D. Badami

519 citations

11 papers · 330 indexed · h-index 7

Impact in

Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability
Electrical and Electronic Engineering
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design

Papers in ⓘ

Electronic, Optical and Magnetic Materials 8
- Copper Interconnects and Reliability 8
Electrical and Electronic Engineering 11
- Semiconductor materials and devices 11
- Electronic Packaging and Soldering Technologies 5
- Integrated Circuits and Semiconductor Failure Analysis 3
- Advancements in Semiconductor Devices and Circuit Design 3
- Electrostatic Discharge in Electronics 1
- Ferroelectric and Negative Capacitance Devices 1
- Electromagnetic Compatibility and Noise Suppression 1

Co-authors: Baozhen Li (4 shared papers)Timothy D. Sullivan (1 shared paper)C. Christiansen (3 shared papers)C.-C. Yang (1 shared paper)Baozhen Li (1 shared paper)M. Shinosky (4 shared papers)J. Aitken (4 shared papers)J. Gambino (2 shared papers)
Journals: Microelectronics Reliability (2 papers)
Partner nations: United States Canada

In The Last Decade

D. Badami

11 papers receiving 314 citations

Peers

Countries citing papers authored by D. Badami

Since Specialization

Citations

This map shows the geographic impact of D. Badami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Badami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Badami more than expected).

Fields of papers citing papers by D. Badami

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Badami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Badami. The network helps show where D. Badami may publish in the future.

Co-authors

The 25 scholars most cited alongside D. Badami, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with D. Badami Line = papers co-authored together D. Badami links everyone, so they are left out of the graph.

All Works

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11 of 11 papers shown

#	Work
1	Reliability challenges for copper interconnects Microelectronics Reliability ·Baozhen Li, Timothy D. Sullivan, Tom C. Lee, D. Badami	2003	204
2	Electromigration challenges for advanced on-chip Cu interconnects Microelectronics Reliability ·Baozhen Li, C. Christiansen, D. Badami, C.-C. Yang	2014	60
3	Critical ultra low-k TDDB reliability issues for advanced CMOS technologies F. Chen, M. Shinosky, B. Li, J. Gambino, S. Mongeon, P. Pokrinchak, J. Aitken, D. Badami, M. Angyal, Ravi Achanta, Griselda Bonilla, G. Yang, P. Liu, K. Li, J. Sudijono, Yue Tan, Tianwen Tang, Craig Child	2009	18
4	A robust reliability methodology for accurately predicting Bias Temperature Instability induced circuit performance degradation in HKMG CMOS Dimitris P. Ioannou, Kai Zhao, Aditya Bansal, B.P. Linder, R. Bolam, E. Cartier, J.-J. Kim, Rahul Rao, Giuseppe La Rosa, G.W. Massey, M. Hauser, Koushik K. Das, J. H. Stathis, J. Aitken, D. Badami, S. Mittl	2011	11
5	Stress voiding characteristics of Cu/low K interconnects under long term stresses Baozhen Li, D. Badami	2012	7
6	Short line electromigration characteristics and their applications for circuit design Baozhen Li, C. Christiansen, Chad Burke, Nicholas Hogle, D. Badami	2013	7
7	Reliability issues for silicon-on-insulator R. Bolam, G. Shahidi, F. Assaderaghi, Mukesh Khare, A. Mocuta, T. Hook, Ernest Y. Wu, E. Leobandung, Steven H. Voldman, D. Badami	2002	7
8	Layout dependence of gate dielectric TDDB in HKMG FinFET technology Wen Liu, Ernest Y. Wu, F Guarin, Charles Griffin, Roger Dufresne, D. Badami, M. Shinosky, David Brochu	2016	6
9	Correlation between I–V slope and TDDB voltage acceleration for Cu/low-k interconnects F. Chen, J. Gambino, M. Shinosky, B. Li, O. Bravo, M. Angyal, D. Badami, J. Aitken	2009	5
10	A case study of electromigration reliability: From design point to system operations Baozhen Li, Paul J. Müller, J. Warnock, L. Sigal, D. Badami	2015	3
11	Technology Reliability Qualification of a 65nm CMOS Cu/Low-k BEOL Interconnect F. Chen, B. Li, Tae‐Gon Lee, C. Christiansen, J. Gill, M. Angyal, M. Shinosky, Chad Burke, W. Hasting, R. Austin, T. Sullivan, D. Badami, J. Aitken	2006	2

About D. Badami

D. Badami is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Infectious Diseases, Organic Chemistry and Surgery, having authored 11 papers that have together received 330 indexed citations. Recurring topics across this work include Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (8 papers), Electronic Packaging and Soldering Technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers), Electrostatic Discharge in Electronics (1 paper), Ferroelectric and Negative Capacitance Devices (1 paper) and Electromagnetic Compatibility and Noise Suppression (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (206 citations), Electrical and Electronic Engineering (283 citations), Mechanics of Materials (52 citations), Hardware and Architecture (11 citations) and Materials Chemistry (64 citations). D. Badami has collaborated with scholars based in United States and Canada. Frequent co-authors include Baozhen Li, Timothy D. Sullivan, C. Christiansen, C.-C. Yang, Baozhen Li, M. Shinosky, J. Aitken, J. Gambino, M. Angyal and Aditya Bansal. Their work appears in journals such as Microelectronics Reliability.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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