N. Sillon

1.5k total citations
71 papers, 968 citations indexed

About

N. Sillon is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, N. Sillon has authored 71 papers receiving a total of 968 indexed citations (citations by other indexed papers that have themselves been cited), including 71 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 12 papers in Automotive Engineering. Recurrent topics in N. Sillon's work include 3D IC and TSV technologies (62 papers), Electronic Packaging and Soldering Technologies (48 papers) and Additive Manufacturing and 3D Printing Technologies (12 papers). N. Sillon is often cited by papers focused on 3D IC and TSV technologies (62 papers), Electronic Packaging and Soldering Technologies (48 papers) and Additive Manufacturing and 3D Printing Technologies (12 papers). N. Sillon collaborates with scholars based in France, Switzerland and United States. N. Sillon's co-authors include David Henry, R. Baptist, V. Lapras, Jean Charbonnier, J.J. Brun, S. Chéramy, C. Gillot, Xavier Baillin, S. Moreau and A. Jouve and has published in prestigious journals such as Proceedings of the IEEE, Sensors and Actuators B Chemical and Sensors and Actuators A Physical.

In The Last Decade

N. Sillon

71 papers receiving 915 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
N. Sillon France 19 895 234 179 59 57 71 968
Ritwik Chatterjee United States 16 909 1.0× 108 0.5× 145 0.8× 51 0.9× 39 0.7× 31 952
Armin Klumpp Germany 17 714 0.8× 162 0.7× 114 0.6× 38 0.6× 57 1.0× 44 781
Dimitrios Velenis Belgium 15 789 0.9× 133 0.6× 99 0.6× 60 1.0× 18 0.3× 86 836
Guruprasad Katti Belgium 13 1.0k 1.2× 140 0.6× 90 0.5× 105 1.8× 39 0.7× 27 1.1k
S.E. Steen United States 11 825 0.9× 151 0.6× 56 0.3× 163 2.8× 32 0.6× 30 921
D.W. Berning United States 23 1.5k 1.6× 176 0.8× 33 0.2× 155 2.6× 144 2.5× 73 1.6k
Douglas Charles La Tulipe United States 8 656 0.7× 106 0.5× 77 0.4× 55 0.9× 29 0.5× 18 718
C.K. Chen United States 10 525 0.6× 70 0.3× 56 0.3× 111 1.9× 14 0.2× 25 560
Kai-Ming Yang Taiwan 20 1.2k 1.3× 246 1.1× 25 0.1× 462 7.8× 63 1.1× 77 1.4k
L.W. Schaper United States 15 563 0.6× 117 0.5× 43 0.2× 57 1.0× 62 1.1× 64 669

Countries citing papers authored by N. Sillon

Since Specialization
Citations

This map shows the geographic impact of N. Sillon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Sillon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Sillon more than expected).

Fields of papers citing papers by N. Sillon

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Sillon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Sillon. The network helps show where N. Sillon may publish in the future.

Co-authorship network of co-authors of N. Sillon

This figure shows the co-authorship network connecting the top 25 collaborators of N. Sillon. A scholar is included among the top collaborators of N. Sillon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Sillon. N. Sillon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lacrevaz, T., A. Farcy, Philip R. LeDuc, et al.. (2014). RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits. Microelectronic Engineering. 130. 74–81. 3 indexed citations
2.
3.
Moreau, S., et al.. (2011). Reliability study of 3D-WLP through silicon via with innovative polymer filling integration. 567–572. 19 indexed citations
4.
Garnier, Arnaud, et al.. (2011). Gold-tin bonding for 200mm wafer level hermetic MEMS packaging. 9. 1610–1615. 8 indexed citations
5.
Parès, G., N. Bresson, S. Minoret, et al.. (2011). Through Silicon Via technology using tungsten metallization. 1–4. 23 indexed citations
6.
Parès, G., F. de Crécy, S. Moreau, et al.. (2011). ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY. IMAPSource Proceedings. 2011(1). 388–399. 2 indexed citations
7.
Gillot, C., Patrice Rey, Denis Mercier, et al.. (2010). Hermetic wafer-level packaging development for RF MEMS switch. 1–6. 14 indexed citations
8.
Pouydebasque, A., S. Moreau, Christophe Bouvier, et al.. (2010). Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers. Procedia Engineering. 5. 432–435. 4 indexed citations
9.
Ancey, P., Jean Charbonnier, S. Chéramy, et al.. (2010). TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration. 1–4. 4 indexed citations
10.
Fuchs, C., Patrick Leduc, Aurélie Thuaire, et al.. (2010). Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking. ECS Transactions. 33(12). 1–21. 9 indexed citations
11.
Gillot, C., et al.. (2010). Low cost Thin Film packaging for MEMS over molded. 1–4. 3 indexed citations
12.
Cioccio, L. Di, et al.. (2009). 3D Integration Technology Activities at CEA-LETI Minatec. ECS Meeting Abstracts. MA2009-02(26). 2173–2173. 1 indexed citations
13.
Leduc, Patrick, M. Assous, D. Bouchu, et al.. (2008). The Effect of Process Parameters on Electrical Properties of High Density Through-Si Vias. 2 indexed citations
14.
Charbonnier, Jean, et al.. (2008). Wafer level packaging technology development for CMOS image sensors using Through Silicon Vias. 141–148. 14 indexed citations
15.
16.
Henry, David, et al.. (2007). Via First Technology Development Based on High Aspect Ratio Trenches Filled with Doped Polysilicon. SPIRE - Sciences Po Institutional REpository. 830–835. 26 indexed citations
17.
Leduc, Patrick, N. Sillon, S. Maı̂trejean, et al.. (2007). Challenges for 3D IC integration: bonding quality and thermal management. 210–212. 69 indexed citations
18.
Gillot, C., et al.. (2007). Wafer Level Thin Film Encapsulation for BAW RF MEMS. 605–609. 17 indexed citations
19.
Gillot, C., et al.. (2005). Wafer Level Thin Film Encapsulation for MEMS. a61. 1–4. 14 indexed citations
20.
Sillon, N. & R. Baptist. (2002). Micromachined mass spectrometer. Sensors and Actuators B Chemical. 83(1-3). 129–137. 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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