I. Vervoort

467 total citations
19 papers, 365 citations indexed

About

I. Vervoort is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, I. Vervoort has authored 19 papers receiving a total of 365 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electronic, Optical and Magnetic Materials, 17 papers in Electrical and Electronic Engineering and 5 papers in Materials Chemistry. Recurrent topics in I. Vervoort's work include Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (11 papers) and Electrodeposition and Electroless Coatings (6 papers). I. Vervoort is often cited by papers focused on Copper Interconnects and Reliability (18 papers), Semiconductor materials and devices (11 papers) and Electrodeposition and Electroless Coatings (6 papers). I. Vervoort collaborates with scholars based in Belgium, Ireland and Japan. I. Vervoort's co-authors include Sywert Brongersma, K. Maex, E. Richard, Emma Kerr, Karen Maex, Moshe Judelewicz, Roger Palmans, Gerald Beyer, H. Bender and Wilfried Vandervorst and has published in prestigious journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Microelectronic Engineering.

In The Last Decade

I. Vervoort

18 papers receiving 350 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
I. Vervoort Belgium	5	315	251	103	75	40	19	365
E. Richard France	6	245 0.8×	201 0.8×	83 0.8×	72 1.0×	33 0.8×	21	296
James G. Ryan United States	10	224 0.7×	142 0.6×	117 1.1×	82 1.1×	68 1.7×	25	352
W. Cote United States	8	334 1.1×	170 0.7×	71 0.7×	43 0.6×	118 3.0×	15	411
H. Rathore United States	7	323 1.0×	244 1.0×	43 0.4×	62 0.8×	30 0.8×	15	367
O. van der Straten United States	11	324 1.0×	204 0.8×	97 0.9×	83 1.1×	26 0.7×	46	381
Jing‐Cheng Lin Taiwan	10	308 1.0×	171 0.7×	102 1.0×	177 2.4×	28 0.7×	17	402
R. Augur Netherlands	9	233 0.7×	171 0.7×	49 0.5×	51 0.7×	42 1.1×	27	269
Christine Hau-Riege United States	13	526 1.7×	444 1.8×	76 0.7×	75 1.0×	36 0.9×	29	583
D. Jawarani United States	10	284 0.9×	139 0.6×	80 0.8×	44 0.6×	67 1.7×	38	336
T. Spooner United States	13	412 1.3×	312 1.2×	83 0.8×	76 1.0×	64 1.6×	49	472

Countries citing papers authored by I. Vervoort

Since Specialization

Citations

This map shows the geographic impact of I. Vervoort's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I. Vervoort with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I. Vervoort more than expected).

Fields of papers citing papers by I. Vervoort

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by I. Vervoort. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I. Vervoort. The network helps show where I. Vervoort may publish in the future.

Co-authorship network of co-authors of I. Vervoort

This figure shows the co-authorship network connecting the top 25 collaborators of I. Vervoort. A scholar is included among the top collaborators of I. Vervoort based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with I. Vervoort. I. Vervoort is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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19 of 19 papers shown

Olmen, J. Van, Wen‐Wei Wu, M. Van Hove, et al.. (2004). Integration of Single Damascene 85/85 nm L/S copper trenches in Black Diamond using 193 nm optical lithography with dipole illumination. 612. 171–173. 1 indexed citations

Zhang, Wenqi, Sywert Brongersma, Trudo Clarysse, et al.. (2003). The thickness and temperature dependent resistivity of thin copper films. 1 indexed citations

Vanhaelemeersch, S., Karen Maex, Gerald Beyer, et al.. (2003). Etch process development for FLARE/sup TM/ for dual damascene architecture using a N/sub 2//O/sub 2/ plasma. 59–61. 2 indexed citations

Brongersma, Sywert, et al.. (2003). Electrical and microstructural characterization of narrow Cu interconnects. 1 indexed citations

Brongersma, H.H., I. Vervoort, H. Bender, et al.. (2003). Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper. 514. 290–292. 1 indexed citations

Das, Abhishek, Yoshiaki Furukawa, Francesca Iacopi, et al.. (2003). Cu/LKD-5109 damascene integration demonstration using FF-02 low-k spin-on hard-mask and embedded etch-stop. 51–53. 2 indexed citations

Donaton, R. A., Karen Maex, Herbert Struyf, et al.. (2003). Critical issues in the integration of copper and low-k dielectrics. 511. 262–264. 1 indexed citations

D’Haen, Jan, et al.. (2003). Copper Deposition and Subsequent Grain Structure Evolution in Narrow Lines. Materials science forum. 426-432. 2485–2490. 2 indexed citations

Brongersma, Sywert, E. Richard, I. Vervoort, & Karen Maex. (2002). A grain size limitation inherent to electroplated copper films. 31–33. 2 indexed citations

10.

Brongersma, Sywert, et al.. (2002). Nanoindentation on low-k dielectrics.

11.

Brongersma, Sywert, et al.. (2002). Grain Growth, Stress, and Impurities in Electroplated Copper. Journal of materials research/Pratt's guide to venture capital sources. 17(3). 582–589. 100 indexed citations

12.

Shaffer, Edward O., David Price, R. A. Donaton, et al.. (2001). Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene. 60–62. 2 indexed citations

13.

Jenei, S., Stefaan Decoutere, Gillis Winderickx, et al.. (2001). High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene. 107–109. 17 indexed citations

14.

Donaton, R. A., Mireille Maenhoudt, Ivan Pollentier, et al.. (2001). Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures. Microelectronic Engineering. 55(1-4). 277–283. 12 indexed citations

15.

Brongersma, Sywert, Emma Kerr, I. Vervoort, & Karen Maex. (2001). Limitations to copper grain growth in narrow trenches. 230–232. 4 indexed citations

16.

Brongersma, Sywert, Moshe Judelewicz, I. Vervoort, et al.. (2000). Self-annealing characterization of electroplated copper films. Microelectronic Engineering. 50(1-4). 449–457. 133 indexed citations

17.

Bender, H., et al.. (1999). Investigation on the Corrosion of Cu Metallization in the Focused Ion Beam System due to a low I2 Background. Proceedings - International Symposium for Testing and Failure Analysis. 30835. 135–140. 1 indexed citations

18.

Brongersma, Sywert, E. Richard, I. Vervoort, & K. Maex. (1999). Stress in electrochemically deposited copper. AIP conference proceedings. 249–254. 2 indexed citations

19.

Brongersma, Sywert, E. Richard, I. Vervoort, et al.. (1999). Two-step room temperature grain growth in electroplated copper. Journal of Applied Physics. 86(7). 3642–3645. 81 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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