R. Goldblatt

743 total citations
15 papers, 359 citations indexed

About

R. Goldblatt is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, R. Goldblatt has authored 15 papers receiving a total of 359 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 5 papers in Materials Chemistry. Recurrent topics in R. Goldblatt's work include Copper Interconnects and Reliability (6 papers), 3D IC and TSV technologies (4 papers) and Silicone and Siloxane Chemistry (4 papers). R. Goldblatt is often cited by papers focused on Copper Interconnects and Reliability (6 papers), 3D IC and TSV technologies (4 papers) and Silicone and Siloxane Chemistry (4 papers). R. Goldblatt collaborates with scholars based in United States. R. Goldblatt's co-authors include J. Heidenreich, L.T. Su, R. Schulz, D. Edelstein, R. Wachnik, N. Lustig, Cyprian Uzoh, S. Luce, A. Simon and John Dukovic and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Electron Devices and Journal of Applied Polymer Science.

In The Last Decade

R. Goldblatt

14 papers receiving 339 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
R. Goldblatt United States 8 278 135 65 53 50 15 359
M. Angyal United States 10 379 1.4× 238 1.8× 72 1.1× 44 0.8× 81 1.6× 28 456
Thierry Mourier France 9 359 1.3× 112 0.8× 50 0.8× 29 0.5× 94 1.9× 49 405
H. Shobha United States 12 332 1.2× 226 1.7× 79 1.2× 66 1.2× 56 1.1× 51 379
Gayle Murdoch Belgium 11 296 1.1× 131 1.0× 69 1.1× 34 0.6× 40 0.8× 39 346
C. Huffman United States 14 502 1.8× 66 0.5× 203 3.1× 43 0.8× 66 1.3× 38 581
Christopher Jezewski United States 13 344 1.2× 145 1.1× 219 3.4× 56 1.1× 40 0.8× 28 432
Ahila Krishnamoorthy Singapore 15 597 2.1× 462 3.4× 79 1.2× 86 1.6× 63 1.3× 41 641
M. Fayolle France 13 356 1.3× 165 1.2× 214 3.3× 64 1.2× 130 2.6× 41 505
Cory S. Wajda United States 11 385 1.4× 81 0.6× 172 2.6× 32 0.6× 39 0.8× 46 419
Kiichiro Mukai Japan 8 311 1.1× 93 0.7× 109 1.7× 48 0.9× 19 0.4× 20 348

Countries citing papers authored by R. Goldblatt

Since Specialization
Citations

This map shows the geographic impact of R. Goldblatt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Goldblatt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Goldblatt more than expected).

Fields of papers citing papers by R. Goldblatt

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by R. Goldblatt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Goldblatt. The network helps show where R. Goldblatt may publish in the future.

Co-authorship network of co-authors of R. Goldblatt

This figure shows the co-authorship network connecting the top 25 collaborators of R. Goldblatt. A scholar is included among the top collaborators of R. Goldblatt based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Goldblatt. R. Goldblatt is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

15 of 15 papers shown
1.
2.
Edelstein, D., J. Heidenreich, R. Goldblatt, et al.. (2002). Full copper wiring in a sub-0.25 μm CMOS ULSI technology. 773–776. 196 indexed citations
3.
Heidenreich, J., D. Edelstein, R. Goldblatt, et al.. (2002). Copper dual damascene wiring for sub-0.25 μm CMOS technology. 11. 151–153. 3 indexed citations
4.
Ivers, T., P. McLaughlin, Alasdair McDonald, et al.. (2002). Integration of copper and fluorosilicate glass for 0.18 μm interconnections. 219–221.
5.
6.
Bialas, Jörg, B. Davari, Raymond E. Floyd, et al.. (1998). A 480-MHz RISC microprocessor in a 0.12-μm L/sub eff/ CMOS technology with copper interconnects. IEEE Journal of Solid-State Circuits. 33(11). 1609–1616. 51 indexed citations
7.
Chou, N. J., A. D. Marwick, R. Goldblatt, et al.. (1992). An isotope approach to characterization of microwave water plasma modified polyimide surfaces. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 10(1). 248–253. 5 indexed citations
8.
Goldblatt, R., S. Nunes, N. J. Chou, et al.. (1992). Characterization of water vapor plasma‐modified polyimide. Journal of Applied Polymer Science. 46(12). 2189–2202. 21 indexed citations
9.
Eldridge, Benjamin N., L.P. Buchwalter, Catherine A. Chess, et al.. (1992). A time-of-flight static secondary ion mass spectrometry and X-ray photoelectron spectroscopy study of 3-aminopropyltrihydroxysilane on water plasma treated chromium and silicon surfaces. Journal of Adhesion Science and Technology. 6(1). 109–125. 10 indexed citations
10.
Goldblatt, R., Jae Myung Park, Robert C. White, et al.. (1989). Photochemical surface modification of poly(ethylene terephthalate). Journal of Applied Polymer Science. 37(2). 335–347. 12 indexed citations
11.
Tong, Hua-Ching, et al.. (1989). Ceramic packages for liquid-nitrogen operation. IEEE Transactions on Electron Devices. 36(8). 1521–1527. 4 indexed citations
12.
Goldblatt, R., G. Scilla, Jae Myung Park, Julian F. Johnson, & Samuel J. Huang. (1988). Surface composition of polystyrene. Journal of Applied Polymer Science. 35(8). 2075–2084. 4 indexed citations
13.
Chou, N. J., et al.. (1987). X-ray photoelectron and infrared spectroscopy of microwave plasma etched polyimide surfaces. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 5(4). 1321–1326. 16 indexed citations
14.
Goldblatt, R., et al.. (1987). Gold/fluorocarbon adhesion. Journal of Adhesion Science and Technology. 1(1). 239–242. 5 indexed citations
15.
Chou, N. J., et al.. (1986). Mechanism of microwave plasma etching of polyimides in O2 and CF4 gas mixtures. Microelectronic Engineering. 5(1-4). 375–386. 20 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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