D. Badami

519 total citations
11 papers, 330 citations indexed

About

D. Badami is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Infectious Diseases. According to data from OpenAlex, D. Badami has authored 11 papers receiving a total of 330 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 0 papers in Infectious Diseases. Recurrent topics in D. Badami's work include Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). D. Badami is often cited by papers focused on Semiconductor materials and devices (11 papers), Copper Interconnects and Reliability (8 papers) and Electronic Packaging and Soldering Technologies (5 papers). D. Badami collaborates with scholars based in United States and Canada. D. Badami's co-authors include Baozhen Li, Timothy D. Sullivan, C. Christiansen, C.-C. Yang, Baozhen Li, M. Shinosky, J. Aitken, J. Gambino, M. Angyal and Giuseppe La Rosa and has published in prestigious journals such as Microelectronics Reliability.

In The Last Decade

D. Badami

11 papers receiving 314 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
D. Badami United States	7	283	206	64	52	31	11	330
H. Rathore United States	7	323 1.1×	244 1.2×	43 0.7×	62 1.2×	46 1.5×	15	367
S. Luce United States	6	259 0.9×	146 0.7×	40 0.6×	43 0.8×	38 1.2×	11	300
Ennis T. Ogawa United States	10	303 1.1×	263 1.3×	49 0.8×	67 1.3×	27 0.9×	20	358
R. Schulz United States	7	296 1.0×	124 0.6×	29 0.5×	30 0.6×	29 0.9×	14	326
K. Motoyama United States	10	203 0.7×	156 0.8×	45 0.7×	27 0.5×	37 1.2×	36	246
Soon‐Cheon Seo United States	9	211 0.7×	142 0.7×	81 1.3×	91 1.8×	41 1.3×	17	269
N. Jourdan Belgium	11	309 1.1×	161 0.8×	51 0.8×	37 0.7×	75 2.4×	26	342
R. Khamankar United States	11	590 2.1×	87 0.4×	117 1.8×	26 0.5×	38 1.2×	34	629
David De Roest Belgium	9	297 1.0×	220 1.1×	53 0.8×	110 2.1×	24 0.8×	52	332
T. Standaert United States	14	426 1.5×	134 0.7×	56 0.9×	23 0.4×	58 1.9×	27	458

Countries citing papers authored by D. Badami

Since Specialization

Citations

This map shows the geographic impact of D. Badami's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D. Badami with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D. Badami more than expected).

Fields of papers citing papers by D. Badami

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by D. Badami. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D. Badami. The network helps show where D. Badami may publish in the future.

Co-authorship network of co-authors of D. Badami

This figure shows the co-authorship network connecting the top 25 collaborators of D. Badami. A scholar is included among the top collaborators of D. Badami based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with D. Badami. D. Badami is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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11 of 11 papers shown

1.

Liu, Wen, et al.. (2016). Layout dependence of gate dielectric TDDB in HKMG FinFET technology. 6 indexed citations

2.

Li, Baozhen, Paul J. Müller, J. Warnock, L. Sigal, & D. Badami. (2015). A case study of electromigration reliability: From design point to system operations. 2D.1.1–2D.1.6. 3 indexed citations

3.

Li, Baozhen, C. Christiansen, D. Badami, & C.-C. Yang. (2014). Electromigration challenges for advanced on-chip Cu interconnects. Microelectronics Reliability. 54(4). 712–724. 60 indexed citations

4.

Li, Baozhen, et al.. (2013). Short line electromigration characteristics and their applications for circuit design. 3F.2.1–3F.2.5. 7 indexed citations

5.

Li, Baozhen & D. Badami. (2012). Stress voiding characteristics of Cu/low K interconnects under long term stresses. 110. 5E.2.1–5E.2.6. 7 indexed citations

6.

Ioannou, Dimitris P., Kai Zhao, Aditya Bansal, et al.. (2011). A robust reliability methodology for accurately predicting Bias Temperature Instability induced circuit performance degradation in HKMG CMOS. CR.1.1–CR.1.4. 11 indexed citations

7.

Chen, F., M. Shinosky, J. Gambino, et al.. (2009). Critical ultra low-k TDDB reliability issues for advanced CMOS technologies. 464–475. 18 indexed citations

8.

Gambino, J., et al.. (2009). Correlation between I–V slope and TDDB voltage acceleration for Cu/low-k interconnects. 95. 182–184. 5 indexed citations

9.

Chen, F., Tae‐Gon Lee, C. Christiansen, et al.. (2006). Technology Reliability Qualification of a 65nm CMOS Cu/Low-k BEOL Interconnect. 97–105. 2 indexed citations

10.

Li, Baozhen, et al.. (2003). Reliability challenges for copper interconnects. Microelectronics Reliability. 44(3). 365–380. 204 indexed citations

11.

Bolam, R., G. Shahidi, F. Assaderaghi, et al.. (2002). Reliability issues for silicon-on-insulator. 131–134. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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