Nobutoshi Fujii

679 total citations
34 papers, 513 citations indexed

About

Nobutoshi Fujii is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Nobutoshi Fujii has authored 34 papers receiving a total of 513 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 20 papers in Electronic, Optical and Magnetic Materials and 14 papers in Materials Chemistry. Recurrent topics in Nobutoshi Fujii's work include Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (14 papers) and Mesoporous Materials and Catalysis (12 papers). Nobutoshi Fujii is often cited by papers focused on Copper Interconnects and Reliability (20 papers), Semiconductor materials and devices (14 papers) and Mesoporous Materials and Catalysis (12 papers). Nobutoshi Fujii collaborates with scholars based in Japan, Taiwan and India. Nobutoshi Fujii's co-authors include Takamaro Kikkawa, Hayato Iwamoto, Nobuhiro Hata, Yutaka Seino, Hirofumi Tanaka, Y. Kagawa, Takuichi Hirano, Yuka Kobayashi, Keiji Tatani and Seiji Nishi and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Thin Solid Films.

In The Last Decade

Nobutoshi Fujii

32 papers receiving 465 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Nobutoshi Fujii Japan 13 425 195 135 92 60 34 513
S. Kadomura Japan 11 499 1.2× 170 0.9× 75 0.6× 79 0.9× 68 1.1× 43 542
M. Fayolle France 13 356 0.8× 165 0.8× 214 1.6× 130 1.4× 64 1.1× 41 505
Riko I Made Singapore 13 399 0.9× 100 0.5× 127 0.9× 96 1.0× 31 0.5× 45 527
Bejoy N. Pushpakaran United States 11 622 1.5× 170 0.9× 158 1.2× 55 0.6× 37 0.6× 21 810
Toshihisa Nonaka Japan 9 331 0.8× 102 0.5× 264 2.0× 103 1.1× 15 0.3× 30 424
Jiahui Sun Hong Kong 13 594 1.4× 183 0.9× 116 0.9× 47 0.5× 19 0.3× 47 737
Kunikazu Izumi Japan 13 479 1.1× 97 0.5× 230 1.7× 88 1.0× 31 0.5× 46 619
W. Zhang Belgium 8 276 0.6× 104 0.5× 61 0.5× 68 0.7× 50 0.8× 14 354
James Spencer Lundh United States 14 261 0.6× 309 1.6× 499 3.7× 117 1.3× 59 1.0× 47 718
Akitsu Shigetou Japan 13 562 1.3× 141 0.7× 45 0.3× 172 1.9× 20 0.3× 54 638

Countries citing papers authored by Nobutoshi Fujii

Since Specialization
Citations

This map shows the geographic impact of Nobutoshi Fujii's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nobutoshi Fujii with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nobutoshi Fujii more than expected).

Fields of papers citing papers by Nobutoshi Fujii

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nobutoshi Fujii. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nobutoshi Fujii. The network helps show where Nobutoshi Fujii may publish in the future.

Co-authorship network of co-authors of Nobutoshi Fujii

This figure shows the co-authorship network connecting the top 25 collaborators of Nobutoshi Fujii. A scholar is included among the top collaborators of Nobutoshi Fujii based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nobutoshi Fujii. Nobutoshi Fujii is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fujii, Nobutoshi, et al.. (2023). Cu-Cu Wiring: The Novel Structure of Cu-Cu Hybrid Bonding. 103–108. 7 indexed citations
2.
Fujii, Nobutoshi, et al.. (2023). (Invited) Bonding Strength of Cu-Cu Hybrid Bonding for 3D Integration Process. ECS Transactions. 112(3). 3–14. 3 indexed citations
3.
Fujii, Nobutoshi, Kengo Kotoo, N. Ogawa, et al.. (2022). Behavior of Bonding Strength on Wafer-to-Wafer Cu-Cu Hybrid Bonding. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 591–594. 13 indexed citations
4.
Kagawa, Y., et al.. (2020). Impacts of Misalignment on 1μm Pitch Cu-Cu Hybrid Bonding. 148–150. 22 indexed citations
5.
Matsumoto, Ryusaku, Suguru Saito, Shigeaki Maruyama, et al.. (2019). High-definition Visible-SWIR InGaAs Image Sensor using Cu-Cu Bonding of III-V to Silicon Wafer. 16.7.1–16.7.4. 56 indexed citations
6.
Kagawa, Y., Nobutoshi Fujii, Yuka Kobayashi, et al.. (2018). An Advanced CuCu Hybrid Bonding For Novel Stacked CMOS Image Sensor. 65–67. 27 indexed citations
7.
Fujii, Nobutoshi, et al.. (2009). Integration of Self-Assembled Porous Silica in Low-k/Cu Damascene Interconnects. Japanese Journal of Applied Physics. 48(9). 95002–95002. 2 indexed citations
8.
Tanaka, Hirofumi, et al.. (2007). A Cu Electroplating Solution for Porous Low-k∕Cu Damascene Interconnects. Journal of The Electrochemical Society. 154(12). D692–D692. 1 indexed citations
9.
Ishikawa, Akira, T. Yamanishi, Nobuhiro Hata, et al.. (2007). Recovery Processes of CMP-Induced Damages for Copper/Porous Silica Damascene Interconnects. Journal of The Electrochemical Society. 154(5). H400–H400. 1 indexed citations
10.
Kurihara, Kazuaki, Tetsuo Ono, Hirofumi Tanaka, et al.. (2007). Carbon loss induced by plasma beam irradiation in porous silica films. Journal of Applied Physics. 101(11). 15 indexed citations
11.
Fujii, Nobutoshi, et al.. (2006). Influence of Cu Electroplating Solution on Self-Assembled Porous Silica Low-k Films. Journal of The Electrochemical Society. 153(9). G870–G870. 1 indexed citations
12.
Tanaka, Hirofumi, et al.. (2006). Novel organosiloxane vapor annealing process for improving properties of porous low-k films. Thin Solid Films. 515(12). 5019–5024. 28 indexed citations
13.
Ishikawa, Akira, T. Yamanishi, Nobuhiro Hata, et al.. (2006). Influence of CMP Chemicals on the Properties of Porous Silica Low-k Films. Journal of The Electrochemical Society. 153(7). G692–G692. 30 indexed citations
14.
Hata, Nobuhiro, et al.. (2006). Dependences of Young’s modulus of porous silica low dielectric constant films on skeletal structure and porosity. Journal of Applied Physics. 100(12). 18 indexed citations
15.
Kikkawa, Takamaro, Ryuta Yagi, Masahiko Shimoyama, et al.. (2006). Advanced scalable ultralow-k/cu interconnect technology for 32 nm CMOS ULSI using self-assembled porous silica and self-aligned CoWP barrier. 151. 92–95. 2 indexed citations
16.
Fujii, Nobutoshi, et al.. (2006). Effect of moisture adsorption on the properties of porous-silica ultralow-k films. Microelectronic Engineering. 83(11-12). 2126–2129. 33 indexed citations
17.
Hata, Nobuhiro, et al.. (2005). Skeletal silica characterization in porous-silica low-dielectric-constant films by infrared spectroscopic ellipsometry. Journal of Applied Physics. 97(11). 19 indexed citations
18.
Fujii, Nobutoshi, et al.. (2005). Fabrication of mesoporous silica for ultra-low-k interlayer dielectrics. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6002. 60020N–60020N. 3 indexed citations
19.
Yagi, Ryuta, Masahiko Shimoyama, Takashi Yoshino, et al.. (2005). Control of process-induced damages in self-assembled porous silica /Cu damascene interconnects for 45nm node and beyond. 812. 146–147. 2 indexed citations
20.
Fujii, Nobutoshi, Kazuhiro Yamada, Yoshiaki Oku, et al.. (2004). Comparative Studies of Ultra Low-κ Porous Silica Films with 2-D Hexagonal and Disordered Pore Structures. MRS Proceedings. 812. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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