M. J. Interrante
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- 3D IC and TSV technologies 7
- Electronic Packaging and Soldering Technologies 4
- Semiconductor materials and devices 2
- Electromagnetic Compatibility and Noise Suppression 1
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 2
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- Nanofabrication and Lithography Techniques 1
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- Manufacturing Process and Optimization 1
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- Semiconductor materials and interfaces 1
- Co-authors
- Katsuyuki SakumaJohn KnickerbockerR. HortonCornelia TsangS. L. WrightPaul AndryB. DangC.S. Patel
- Partner nations
- United StatesJapanCanada
In The Last Decade
M. J. Interrante
7 papers receiving 470 citations
Hit Papers
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 463
- Automotive Engineering 77
- Hardware and Architecture 27
- Electronic, Optical and Magnetic Materials 52
- Biomedical Engineering 71
Countries citing papers authored by M. J. Interrante
This map shows the geographic impact of M. J. Interrante's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. J. Interrante with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. J. Interrante more than expected).
Fields of papers citing papers by M. J. Interrante
This network shows the impact of papers produced by M. J. Interrante. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. J. Interrante. The network helps show where M. J. Interrante may publish in the future.
Co-authorship network
The 25 scholars most cited alongside M. J. Interrante, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 25 | |
| 2 | 2013 | 6 | |
| 3 | 2009 | 8 | |
| 4 | Three-dimensional silicon integrationbreakdown → | 2008 | 396 |
| 5 | 2008 | 39 | |
| 6 | 2004 | 10 | |
| 7 | 2002 | 3 |
About M. J. Interrante
M. J. Interrante is a scholar working on Ceramics and Composites, Automotive Engineering and Electrical and Electronic Engineering, having authored 7 papers that have together received 487 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (4 papers), Semiconductor materials and devices (2 papers), Additive Manufacturing and 3D Printing Technologies (2 papers), Nanofabrication and Lithography Techniques (1 paper), Manufacturing Process and Optimization (1 paper), Electromagnetic Compatibility and Noise Suppression (1 paper) and Semiconductor materials and interfaces (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (463 citations), Automotive Engineering (77 citations) and Hardware and Architecture (27 citations). M. J. Interrante has collaborated with scholars based in United States, Japan and Canada. Frequent co-authors include Katsuyuki Sakuma, John Knickerbocker, R. Horton, Cornelia Tsang, S. L. Wright, Paul Andry, B. Dang, C.S. Patel, R. Polastre and E. Sprogis. Their work appears in journals such as IBM Journal of Research and Development.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.