low-k dielectrics due to massive metallic diffusion 2012 ·Applied Physics Letters ·Fen Chen, M. Shinosky, J. Aitken, C.-C. Yang, D. Edelstein	12
9	Investigation of emerging middle-of-line poly gate-to-diffusion contact reliability issues 2012 ·Chen Fen, S. Mittl, M. Shinosky, (unknown), (unknown), Brent Anderson, J. Aitken, Yanfeng Wang, Emily Kinser, M. Kumar, Yun Wang, (unknown), (unknown), W.K. Henson, D. Mocuta, Dian Li	18
10	Experimental confirmation of electron fluence driven, Cu catalyzed interface breakdown model for low-k TDDB 2012 ·Fen Chen, J. Gambino, M. Shinosky, J. Aitken, Elbert Huang, S. A. Cohen, C.-C. Yang, (unknown), Yun Wang, (unknown), D. Kioussis	3
11	Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes 2011 ·F. Chen, M. Shinosky, (unknown), J. Aitken, Sidney Cohen, Griselda Bonilla, A. Simon, P. McLaughlin, (unknown), F.H. Baumann, C. Parks, (unknown)	5
12	Extreme-Value Statistics and Poisson Area Scaling With a Fatal-Area Ratio for Low- $k$ Dielectric TDDB Modeling 2011 ·IEEE Transactions on Electron Devices ·Fen Chen, M. Shinosky, J. Aitken	17
13	A comparative study of ULK conduction mechanisms and TDDB characteristics for Cu interconnects with and without CoWP metal cap at 32nm technology 2010 ·(unknown), E. Huang, M. Shinosky, M. Angyal, (unknown), (unknown), A. Kolics	5
14	Soft breakdown characteristics of ultralow-k time-dependent dielectric breakdown for advanced complementary metal-oxide semiconductor technologies 2010 ·Journal of Applied Physics ·Fen Chen, M. Shinosky	17
15	Critical ultra low-k TDDB reliability issues for advanced CMOS technologies 2009 ·F. Chen, M. Shinosky, (unknown), J. Gambino, (unknown), (unknown), J. Aitken, D. Badami, M. Angyal, (unknown), Griselda Bonilla, G. Yang, (unknown), (unknown), J. Sudijono, Yue Tan, (unknown), (unknown)	18
16	Correlation between I–V slope and TDDB voltage acceleration for Cu/low-k interconnects 2009 ·(unknown), J. Gambino, M. Shinosky, (unknown), (unknown), M. Angyal, D. Badami, J. Aitken	5
17	Cu/low-k dielectric TDDB reliability issues for advanced CMOS technologies 2008 ·Microelectronics Reliability ·F. Chen, O. Martı́nez, D. Harmon, M. Shinosky, J. Aitken	37
18	Line edge roughness and spacing effect on low-k TDDB characteristics 2008 ·F. Chen, J. R. Lloyd, Kaushik Chanda, (unknown), (unknown), A. Strong, P. McLaughlin, M. Shinosky, S. Sankaran, (unknown), A. K. Stamper, Zhenyu He	34
19	The Effect of Metal Area and Line Spacing on TDDB Characteristics of 45nm Low-k SiCOH Dielectrics 2007 ·F. Chen, P. McLaughlin, J. Gambino, Ernest Y. Wu, J. Demarest, (unknown), M. Shinosky	26
20	Reliability Characterization of BEOL Vertical Natural Capacitor using Copper and Low-k SiCOH Dielectric for 65nm RF and Mixed-Signal Applications 2006 ·F. Chen, (unknown), A. Fischer, J. Gill, A. Chinthakindi, (unknown), M. Shinosky, D. Coolbaugh, V. Ramachandran, Yong Kong Siew, (unknown), (unknown), K. Park	13

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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