E. Richard

1.0k total citations
21 papers, 296 citations indexed

About

E. Richard is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, E. Richard has authored 21 papers receiving a total of 296 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 16 papers in Electronic, Optical and Magnetic Materials and 5 papers in Materials Chemistry. Recurrent topics in E. Richard's work include Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (15 papers) and Electrodeposition and Electroless Coatings (7 papers). E. Richard is often cited by papers focused on Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (15 papers) and Electrodeposition and Electroless Coatings (7 papers). E. Richard collaborates with scholars based in France, Belgium and Switzerland. E. Richard's co-authors include I. Vervoort, Sywert Brongersma, Karen Maex, Moshe Judelewicz, Roger Palmans, K. Maex, Wilfried Vandervorst, Gerald Beyer, H. Bender and J. Torrès and has published in prestigious journals such as Journal of Applied Physics, Applied Surface Science and Microelectronic Engineering.

In The Last Decade

E. Richard

20 papers receiving 285 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
E. Richard France	6	245	201	83	72	34	21	296
I. Vervoort Belgium	5	315 1.3×	251 1.2×	103 1.2×	75 1.0×	37 1.1×	19	365
R. Augur Netherlands	9	233 1.0×	171 0.9×	49 0.6×	51 0.7×	15 0.4×	27	269
Jing‐Cheng Lin Taiwan	10	308 1.3×	171 0.9×	102 1.2×	177 2.5×	34 1.0×	17	402
V. Arnal France	11	245 1.0×	192 1.0×	59 0.7×	65 0.9×	9 0.3×	44	297
D. Jawarani United States	10	284 1.2×	139 0.7×	80 1.0×	44 0.6×	23 0.7×	38	336
W. Cote United States	8	334 1.4×	170 0.8×	71 0.9×	43 0.6×	43 1.3×	15	411
J. D. Blevins United States	13	271 1.1×	201 1.0×	246 3.0×	48 0.7×	31 0.9×	17	471
R. G. Filippi United States	11	413 1.7×	345 1.7×	45 0.5×	52 0.7×	17 0.5×	42	447
Jeff Gambino United States	10	310 1.3×	108 0.5×	62 0.7×	27 0.4×	23 0.7×	59	344
W. Robl Germany	11	172 0.7×	111 0.6×	138 1.7×	159 2.2×	77 2.3×	26	345

Countries citing papers authored by E. Richard

Since Specialization

Citations

This map shows the geographic impact of E. Richard's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E. Richard with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E. Richard more than expected).

Fields of papers citing papers by E. Richard

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by E. Richard. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E. Richard. The network helps show where E. Richard may publish in the future.

Co-authorship network of co-authors of E. Richard

This figure shows the co-authorship network connecting the top 25 collaborators of E. Richard. A scholar is included among the top collaborators of E. Richard based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with E. Richard. E. Richard is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Richard, E.. (2024). Os nomes jocosos, seus significados e usos entre os Tuyuka: uma reflexão sobre o humor ameríndio a partir dos apelidos. Boletim do Museu Paraense Emílio Goeldi Ciências Humanas. 19(1). 1 indexed citations

Weber, O., E. Josse, X. Garros, et al.. (2016). Gate stack solutions in gate-first FDSOI technology to meet high performance, low leakage, V<inf>T</inf> centering and reliability criteria. 1–2.

Weber, O., N. Planes, V. Barral, et al.. (2013). Junction engineering for FDSOI technology speed/power enhancement. 1–2. 1 indexed citations

Haxaire, K., et al.. (2010). New generation of Self Ionized Plasma copper seed for sub 40nm nodes. Microelectronic Engineering. 88(5). 697–700. 2 indexed citations

Arnaud, L., E. Richard, D. Roy, et al.. (2009). Reliability failure modes in interconnects for the 45 nm technology node and beyond. 104. 179–181. 5 indexed citations

Arnal, V., A. Farcy, V. Jousseaume, et al.. (2009). 32nm node BEOL integration with an extreme low-k porous SiOCH dielectric k=2.3. Microelectronic Engineering. 87(3). 316–320. 14 indexed citations

Arnal, V., A. Farcy, C. Guedj, et al.. (2006). 45 nm Node Multi Level Interconnects with Porous SiOCH Dielectric k=2.5. 213–215. 4 indexed citations

Brongersma, H.H., I. Vervoort, H. Bender, et al.. (2003). Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper. 514. 290–292. 1 indexed citations

Donaton, R. A., Karen Maex, Herbert Struyf, et al.. (2003). Critical issues in the integration of copper and low-k dielectrics. 511. 262–264. 1 indexed citations

10.

Brongersma, Sywert, E. Richard, I. Vervoort, & Karen Maex. (2002). A grain size limitation inherent to electroplated copper films. 31–33. 2 indexed citations

11.

Plant, David V., et al.. (2002). Temperature dependence of QCSE device characteristics and performance. IV/17–IV/20. 1 indexed citations

12.

Brongersma, Sywert, Moshe Judelewicz, I. Vervoort, et al.. (2000). Self-annealing characterization of electroplated copper films. Microelectronic Engineering. 50(1-4). 449–457. 133 indexed citations

13.

Brongersma, Sywert, E. Richard, I. Vervoort, & K. Maex. (1999). Stress in electrochemically deposited copper. AIP conference proceedings. 249–254. 2 indexed citations

14.

Brongersma, Sywert, E. Richard, I. Vervoort, et al.. (1999). Two-step room temperature grain growth in electroplated copper. Journal of Applied Physics. 86(7). 3642–3645. 81 indexed citations

15.

Richard, E., et al.. (1997). OMCVD TiN diffusion barrier for copper contact and via/interconnects structures. Microelectronic Engineering. 37-38. 197–203. 4 indexed citations

16.

Richard, E., et al.. (1997). Cu-CVD process optimised in a cluster equipment for IC manufacturing. Microelectronic Engineering. 33(1-4). 3–13. 5 indexed citations

17.

Richard, E., et al.. (1997). CVD process for copper interconnection. Microelectronic Engineering. 37-38. 97–103. 10 indexed citations

18.

Braud, Flavie, et al.. (1997). Ultra thin diffusion barriers for Cu interconnections at the gigabit generation and beyond. Microelectronic Engineering. 33(1-4). 293–300. 14 indexed citations

19.

Richard, E., et al.. (1995). CVD Copper Deposition from Cu^I(HFAC)TMVS Studied Through a Modeling Experimental Design. Journal de Physique IV (Proceedings). 5(C5). C5–517. 2 indexed citations

20.

Richard, E., et al.. (1995). Process optimization of copper MOCVD using modeling experimental design. Applied Surface Science. 91(1-4). 129–133. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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