John Knickerbocker

3.5k total citations · 1 hit paper
89 papers, 2.7k citations indexed

About

John Knickerbocker is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, John Knickerbocker has authored 89 papers receiving a total of 2.7k indexed citations (citations by other indexed papers that have themselves been cited), including 75 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 13 papers in Automotive Engineering. Recurrent topics in John Knickerbocker's work include 3D IC and TSV technologies (63 papers), Electronic Packaging and Soldering Technologies (39 papers) and Semiconductor materials and devices (12 papers). John Knickerbocker is often cited by papers focused on 3D IC and TSV technologies (63 papers), Electronic Packaging and Soldering Technologies (39 papers) and Semiconductor materials and devices (12 papers). John Knickerbocker collaborates with scholars based in United States, Japan and Switzerland. John Knickerbocker's co-authors include Cornelia Tsang, Paul Andry, R. Polastre, S. L. Wright, R. Horton, B. Dang, Bucknell C. Webb, C.S. Patel, E. Sprogis and Katsuyuki Sakuma and has published in prestigious journals such as Journal of the American Ceramic Society, IEEE Access and IEEE Journal of Solid-State Circuits.

In The Last Decade

John Knickerbocker

86 papers receiving 2.6k citations

Hit Papers

Three-dimensional silicon integration 2008 2026 2014 2020 2008 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. Three-dimensional silicon integration
    2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
John Knickerbocker United States 26 2.4k 453 392 267 188 89 2.7k
Cornelia Tsang United States 26 2.2k 0.9× 360 0.8× 377 1.0× 196 0.7× 167 0.9× 51 2.4k
Paul Andry United States 28 2.4k 1.0× 382 0.8× 405 1.0× 149 0.6× 182 1.0× 64 2.6k
R. Polastre United States 21 1.8k 0.8× 339 0.7× 286 0.7× 493 1.8× 139 0.7× 42 2.2k
Bucknell C. Webb United States 22 1.7k 0.7× 289 0.6× 262 0.7× 146 0.5× 293 1.6× 52 1.9k
Mitsumasa Koyanagi Japan 31 4.1k 1.7× 838 1.8× 484 1.2× 449 1.7× 376 2.0× 379 4.4k
Katsuyuki Sakuma Japan 20 1.8k 0.7× 383 0.8× 386 1.0× 150 0.6× 103 0.5× 82 1.9k
B. Dang United States 17 1.4k 0.6× 230 0.5× 250 0.6× 125 0.5× 112 0.6× 29 1.5k
Muhannad S. Bakir United States 28 2.4k 1.0× 555 1.2× 115 0.3× 962 3.6× 130 0.7× 254 3.1k
E. Sprogis United States 18 1.7k 0.7× 246 0.5× 267 0.7× 91 0.3× 153 0.8× 31 1.7k
Takafumi Fukushima Japan 28 3.0k 1.2× 813 1.8× 453 1.2× 606 2.3× 266 1.4× 349 3.5k

Countries citing papers authored by John Knickerbocker

Since Specialization
Citations

This map shows the geographic impact of John Knickerbocker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Knickerbocker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Knickerbocker more than expected).

Fields of papers citing papers by John Knickerbocker

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John Knickerbocker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Knickerbocker. The network helps show where John Knickerbocker may publish in the future.

Co-authorship network of co-authors of John Knickerbocker

This figure shows the co-authorship network connecting the top 25 collaborators of John Knickerbocker. A scholar is included among the top collaborators of John Knickerbocker based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John Knickerbocker. John Knickerbocker is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Sakuma, Katsuyuki, et al.. (2023). Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails. Micromachines. 15(1). 69–69. 1 indexed citations
2.
Matsumoto, Keiji, et al.. (2022). Thermal solution for Co-Packaged Optics (CPO) modules. 1–3.
3.
Sakuma, Katsuyuki, Michael Belyansky, Spyridon Skordas, et al.. (2022). Surface Energy Characterization for Die-Level Cu Hybrid Bonding. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 312–316. 12 indexed citations
4.
Chen, Qianwen, E. G. Colgan, Bing Dang, et al.. (2018). High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application. 1981–1986. 1 indexed citations
5.
6.
Parida, Pritish R., Arvind Sridhar, Mark Schultz, et al.. (2017). Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices. 130–138. 10 indexed citations
7.
Dang, Bing, Bucknell C. Webb, Cornelia Tsang, Paul Andry, & John Knickerbocker. (2014). Factors in the selection of temporary wafer handlers for 3D/2.5D integration. 576–581. 10 indexed citations
8.
Gu, Xiaoxiong, Bing Dang, Cornelia Tsang, et al.. (2011). High-density silicon carrier transmission line design for chip-to-chip interconnects. 27–30. 19 indexed citations
9.
Maria, Joana, B. Dang, S. L. Wright, et al.. (2011). 3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections. 268–273. 28 indexed citations
10.
Andry, Paul, et al.. (2011). Low-profile 3D silicon-on-silicon multi-chip assembly. 553–559. 6 indexed citations
11.
Sakuma, Katsuyuki, Sayuri Kohara, K. Matsumoto, et al.. (2010). IMC bonding for 3D interconnection. 864–871. 53 indexed citations
12.
Nakada, Kazuyoshi, et al.. (2010). Novel adhesive development for CMOS-compatible thin wafer handling. 1239–1244. 31 indexed citations
13.
Interrante, M. J., Paul Andry, B. Dang, et al.. (2009). Reliable through silicon vias for 3D silicon applications. 63–66. 8 indexed citations
14.
Knickerbocker, John. (2008). Preface. IBM Journal of Research and Development. 52(6). 539–540. 1 indexed citations
15.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). Die-to-Wafer 3D Integration Technology for High Yield and Throughput. 4 indexed citations
16.
Schow, Clint L., Fuad E. Doany, Cornelia Tsang, et al.. (2008). 300-Gb/s, 24-Channel Full-Duplex, 850-nm, CMOS-Based Optical Transceivers. 1–3. 16 indexed citations
17.
Sakuma, Katsuyuki, Paul Andry, Cornelia Tsang, et al.. (2008). 3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. IBM Journal of Research and Development. 52(6). 611–622. 126 indexed citations
18.
Doany, Fuad E., Clint L. Schow, Cornelia Tsang, et al.. (2008). 300-Gb/s 24-channel bidirectional Si carrier transceiver Optochip for board-level interconnects. 238–243. 27 indexed citations
19.
Sakuma, Katsuyuki, Paul Andry, B. Dang, et al.. (2007). 3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections. 627–632. 70 indexed citations
20.
Tummala, Rao, John Knickerbocker, Sarah H. Knickerbocker, et al.. (1992). High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. IBM Journal of Research and Development. 36(5). 889–904. 25 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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