L. Arnaud

1.3k total citations
85 papers, 779 citations indexed

About

L. Arnaud is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, L. Arnaud has authored 85 papers receiving a total of 779 indexed citations (citations by other indexed papers that have themselves been cited), including 73 papers in Electrical and Electronic Engineering, 68 papers in Electronic, Optical and Magnetic Materials and 15 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in L. Arnaud's work include Copper Interconnects and Reliability (66 papers), Semiconductor materials and devices (47 papers) and Electronic Packaging and Soldering Technologies (44 papers). L. Arnaud is often cited by papers focused on Copper Interconnects and Reliability (66 papers), Semiconductor materials and devices (47 papers) and Electronic Packaging and Soldering Technologies (44 papers). L. Arnaud collaborates with scholars based in France, Switzerland and Belgium. L. Arnaud's co-authors include G. Reimbold, S. Moreau, Y. Wouters, Thomas Frank, C. Chappaz, Lorena Anghel, Philip R. LeDuc, F. Lorut, Aurélie Thuaire and X. Federspiel and has published in prestigious journals such as Journal of Applied Physics, Journal of Magnetism and Magnetic Materials and IEEE Transactions on Magnetics.

In The Last Decade

L. Arnaud

81 papers receiving 752 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
L. Arnaud France 16 652 394 112 87 82 85 779
Sungwook Choi South Korea 13 344 0.5× 58 0.1× 153 1.4× 18 0.2× 176 2.1× 58 551
Badih El-Kareh United States 12 497 0.8× 63 0.2× 70 0.6× 25 0.3× 90 1.1× 30 588
Xavier Baillin France 12 246 0.4× 50 0.1× 75 0.7× 43 0.5× 105 1.3× 38 467
Yiwen Song United States 13 211 0.3× 236 0.6× 50 0.4× 42 0.5× 96 1.2× 37 546
J. Cotte United States 15 502 0.8× 32 0.1× 155 1.4× 10 0.1× 150 1.8× 31 591
Shigeru Imai Japan 15 375 0.6× 71 0.2× 138 1.2× 74 0.9× 102 1.2× 41 566
Takian Fakhrul United States 13 496 0.8× 223 0.6× 447 4.0× 19 0.2× 87 1.1× 23 768
A. Diligenti Italy 15 506 0.8× 159 0.4× 144 1.3× 20 0.2× 258 3.1× 58 634
Feifan Xu China 9 116 0.2× 246 0.6× 112 1.0× 14 0.2× 49 0.6× 31 463
O.D. Podoltsev Ukraine 14 360 0.6× 209 0.5× 107 1.0× 20 0.2× 124 1.5× 47 594

Countries citing papers authored by L. Arnaud

Since Specialization
Citations

This map shows the geographic impact of L. Arnaud's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L. Arnaud with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L. Arnaud more than expected).

Fields of papers citing papers by L. Arnaud

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L. Arnaud. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L. Arnaud. The network helps show where L. Arnaud may publish in the future.

Co-authorship network of co-authors of L. Arnaud

This figure shows the co-authorship network connecting the top 25 collaborators of L. Arnaud. A scholar is included among the top collaborators of L. Arnaud based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L. Arnaud. L. Arnaud is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Moreau, S., et al.. (2022). Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements. ECS Journal of Solid State Science and Technology. 11(2). 24001–24001. 35 indexed citations
2.
Arnaud, L., et al.. (2021). 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. SPIRE - Sciences Po Institutional REpository. 1–4. 5 indexed citations
3.
Jouve, A., V. Balan, N. Bresson, et al.. (2017). 1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy. HAL (Le Centre pour la Communication Scientifique Directe). 1–2. 27 indexed citations
4.
5.
Arnaud, L., et al.. (2014). Study of EM void nucleation and mechanic relaxation effects. Microelectronics Reliability. 54(9-10). 1692–1696. 1 indexed citations
6.
Petitprez, E., et al.. (2013). Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment. Microelectronic Engineering. 106. 195–199. 1 indexed citations
7.
8.
Haxaire, K., et al.. (2010). Microstructure and texture analysis of narrow copper line versus widths and annealing for reliability improvement. Microelectronic Engineering. 88(5). 661–665. 6 indexed citations
9.
Arnaud, L., et al.. (2009). Analysis of electromigration induced early failures in Cu interconnects for 45nm node. Microelectronic Engineering. 87(3). 355–360. 15 indexed citations
10.
Doyen, Laurent, et al.. (2008). Extensive analysis of resistance evolution due to electromigration induced degradation. Journal of Applied Physics. 104(12). 49 indexed citations
11.
Doyen, Laurent, et al.. (2006). Residual resistivity model and its application. 1. 134–135. 1 indexed citations
12.
Guedj, C., V. Arnal, L. Arnaud, et al.. (2005). Bias-stress-induced evolution of the dielectric properties of porous-ULK/ copper advanced interconnects. Microelectronic Engineering. 80. 345–348. 5 indexed citations
13.
Guedj, C., V. Arnal, L. Arnaud, et al.. (2005). Influence of the diffusion barriers on the dielectric reliability of ULK/Cu advanced interconnects. 57–59. 2 indexed citations
14.
Arnaud, L., et al.. (2002). Analysis of Blech product threshold in passivated AlCu interconnections. 67. 289–291. 1 indexed citations
15.
Arnaud, L., et al.. (2002). Evidence of grain-boundary versus interface diffusion in electromigration experiments in copper damascene interconnects. Journal of Applied Physics. 93(1). 192–204. 61 indexed citations
16.
Arnaud, L., et al.. (2000). Electromigration characterization of damascene copper interconnects using normally and highly accelerated tests. Microelectronics Reliability. 40(8-10). 1311–1316. 6 indexed citations
17.
Sicardy, O., et al.. (2000). X-Ray Diffraction Determination of Residual Stresses in Narrow Copper Interconnects with Submicronic Widths. Materials science forum. 347-349. 562–567. 3 indexed citations
18.
Arnaud, L., et al.. (1998). Influence of thermal heating effect on pulsed DC electromigration result analysis. Microelectronics Reliability. 38(10). 1531–1537. 3 indexed citations
19.
Lormand, G., et al.. (1997). Thermal analytical model for analysis of pulsed DC electromigration results. 484–487. 1 indexed citations
20.
Arnaud, L., et al.. (1988). Storage loop definition for Bloch line memories. IEEE Transactions on Magnetics. 24(2). 1719–1721. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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