Patrick Leduc

677 total citations
21 papers, 269 citations indexed

About

Patrick Leduc is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Patrick Leduc has authored 21 papers receiving a total of 269 indexed citations (citations by other indexed papers that have themselves been cited), including 14 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 6 papers in Biomedical Engineering. Recurrent topics in Patrick Leduc's work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (10 papers) and Copper Interconnects and Reliability (6 papers). Patrick Leduc is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (10 papers) and Copper Interconnects and Reliability (6 papers). Patrick Leduc collaborates with scholars based in France, Switzerland and United States. Patrick Leduc's co-authors include L. Di Cioccio, N. Sillon, Christophe Guérin, Rémi Galland, David Peyrade, Manuel Théry, Laurent Blanchoin, S. Maı̂trejean, G. Passemard and Marc Zussy and has published in prestigious journals such as Nature Materials, Proceedings of the IEEE and Journal of materials research/Pratt's guide to venture capital sources.

In The Last Decade

Patrick Leduc

20 papers receiving 260 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Patrick Leduc France	8	208	59	54	32	28	21	269
Rob Hendriks Netherlands	9	254 1.2×	25 0.4×	105 1.9×	18 0.6×	50 1.8×	24	324
Junsun Park South Korea	6	240 1.2×	21 0.4×	90 1.7×	5 0.2×	28 1.0×	13	329
Sungbong Kim South Korea	8	236 1.1×	20 0.3×	80 1.5×	18 0.6×	16 0.6×	17	309
Ting-Yen Chiang United States	8	292 1.4×	29 0.5×	21 0.4×	52 1.6×	51 1.8×	11	317
Aurélie Thuaire France	11	289 1.4×	27 0.5×	130 2.4×	63 2.0×	36 1.3×	27	403
Zhihao Wang China	9	176 0.8×	63 1.1×	113 2.1×	23 0.7×	22 0.8×	24	307
G. Beer Germany	8	339 1.6×	29 0.5×	57 1.1×	29 0.9×	4 0.1×	20	394
Christine Arndt Germany	9	158 0.8×	8 0.1×	164 3.0×	52 1.6×	50 1.8×	15	389
C. Chappaz France	7	275 1.3×	37 0.6×	43 0.8×	99 3.1×	25 0.9×	17	301
Soo-Won Kim South Korea	9	292 1.4×	17 0.3×	134 2.5×	74 2.3×	164 5.9×	30	398

Countries citing papers authored by Patrick Leduc

Since Specialization

Citations

This map shows the geographic impact of Patrick Leduc's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Patrick Leduc with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Patrick Leduc more than expected).

Fields of papers citing papers by Patrick Leduc

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Patrick Leduc. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Patrick Leduc. The network helps show where Patrick Leduc may publish in the future.

Co-authorship network of co-authors of Patrick Leduc

This figure shows the co-authorship network connecting the top 25 collaborators of Patrick Leduc. A scholar is included among the top collaborators of Patrick Leduc based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Patrick Leduc. Patrick Leduc is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Vu, Hai Canh, et al.. (2023). Ensemble Learning for Multi-Label Classification with Unbalanced Classes: A Case Study of a Curing Oven in Glass Wool Production. Mathematics. 11(22). 4602–4602. 2 indexed citations

Vu, Hai Canh, et al.. (2021). An Overview of Machine Health Management in Industry 4.0. Proceedings of the 31st European Safety and Reliability Conference (ESREL 2021). 433–440. 1 indexed citations

Leduc, Patrick, et al.. (2013). Panel: "will 3D-IC remain a technology of the future... even in the future?". Design, Automation, and Test in Europe. 1526–1530. 1 indexed citations

Galland, Rémi, Patrick Leduc, Christophe Guérin, et al.. (2013). Fabrication of three-dimensional electrical connections by means of directed actin self-organization. Nature Materials. 12(5). 416–421. 51 indexed citations

Leduc, Patrick, et al.. (2013). PANEL: Will 3D-IC Remain a Technology of the Future Even in the Future. Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013. 1526–1530.

Crécy, F. de, Vincent Fiori, A. Farcy, et al.. (2012). Thermal behavior of stack-based 3D ICs. 1–6. 4 indexed citations

Fuchs, C., Patrick Leduc, Aurélie Thuaire, et al.. (2010). Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking. ECS Transactions. 33(12). 1–21. 9 indexed citations

Ong, Markus D., et al.. (2010). Solution chemistry effects on cracking and damage evolution during chemical-mechanical planarization. Journal of materials research/Pratt's guide to venture capital sources. 25(10). 1904–1909. 2 indexed citations

Assous, M., Patrick Leduc, Aurélie Thuaire, et al.. (2010). A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. 1–4. 3 indexed citations

10.

Cioccio, L. Di, Pierric Gueguen, Thomas Signamarcheix, et al.. (2009). Enabling 3D interconnects with metal direct bonding. 152–154. 6 indexed citations

11.

Cioccio, L. Di, et al.. (2009). 3D Integration Technology Activities at CEA-LETI Minatec. ECS Meeting Abstracts. MA2009-02(26). 2173–2173. 1 indexed citations

12.

Gueguen, Pierric, L. Di Cioccio, H. Moriceau, et al.. (2009). Physics of direct bonding: Applications to 3D heterogeneous or monolithic integration. Microelectronic Engineering. 87(3). 477–484. 37 indexed citations

13.

Leduc, Patrick, M. Assous, L. Di Cioccio, et al.. (2009). First integration of Cu TSV using die-to-wafer direct bonding and planarization. 1–5. 20 indexed citations

14.

Cioccio, L. Di, Pierric Gueguen, R. Taïbi, et al.. (2009). An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 1–4. 16 indexed citations

15.

Leduc, Patrick, M. Assous, D. Bouchu, et al.. (2008). The Effect of Process Parameters on Electrical Properties of High Density Through-Si Vias. 2 indexed citations

16.

Cioccio, L. Di, et al.. (2008). 3D Integration : a technological toolbox. 375–378. 7 indexed citations

17.

Charlet, Barbara, L. Di Cioccio, & Patrick Leduc. (2007). Enabling technologies for 3D System on Chip (SoC) integration and examples of 3D integrated structures. 1–1. 1 indexed citations

18.

Leduc, Patrick, N. Sillon, S. Maı̂trejean, et al.. (2007). Challenges for 3D IC integration: bonding quality and thermal management. 210–212. 69 indexed citations

19.

Leduc, Patrick, et al.. (2006). CMP-induced Peeling in Multi-level Ultra Low-k / Cu Interconnects. MRS Proceedings. 914. 1 indexed citations

20.

Leduc, Patrick, et al.. (2006). Dependence of CMP-induced delamination on number of low-k dielectric films stacked. Microelectronic Engineering. 83(11-12). 2072–2076. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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