F. de Crécy

804 total citations
37 papers, 581 citations indexed

About

F. de Crécy is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, F. de Crécy has authored 37 papers receiving a total of 581 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 7 papers in Biomedical Engineering. Recurrent topics in F. de Crécy's work include 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Copper Interconnects and Reliability (7 papers). F. de Crécy is often cited by papers focused on 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (14 papers) and Copper Interconnects and Reliability (7 papers). F. de Crécy collaborates with scholars based in France, Switzerland and Austria. F. de Crécy's co-authors include J. Eymery, Eva-Maria Collnot, Claus‐Michael Lehr, L. Di Cioccio, Steffi Hansen, N. Sillon, L.L. Chapelon, L. Clavelier, Pierric Gueguen and R. Taïbi and has published in prestigious journals such as Biomaterials, Physical Review B and Journal of The Electrochemical Society.

In The Last Decade

F. de Crécy

37 papers receiving 560 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
F. de Crécy France 11 327 114 100 92 56 37 581
Joshua Dijksman Netherlands 16 443 1.4× 200 1.8× 55 0.6× 275 3.0× 52 0.9× 36 726
Jungkwun Kim United States 15 485 1.5× 39 0.3× 68 0.7× 269 2.9× 23 0.4× 83 748
Jiarui Wang China 11 208 0.6× 30 0.3× 38 0.4× 48 0.5× 23 0.4× 29 334
Ivan Kassamakov Finland 11 252 0.8× 35 0.3× 43 0.4× 193 2.1× 33 0.6× 32 473
Yong Joong Lee South Korea 9 197 0.6× 33 0.3× 29 0.3× 68 0.7× 37 0.7× 36 334
Dawei Luo China 12 194 0.6× 43 0.4× 61 0.6× 278 3.0× 12 0.2× 37 548
Lars Erdmann Germany 11 232 0.7× 20 0.2× 31 0.3× 256 2.8× 9 0.2× 31 639
Fang Dong China 12 200 0.6× 19 0.2× 153 1.5× 94 1.0× 10 0.2× 68 438
Tatsuya Yamaue Japan 12 296 0.9× 71 0.6× 86 0.9× 176 1.9× 171 3.1× 31 559

Countries citing papers authored by F. de Crécy

Since Specialization
Citations

This map shows the geographic impact of F. de Crécy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. de Crécy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. de Crécy more than expected).

Fields of papers citing papers by F. de Crécy

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by F. de Crécy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. de Crécy. The network helps show where F. de Crécy may publish in the future.

Co-authorship network of co-authors of F. de Crécy

This figure shows the co-authorship network connecting the top 25 collaborators of F. de Crécy. A scholar is included among the top collaborators of F. de Crécy based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F. de Crécy. F. de Crécy is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
2.
Coudrain, P., Vincent Fiori, A. Farcy, et al.. (2015). Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Design and Test. 33(3). 21–36. 14 indexed citations
3.
Fiori, Vincent, A. Farcy, F. de Crécy, et al.. (2014). Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(8). 1284–1292. 7 indexed citations
4.
Fréchette, Luc G., et al.. (2013). Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications. European Microelectronics and Packaging Conference. 1–8. 2 indexed citations
5.
Joblot, S., et al.. (2013). Reliability study for large silicon interposers report on board. 383–389. 9 indexed citations
6.
Crécy, F. de. (2012). A simple and approximate analytical model for the estimation of the thermal resistances in 3D stacks of integrated circuits. 1–6. 9 indexed citations
7.
Parès, G., et al.. (2012). ULTRA THIN CHIPS STACKING ON TSV SILICON INTERPOSER USING BACK-TO-FACE TECHNOLOGY. IMAPSource Proceedings. 2012(1). 710–719. 5 indexed citations
8.
Delmas, Thomas, Anne‐Claude Couffin, F. de Crécy, et al.. (2011). Preparation and characterization of highly stable lipid nanoparticles with amorphous core of tuneable viscosity. Journal of Colloid and Interface Science. 360(2). 471–481. 67 indexed citations
9.
Parès, G., F. de Crécy, S. Moreau, et al.. (2011). ASSESSMENT AND CHARACTERIZATION OF STRESS INDUCED BY VIA-FIRST TSV TECHNOLOGY. IMAPSource Proceedings. 2011(1). 388–399. 2 indexed citations
10.
Labeau, M., Fabien Sauter-Starace, F. de Crécy, et al.. (2010). The development of high quality seals for silicon patch-clamp chips. Biomaterials. 31(28). 7398–7410. 12 indexed citations
11.
Dehbi, A. & F. de Crécy. (2010). Validation of the Langevin particle dispersion model against experiments on turbulent mixing in a T-junction. Powder Technology. 206(3). 312–321. 7 indexed citations
12.
Reinhardt, Alexandre, et al.. (2008). Design of Computer Experiments: A powerful tool for the numerical design of BAW filters. UPM Digital Archive (Technical University of Madrid). 2185–2188. 2 indexed citations
13.
Leduc, Patrick, N. Sillon, S. Maı̂trejean, et al.. (2007). Challenges for 3D IC integration: bonding quality and thermal management. 210–212. 69 indexed citations
14.
Lacrevaz, T., B. Fléchet, A. Farcy, et al.. (2006). Wide band frequency and in situ characterisation of high permittivity insulators (High-K) for H.F. integrated passives. Microelectronic Engineering. 83(11-12). 2184–2188. 11 indexed citations
15.
Lacrevaz, T., B. Fléchet, A. Farcy, et al.. (2006). Wide Band Frequency Characterization of High Permittivity Dielectrics (High-K) for RF MIM Capacitors Integrated in BEOL. 78–80. 1 indexed citations
16.
Crécy, F. de, et al.. (2006). Surface diffusion dewetting of thin solid films: Numerical method and application toSiSiO2. Physical Review B. 73(11). 92 indexed citations
17.
Landis, S., et al.. (2005). Full three-dimensional characterization of 25nm lines for chemically amplified resist simulation. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 23(6). 2733–2737. 3 indexed citations
18.
Crécy, F. de. (1994). The effect of grid assembly mixing vanes on critical heat flux values and azimuthal location in fuel assemblies. Nuclear Engineering and Design. 149(1-3). 233–241. 27 indexed citations
19.
Crécy, F. de, et al.. (1994). The adjoint sensitivity method, a contribution to the code uncertainty evaluation. Nuclear Engineering and Design. 149(1-3). 357–364. 6 indexed citations
20.
Crécy, F. de. (1986). Modeling of stratified two-phase flow in pipes, pumps and other devices. International Journal of Multiphase Flow. 12(3). 307–323. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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