F. de Crécy
- Electrical and Electronic Engineering top 10%
- Computational Mechanics top 10%
- Materials Chemistry
- Biomedical Engineering
- Automotive Engineering top 10%
- Co-authors
- J. EymeryEva-Maria CollnotClaus‐Michael LehrL. Di CioccioSteffi HansenN. SillonL.L. ChapelonL. Clavelier
- Topics
- 3D IC and TSV technologies (21 papers)Electronic Packaging and Soldering Technologies (14 papers)Copper Interconnects and Reliability (7 papers)
- Partner nations
- FranceSwitzerlandAustria
In The Last Decade
F. de Crécy
37 papers receiving 560 citations
Peers
Comparison fields: 5 of 71
- Electrical and Electronic Engineering 327
- Computational Mechanics 114
- Materials Chemistry 100
- Biomedical Engineering 92
- Automotive Engineering 56
Countries citing papers authored by F. de Crécy
This map shows the geographic impact of F. de Crécy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. de Crécy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. de Crécy more than expected).
Fields of papers citing papers by F. de Crécy
This network shows the impact of papers produced by F. de Crécy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. de Crécy. The network helps show where F. de Crécy may publish in the future.
Co-authorship network of co-authors of F. de Crécy
This figure shows the co-authorship network connecting the top 25 collaborators of F. de Crécy. A scholar is included among the top collaborators of F. de Crécy based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F. de Crécy. F. de Crécy is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 46 | |
| 2 | 14 | |
| 3 | 7 | |
| 4 | Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications | 2 |
| 5 | 9 | |
| 6 | A simple and approximate analytical model for the estimation of the thermal resistances in 3D stacks of integrated circuits | 9 |
| 7 | 5 | |
| 8 | 67 | |
| 9 | 2 | |
| 10 | 12 | |
| 11 | 7 | |
| 12 | 2 | |
| 13 | 69 | |
| 14 | 11 | |
| 15 | 1 | |
| 16 | 92 | |
| 17 | 3 | |
| 18 | 27 | |
| 19 | 6 | |
| 20 | 5 |
About F. de Crécy
F. de Crécy is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 37 papers that have together received 581 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Copper Interconnects and Reliability (7 papers). The work is most often cited by research in Pharmaceutical Science (54 citations), Electrical and Electronic Engineering (327 citations) and Computational Mechanics (114 citations). F. de Crécy has collaborated with scholars based in France, Switzerland and Austria. Frequent co-authors include J. Eymery, Eva-Maria Collnot, Claus‐Michael Lehr, L. Di Cioccio, Steffi Hansen, N. Sillon, L.L. Chapelon, L. Clavelier, Pierric Gueguen and R. Taïbi. Their work appears in journals such as Biomaterials, Physical Review B and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.