R. Goldblatt
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Materials Chemistry
- Mechanics of Materials
- Biomedical Engineering
- Topics
- Copper Interconnects and Reliability (6 papers)3D IC and TSV technologies (4 papers)Silicone and Siloxane Chemistry (4 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringHardware and Architecture
- Journals
- IEEE Journal of Solid-State CircuitsIEEE Transactions on Electron DevicesJournal of Applied Polymer Science
- Partner nations
- United States
In The Last Decade
R. Goldblatt
14 papers receiving 339 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 278
- Electronic, Optical and Magnetic Materials 135
- Materials Chemistry 65
- Mechanics of Materials 53
- Biomedical Engineering 50
Countries citing papers authored by R. Goldblatt
This map shows the geographic impact of R. Goldblatt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R. Goldblatt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R. Goldblatt more than expected).
Fields of papers citing papers by R. Goldblatt
This network shows the impact of papers produced by R. Goldblatt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R. Goldblatt. The network helps show where R. Goldblatt may publish in the future.
Co-authorship network of co-authors of R. Goldblatt
This figure shows the co-authorship network connecting the top 25 collaborators of R. Goldblatt. A scholar is included among the top collaborators of R. Goldblatt based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with R. Goldblatt. R. Goldblatt is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 196 | |
| 3 | 3 | |
| 4 | 0 | |
| 5 | 10 | |
| 6 | 51 | |
| 7 | 5 | |
| 8 | 21 | |
| 9 | 10 | |
| 10 | 12 | |
| 11 | 4 | |
| 12 | 4 | |
| 13 | 16 | |
| 14 | 5 | |
| 15 | 20 |
About R. Goldblatt
R. Goldblatt is a scholar working on Electronic, Optical and Magnetic Materials, General Materials Science and Surfaces, Coatings and Films, having authored 15 papers that have together received 359 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (6 papers), 3D IC and TSV technologies (4 papers) and Silicone and Siloxane Chemistry (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (135 citations), Electrical and Electronic Engineering (278 citations) and Hardware and Architecture (22 citations). R. Goldblatt has collaborated with scholars based in United States. Frequent co-authors include J. Heidenreich, L.T. Su, R. Schulz, D. Edelstein, R. Wachnik, N. Lustig, Cyprian Uzoh, S. Luce, A. Simon and John Dukovic. Their work appears in journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Electron Devices and Journal of Applied Polymer Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.