M. J. Interrante

618 total citations · 1 hit paper
7 papers, 487 citations indexed

About

M. J. Interrante is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, M. J. Interrante has authored 7 papers receiving a total of 487 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 2 papers in Automotive Engineering and 1 paper in Atomic and Molecular Physics, and Optics. Recurrent topics in M. J. Interrante's work include 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Semiconductor materials and devices (2 papers). M. J. Interrante is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers) and Semiconductor materials and devices (2 papers). M. J. Interrante collaborates with scholars based in United States, Japan and Canada. M. J. Interrante's co-authors include Katsuyuki Sakuma, John Knickerbocker, R. Horton, S. L. Wright, E. Sprogis, R. Polastre, C.S. Patel, B. Dang, Bucknell C. Webb and Paul Andry and has published in prestigious journals such as IBM Journal of Research and Development.

In The Last Decade

M. J. Interrante

7 papers receiving 470 citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Three-dimensional silicon integration

2008 396 citations John Knickerbocker, Paul Andry et al. IBM Journal of Research and Development profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M. J. Interrante United States	6	463	77	71	52	47	7	487
R. Yu United States	6	370 0.8×	47 0.6×	88 1.2×	59 1.1×	61 1.3×	10	403
S. Chéramy France	14	490 1.1×	104 1.4×	71 1.0×	41 0.8×	20 0.4×	61	522
Kwang-Yoo Byun South Korea	8	711 1.5×	61 0.8×	84 1.2×	64 1.2×	78 1.7×	18	736
J. Van Olmen Belgium	11	478 1.0×	38 0.5×	113 1.6×	87 1.7×	62 1.3×	31	499
Scott Pozder United States	14	580 1.3×	102 1.3×	51 0.7×	71 1.4×	26 0.6×	25	607
Masahiro Sunohara Japan	12	550 1.2×	83 1.1×	141 2.0×	33 0.6×	27 0.6×	18	578
Tapobrata Bandyopadhyay United States	11	753 1.6×	71 0.9×	137 1.9×	65 1.3×	33 0.7×	12	791
Min-Suk Suh South Korea	9	684 1.5×	43 0.6×	57 0.8×	47 0.9×	81 1.7×	20	709
Lieve Bogaerts Belgium	8	291 0.6×	50 0.6×	46 0.6×	28 0.5×	33 0.7×	21	306
A. Sharma United States	6	327 0.7×	47 0.6×	46 0.6×	29 0.6×	33 0.7×	8	362

Countries citing papers authored by M. J. Interrante

Since Specialization

Citations

This map shows the geographic impact of M. J. Interrante's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. J. Interrante with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. J. Interrante more than expected).

Fields of papers citing papers by M. J. Interrante

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. J. Interrante. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. J. Interrante. The network helps show where M. J. Interrante may publish in the future.

Co-authorship network of co-authors of M. J. Interrante

This figure shows the co-authorship network connecting the top 25 collaborators of M. J. Interrante. A scholar is included among the top collaborators of M. J. Interrante based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. J. Interrante. M. J. Interrante is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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7 of 7 papers shown

1.

Sakuma, Katsuyuki, M. J. Interrante, M. Angyal, et al.. (2015). An enhanced thermo-compression bonding process to address warpage in 3D integration of large die on organic substrates. 318–324. 25 indexed citations

2.

Sakuma, Katsuyuki, et al.. (2013). Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates. 667–673. 6 indexed citations

3.

Interrante, M. J., Paul Andry, B. Dang, et al.. (2009). Reliable through silicon vias for 3D silicon applications. 63–66. 8 indexed citations

4.

Knickerbocker, John, Paul Andry, B. Dang, et al.. (2008). Three-dimensional silicon integration. IBM Journal of Research and Development. 52(6). 553–569. 396 indexed citations breakdown →

5.

Dang, B., S. L. Wright, Paul Andry, et al.. (2008). 3D chip stacking with C4 technology. IBM Journal of Research and Development. 52(6). 599–609. 39 indexed citations

6.

Interrante, M. J., et al.. (2004). Lead-free package interconnections for ceramic grid arrays. 85–92. 10 indexed citations

7.

Ray, Sumit Kumar, K. Seshan, & M. J. Interrante. (2002). Engineering change (EC) technology for thin film metallurgy on polyimide films. 395–400. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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