Ahila Krishnamoorthy

842 total citations
41 papers, 641 citations indexed

About

Ahila Krishnamoorthy is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Ahila Krishnamoorthy has authored 41 papers receiving a total of 641 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 37 papers in Electronic, Optical and Magnetic Materials and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Ahila Krishnamoorthy's work include Copper Interconnects and Reliability (37 papers), Semiconductor materials and devices (32 papers) and Electronic Packaging and Soldering Technologies (17 papers). Ahila Krishnamoorthy is often cited by papers focused on Copper Interconnects and Reliability (37 papers), Semiconductor materials and devices (32 papers) and Electronic Packaging and Soldering Technologies (17 papers). Ahila Krishnamoorthy collaborates with scholars based in Singapore, United States and Italy. Ahila Krishnamoorthy's co-authors include Subodh G. Mhaisalkar, A. V. Vairagar, Won Jong Yoo, Ehrenfried Zschech, Ganpati Ramanath, S. P. Murarka, Qiang Guo, Andriy Gusak, Moritz Andreas Meyer and K. N. Tu and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and IEEE Transactions on Electron Devices.

In The Last Decade

Ahila Krishnamoorthy

37 papers receiving 609 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ahila Krishnamoorthy Singapore 15 597 462 86 82 79 41 641
M. Angyal United States 10 379 0.6× 238 0.5× 44 0.5× 64 0.8× 72 0.9× 28 456
Chen Wu Belgium 11 391 0.7× 290 0.6× 73 0.8× 79 1.0× 93 1.2× 37 460
T. Spooner United States 13 412 0.7× 312 0.7× 76 0.9× 109 1.3× 83 1.1× 49 472
S. Kadomura Japan 11 499 0.8× 170 0.4× 68 0.8× 34 0.4× 75 0.9× 43 542
Alvin L. S. Loke United States 14 625 1.0× 350 0.8× 102 1.2× 65 0.8× 129 1.6× 38 680
Mong-Song Liang Taiwan 16 641 1.1× 220 0.5× 152 1.8× 78 1.0× 162 2.1× 51 715
Chien Chiang United States 8 280 0.5× 253 0.5× 127 1.5× 63 0.8× 78 1.0× 21 383
D. Canaperi United States 13 599 1.0× 235 0.5× 70 0.8× 116 1.4× 85 1.1× 45 677
R. Goldblatt United States 8 278 0.5× 135 0.3× 53 0.6× 28 0.3× 65 0.8× 15 359
Thierry Mourier France 9 359 0.6× 112 0.2× 29 0.3× 41 0.5× 50 0.6× 49 405

Countries citing papers authored by Ahila Krishnamoorthy

Since Specialization
Citations

This map shows the geographic impact of Ahila Krishnamoorthy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ahila Krishnamoorthy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ahila Krishnamoorthy more than expected).

Fields of papers citing papers by Ahila Krishnamoorthy

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ahila Krishnamoorthy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ahila Krishnamoorthy. The network helps show where Ahila Krishnamoorthy may publish in the future.

Co-authorship network of co-authors of Ahila Krishnamoorthy

This figure shows the co-authorship network connecting the top 25 collaborators of Ahila Krishnamoorthy. A scholar is included among the top collaborators of Ahila Krishnamoorthy based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ahila Krishnamoorthy. Ahila Krishnamoorthy is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Krishnamoorthy, Ahila, et al.. (2014). Reliability characterization of organic ultra low k film using ramp voltage breakdown. National University of Singapore.
2.
George, Simi, Patrick Naulleau, Ahila Krishnamoorthy, et al.. (2010). Characterization of line-edge roughness (LER) propagation from resists: underlayer interfaces in ultrathin resist films. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7636. 763605–763605. 14 indexed citations
3.
Krishnamoorthy, Ahila, et al.. (2009). Performance properties in thick film silicate dielectric layers using molecular modeling. Microelectronics Reliability. 49(8). 877–883. 1 indexed citations
4.
Krishnamoorthy, Ahila, et al.. (2007). Planarization Materials for Active Matrix Thin Film Transistor Arrays. MRS Proceedings. 1030. 1 indexed citations
5.
Drost, Robert, C. J. Forrest, B.M. Guenin, et al.. (2006). Challenges in Building a Flat-Bandwidth Memory Hierarchy for a Large-Scale Computer with Proximity Communication. 9. 13–22. 27 indexed citations
6.
Chen, Jinghong, et al.. (2006). 65.2: Spin‐On Polymers for TFT Gate Dielectric Application and Planarization of Stainless Steel. SID Symposium Digest of Technical Papers. 37(1). 1878–1881. 4 indexed citations
7.
Vairagar, A. V., Subodh G. Mhaisalkar, Michael Meyer, et al.. (2005). Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures. Applied Physics Letters. 87(8). 24 indexed citations
8.
Yan, Minyu, K. N. Tu, A. V. Vairagar, Subodh G. Mhaisalkar, & Ahila Krishnamoorthy. (2005). Confinement of electromigration induced void propagation in Cu interconnect by a buried Ta diffusion barrier layer. Applied Physics Letters. 87(26). 9 indexed citations
9.
Zschech, Ehrenfried, Michael Meyer, Subodh G. Mhaisalkar, et al.. (2005). Effect of interface modification on EM-induced degradation mechanisms in copper interconnects. Thin Solid Films. 504(1-2). 279–283. 20 indexed citations
10.
Yan, Minyu, Jong-ook Suh, Fei Ren, et al.. (2005). Effect of Cu3Sn coatings on electromigration lifetime improvement of Cu dual-damascene interconnects. Applied Physics Letters. 87(21). 22 indexed citations
11.
Yoo, Won Jong, et al.. (2005). Effect of electric field on chemical bonds of carbon-doped silicon oxide as evidenced by in situ Fourier transform infrared spectroscopy. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 23(2). 433–436. 4 indexed citations
12.
Krishnamoorthy, Ahila, et al.. (2004). SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects. Microelectronics Reliability. 45(3-4). 507–516. 1 indexed citations
13.
Vairagar, A. V., Subodh G. Mhaisalkar, & Ahila Krishnamoorthy. (2004). Electromigration behavior of dual-damascene Cu interconnects––Structure, width, and length dependences. Microelectronics Reliability. 44(5). 747–754. 61 indexed citations
14.
Guo, Qiang, et al.. (2004). Study of leakage mechanisms of the copper/Black Diamond™ damascene process. Thin Solid Films. 462-463. 330–333. 10 indexed citations
15.
Yoo, Won Jong, et al.. (2004). Reliability improvement using buried capping layer in advanced interconnects. 333–337. 7 indexed citations
16.
Shao, Wei, A. V. Vairagar, Chih-Hang Tung, et al.. (2004). Electromigration in copper damascene interconnects: reservoir effects and failure analysis. Surface and Coatings Technology. 198(1-3). 257–261. 21 indexed citations
17.
Vairagar, A. V., Subodh G. Mhaisalkar, Ahila Krishnamoorthy, et al.. (2004). In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures. Applied Physics Letters. 85(13). 2502–2504. 82 indexed citations
18.
Tsang, C.F., C.Y. Li, Ahila Krishnamoorthy, et al.. (2004). Impact of barrier deposition process on electrical and reliability performance of Cu/CVD low k SiOCH metallization. Microelectronics Journal. 35(9). 693–700. 1 indexed citations
19.
Krishnamoorthy, Ahila, et al.. (2003). Assessment of Reliability of cap layers used in Cu-Black DiamondTM Interconnects. MRS Proceedings. 766.
20.
Krishnamoorthy, Ahila, Vladimir Bliznetsov, Huay Ling Tay, & Bo Yu. (2002). Effect of Etching Process Deviations and Photoresist Stripping on Contact Yield of Copper Dual Damascene Metallization. Journal of The Electrochemical Society. 149(12). G656–G656. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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