H. Feldis
Impact in
-
- Copper Interconnects and Reliability
-
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Plasma Diagnostics and Applications
Papers in ⓘ
-
- Copper Interconnects and Reliability 11
-
- Semiconductor materials and devices 10
- 3D IC and TSV technologies 6
- Electronic Packaging and Soldering Technologies 4
- Co-authors
- M. Fayolle (9 shared papers)M. Assous (9 shared papers)G. Passemard (6 shared papers)J. Torrès (4 shared papers)O. Louveau (5 shared papers)V. Jousseaume (4 shared papers)Paul‐Henri Haumesser (3 shared papers)Florence Fusalba (4 shared papers)
- Journals
- Microelectronic Engineering (3 papers)Journal of The Electrochemical Society (1 paper)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (1 paper)ECS Transactions (1 paper)TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference (1 paper)
In The Last Decade
H. Feldis
15 papers receiving 125 citations
Peers
Comparison fields: 5 of 24
- Electronic, Optical and Magnetic Materials 72
- Electrical and Electronic Engineering 117
- Mechanics of Materials 37
- Ceramics and Composites 4
- Biomedical Engineering 22
Countries citing papers authored by H. Feldis
This map shows the geographic impact of H. Feldis's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Feldis with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Feldis more than expected).
Fields of papers citing papers by H. Feldis
This network shows the impact of papers produced by H. Feldis. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Feldis. The network helps show where H. Feldis may publish in the future.
Co-authors
The 25 scholars most cited alongside H. Feldis, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 23 | |
| 2 | 2005 | 17 | |
| 3 | 2008 | 16 | |
| 4 | 2003 | 15 | |
| 5 | 1998 | 12 | |
| 6 | 2012 | 11 | |
| 7 | 2004 | 5 | |
| 8 | 2012 | 5 | |
| 9 | 2009 | 4 | |
| 10 | 2003 | 4 | |
| 11 | 2009 | 4 | |
| 12 | 2004 | 4 | |
| 13 | 2004 | 4 | |
| 14 | 2010 | 3 | |
| 15 | 2002 | 2 | |
| 16 | 2013 | 0 |
About H. Feldis
H. Feldis is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Ceramics and Composites, Surfaces, Coatings and Films and Industrial and Manufacturing Engineering, having authored 16 papers that have together received 129 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (10 papers), 3D IC and TSV technologies (6 papers), Electronic Packaging and Soldering Technologies (4 papers), Nanofabrication and Lithography Techniques (4 papers), Semiconductor materials and interfaces (3 papers), Metal and Thin Film Mechanics (2 papers) and Recycling and Waste Management Techniques (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (72 citations), Electrical and Electronic Engineering (117 citations), Mechanics of Materials (37 citations), Ceramics and Composites (4 citations) and Biomedical Engineering (22 citations). H. Feldis has collaborated with scholars based in France, Japan and Belgium. Frequent co-authors include M. Fayolle, M. Assous, G. Passemard, J. Torrès, O. Louveau, V. Jousseaume, Paul‐Henri Haumesser, Florence Fusalba, D. Louis and S. Maı̂trejean. Their work appears in journals such as Microelectronic Engineering, Journal of The Electrochemical Society, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films, ECS Transactions and TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.