E. Richard

1.0k citations

21 papers · 296 indexed · h-index 6

Impact in

Electronic, Optical and Magnetic Materials top 10%
- Copper Interconnects and Reliability
Electrical and Electronic Engineering
- Electrodeposition and Electroless Coatings
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies

Papers in ⓘ

Electrical and Electronic Engineering 19
- Semiconductor materials and devices 15
- Electrodeposition and Electroless Coatings 7
- Electronic Packaging and Soldering Technologies 3
- Advancements in Semiconductor Devices and Circuit Design 2
- Integrated Circuits and Semiconductor Failure Analysis 2
Electronic, Optical and Magnetic Materials 16
- Copper Interconnects and Reliability 16

Co-authors: Sywert Brongersma (4 shared papers)I. Vervoort (6 shared papers)Karen Maex (4 shared papers)Moshe Judelewicz (1 shared paper)Roger Palmans (2 shared papers)K. Maex (2 shared papers)Wilfried Vandervorst (1 shared paper)H. Bender (2 shared papers)
Journals: Microelectronic Engineering (7 papers)Journal of Applied Physics (1 paper)Applied Surface Science (1 paper)Boletim do Museu Paraense Emílio Goeldi Ciências Humanas (1 paper)AIP conference proceedings (1 paper)
Partner nations: France Belgium Switzerland

In The Last Decade

E. Richard

20 papers receiving 285 citations

Peers

Countries citing papers authored by E. Richard

Since Specialization

Citations

This map shows the geographic impact of E. Richard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Richard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Richard more than expected).

Fields of papers citing papers by E. Richard

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Richard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Richard. The network helps show where E. Richard may publish in the future.

Co-authors

The 25 scholars most cited alongside E. Richard, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with E. Richard Line = papers co-authored together E. Richard links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 21 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Self-annealing characterization of electroplated copper films Microelectronic Engineering ·Sébastien Lagrange, Sywert Brongersma, Moshe Judelewicz, A. Saerens, I. Vervoort, E. Richard, Roger Palmans, Karen Maex	2000	133
2	Two-step room temperature grain growth in electroplated copper Journal of Applied Physics ·Sywert Brongersma, E. Richard, I. Vervoort, H. Bender, Wilfried Vandervorst, Sébastien Lagrange, Gerald Beyer, K. Maex	1999	81
3	Ultra thin diffusion barriers for Cu interconnections at the gigabit generation and beyond Microelectronic Engineering ·Flavie Braud, J. Torrès, J. Palleeau, J.L. Mermet, C. Marcadal, E. Richard	1997	14
4	32nm node BEOL integration with an extreme low-k porous SiOCH dielectric k=2.3 Microelectronic Engineering ·K. Hamioud, V. Arnal, A. Farcy, V. Jousseaume, A. Zenasni, B. Icard, Jonathan Pradelles, S. Manakli, P. Brun, G. Imbert, C. Jayet, M. Assous, S. Maı̂trejean, D. Galpin, C. Monget, J. Guillan, S. Chhun, E. Richard, D. Barbier, M. Haond	2009	14
5	CVD process for copper interconnection Microelectronic Engineering ·C. Marcadal, E. Richard, J. Torrès, J. Palleau, R. Madar	1997	10
6	Process optimization of copper MOCVD using modeling experimental design Applied Surface Science ·Marie-José Mouche, J.L. Mermet, F. Pires, E. Richard, Joaquin Torres, J. Palleau, François Braud	1995	10
7	Reliability failure modes in interconnects for the 45 nm technology node and beyond L. Arnaud, D. Galpin, S. Chhun, C. Monget, E. Richard, D. Roy, C. Besset, M. Vilmay, Laurent Doyen, P. Waltz, E. Petitprez, F. Terrier, G. Imbert, Y. Le Friec	2009	5
8	Cu-CVD process optimised in a cluster equipment for IC manufacturing Microelectronic Engineering ·C. Marcadal, E. Richard, J.L. Mermet, J. Torrès, J. Palleau, B. Alaux, M. Bakli	1997	5
9	OMCVD TiN diffusion barrier for copper contact and via/interconnects structures Microelectronic Engineering ·C. Marcadal, E. Richard, J. Torrès, J. Palleau, L. Ulmer, L. Perroud, J. Piaguet, G. Rolland	1997	4
10	45 nm Node Multi Level Interconnects with Porous SiOCH Dielectric k=2.5 V. Arnal, A. Farcy, M. Aimadeddine, B. Icard, C. Guedj, S. Maı̂trejean, J. Todeschini, W.F.A. Besling, P. Brun, Emmanuel Ollier, J.P. Jacquemin, R. Delsol, Pauline Vannier, M. Mellier, E. Richard, Robert Fox, G. Imbert, Y. Le-Friec, A. Toffoli, J. Torrès	2006	4
11	In situ post etching treatment as a solution to improve defect density for porous low-k integration using metallic hard masks N. Possémé, R. Bouyssou, T. Chevolleau, David Tormey, V. Arnal, S. Chhun, C. Monget, E. Richard, D. Galpin, J. Guillan, L. Arnaud, D. Roy, M. Guillermet, J. Ramard, O. Joubert, C. Vérove	2009	3
12	A grain size limitation inherent to electroplated copper films Sywert Brongersma, E. Richard, I. Vervoort, Karen Maex	2002	2
13	Stress in electrochemically deposited copper AIP conference proceedings ·Sywert Brongersma, E. Richard, I. Vervoort, K. Maex	1999	2
14	CVD Copper Deposition from Cu^I(HFAC)TMVS Studied Through a Modeling Experimental Design Journal de Physique IV (Proceedings) ·J.L. Mermet, Marie-José Mouche, F. Pires, E. Richard, J. Torrès, J. Palleau, Flavie Braud	1995	2
15	New generation of Self Ionized Plasma copper seed for sub 40nm nodes Microelectronic Engineering ·J. Guillan, K. Haxaire, S. Chhun, E. Richard, M. C. Luche, L. Arnaud, E. Petitprez, C. Monget, D. Galpin, P. Normandon	2010	2
16	Temperature dependence of QCSE device characteristics and performance Michael B. Venditti, D. Kabal, Michael H. Ayliffe, David V. Plant, F. A. P. Tooley, E. Richard, J. F. Currie, A.J. Spring Thorpes	2002	1
17	Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper H.H. Brongersma, I. Vervoort, M. Judelwicz, H. Bender, T. Conard, W. Vandervorst, Gerald Beyer, E. Richard, Roger Palmans, Sébastien Lagrange, Karen Maex	2003	1
18	Critical issues in the integration of copper and low-k dielectrics R. A. Donaton, B. Coenagrachts, Karen Maex, Herbert Struyf, S. Vanhaelemeersch, Gerald Beyer, E. Richard, I. Vervoort, Wim Fyen, Joost Grillaert, Sonja van der Groen, Michele Stucchi, David De Roest	2003	1
19	Os nomes jocosos, seus significados e usos entre os Tuyuka: uma reflexão sobre o humor ameríndio a partir dos apelidos Boletim do Museu Paraense Emílio Goeldi Ciências Humanas ·E. Richard	2024	1
20	Junction engineering for FDSOI technology speed/power enhancement O. Weber, N. Planes, V. Barral, D. Barge, E. Richard, B. Dumont, P. Perreau, D. Petit, Dominique Golanski, C. Fenouillet-Béranger, Nicolas Guillot, S. Lagrasta, P. Gouraud, Y. Campidelli, L. Pinzelli, M. Mellier, F. Arnaud, M. Haond	2013	1

About E. Richard

E. Richard is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Atomic and Molecular Physics, and Optics and Mechanics of Materials, having authored 21 papers that have together received 296 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (15 papers), Electrodeposition and Electroless Coatings (7 papers), Electronic Packaging and Soldering Technologies (3 papers), Semiconductor materials and interfaces (3 papers), Corrosion Behavior and Inhibition (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (201 citations), Electrical and Electronic Engineering (245 citations), Mechanics of Materials (72 citations), Materials Chemistry (83 citations) and Mechanical Engineering (34 citations). E. Richard has collaborated with scholars based in France, Belgium and Switzerland. Frequent co-authors include Sywert Brongersma, I. Vervoort, Karen Maex, Moshe Judelewicz, Roger Palmans, K. Maex, Wilfried Vandervorst, H. Bender, Gerald Beyer and J. Torrès. Their work appears in journals such as Microelectronic Engineering, Journal of Applied Physics, Applied Surface Science, Boletim do Museu Paraense Emílio Goeldi Ciências Humanas and AIP conference proceedings.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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