J. Van Olmen

1.3k citations

31 papers · 499 indexed · h-index 11

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Photolithography Techniques
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability

Papers in

Electronic, Optical and Magnetic Materials 11
- Copper Interconnects and Reliability 11
Instrumentation 2

Co-authors: Guruprasad Katti Wim Dehaene Michele Stucchi K. De Meyer Cedric Huyghebaert Eric Beyne Youssef Travaly Anne Jourdain
Journals: Microelectronics Reliability (7 papers)Microelectronic Engineering (2 papers)IEEE Electron Device Letters (1 paper)Applied Optics (1 paper)IEEE Transactions on Semiconductor Manufacturing (1 paper)
Partner nations: Belgium Netherlands Austria

In The Last Decade

J. Van Olmen

29 papers receiving 480 citations

Peers

Countries citing papers authored by J. Van Olmen

Since Specialization

Citations

This map shows the geographic impact of J. Van Olmen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Van Olmen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Van Olmen more than expected).

Fields of papers citing papers by J. Van Olmen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Van Olmen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Van Olmen. The network helps show where J. Van Olmen may publish in the future.

Co-authorship network

The 25 scholars most cited alongside J. Van Olmen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with J. Van Olmen Line = papers co-authored together J. Van Olmen links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	A 7-band CCD-in-CMOS multispectral TDI imager VUBIR (Vrije Universiteit Brussel) ·David San Segundo Bello, Eun-Ji Kim, P. Boulenc, Minglei Ma, Lin-Kun Wu, J. Van Olmen, Shoham, Jan Craninckx, L. Haspeslagh, Prathmesh Rajendra Bhiungade Bhiungade, M. Rosmeulen, Jonathan Borremans	2024	3
2	Novel technology for microlenses for imaging applications Applied Optics ·Vasyl Motsnyi, Ingrid De Wolf, Véronique Rochus, Xavier Rottenberg, Özlem Cangar, J. Van Olmen, Prathmesh Rajendra Bhiungade Bhiungade, Piet De Moor, Feng Wang	2018	5
3	Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors Sensors ·Paweł E. Malinowski, Epimitheas Georgitzikis, Jorick Maes, Ökkeş Küçükdağılkan, Salvá Verd A, J. Van Olmen, Piet De Moor, Paul Heremans, Zeger Hens, David Cheyns	2017	43
4	On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes ECS Transactions ·Vladimiro Ricardo Cordero Galarza, Lan Peng, Farid Sebaai, T Adrian Carpenter, Gail Percival, J. Van Olmen, Deniz Sabuncuoglu Tezcan, Frances M. Moore	2015	9
5	On the Fabrication of Backside Illuminated Image Sensors: Bonding Oxide, Edge Trimming and CMP Rework Routes ECS Meeting Abstracts ·Vladimiro Ricardo Cordero Galarza, Lan Peng, Farid Sebaai, T Adrian Carpenter, Gail Percival, J. Van Olmen, Deniz Sabuncuoglu Tezcan, Frances M. Moore	2014	0
6	Electronic-photonic integration in the helios project Jean-Marc Fédéli, Franz Schrank, Wim Bogaerts, Maria [UNESP] Encarnacao Beltrao Sposito, Lars Zimmermann, E. Augendre, Stéphane Bernabé, Jochen Kraft, J. Van Olmen, Deniz Sabuncuoglu Tezcan, Philippe Grosse, T. Enot	2013	2
7	Temperature dependent electrical characteristics of through-si-via (TSV) interconnections Guruprasad Katti, A. Mercha, Michele Stucchi, Zs. Tôkei, Dimitrios Velenis, J. Van Olmen, Cedric Huyghebaert, Anne Jourdain, Michał Rakowski, I. Debusschere, Ahmadreza Ahmadi-Abdashti, Herman Oprins, Wim Dehaene, K. De Meyer, Youssef Travaly, Eric Beyne, S. Biesemans, Bart Swinnen	2010	26
8	Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration AIP conference proceedings ·Chukwudi Okoro, Cedric Huyghebaert, J. Van Olmen, Riet Labie, Wulandari Wijaya, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Ehrenfried Zschech, Shinichi Ogawa, Paul S. Ho	2010	40
9	Through-Silicon-Via Capacitance Reduction Technique to Benefit 3-D IC Performance IEEE Electron Device Letters ·Guruprasad Katti, Michele Stucchi, J. Van Olmen, K. De Meyer, Wim Dehaene	2010	73
10	Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures Microelectronics Reliability ·Yusen Yang, Riet Labie, Ling Fang, Cheng Zhao, Aleksandar Radisic, J. Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf	2010	17
11	Photonics-CMOS 3D integration: copper through-silicon-via approach Ghent University Academic Bibliography (Ghent University) ·Maria [UNESP] Encarnacao Beltrao Sposito, Wim Bogaerts, J. Van Olmen, J. Van Aelst, Dries Van Thourhout, Deniz Sabuncuoglu Tezcan	2009	6
12	TSV metrology and inspection challenges Armansyah Armansyah, Youssef Travaly, J. Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Laura Hunnisett, Yinling Han, T Adrian Carpenter, Villalobos Ramírez M, 重義針原, Elizabeth I. Pope, Akane YAMAMICHI, Haiping Zhang, D. Levy, R. Cindy, O. Laksin	2009	8
13	Through-Si-Via Technology Solutions for 3D System Integration Eric Beyne, Bart Swinnen, J. Van Olmen, Deniz Sabuncuoglu Tezcan, Anne Jourdain, Alex Stock	2009	8
14	3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV) J. Van Olmen, Peter Lauridsen, Wim Dehaene, K. De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, A. Mercha, Michał Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen	2009	36
15	3D stacked ICs using Cu TSVs and Die to Wafer Hybrid Collective bonding Guruprasad Katti, Ali Merç, J. Van Olmen, Cedric Huyghebaert, Anne Jourdain, Michele Stucchi, Michał Rakowski, I. Debusschere, Ahmadreza Ahmadi-Abdashti, Wim Dehaene, K. De Meyer, Youssef Travaly, Eric Beyne, S. Biesemans, Bart Swinnen	2009	56
16	On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance IEEE Transactions on Semiconductor Manufacturing ·Youssef Travaly, Giovanna Zanolla, L. Carbonell, Zs. Tôkei, J. Van Olmen, Francesca Iacopi, M. Van Hove, Michele Stucchi, Karen Maex	2007	10
17	Low-damage damascene patterning of SiOC(H) low-k dielectrics Herbert Struyf, Adresse Address, J. Van Olmen, Francesca Iacopi, Olivier Richard, Youssef Travaly, M. Van Hove, Werner Boullart, S. Vanhaelemeersch	2005	4
18	Integration of Single Damascene 85/85 nm L/S copper trenches in Black Diamond using 193 nm optical lithography with dipole illumination J. Van Olmen, Wen‐Wei Wu, M. Van Hove, Youssef Travaly, Sywert Brongersma, B. Eyckens, Mireille Maenhoudt, J. Van Aelst, Herbert Struyf, S. Demuynck, Zs. Tôkei, I. Vervoort, Patricio Canepa Fernández, Carmen Concepción Hernández Hernández, Ivan Ciofi, Michele Stucchi, Karen Maex, Francesca Iacopi	2004	1
19	Overview of the kinetics of the early stages of electromigration under low (= realistic) current density stress Microelectronics Reliability ·J. Van Olmen, Jean Manca, W. De Ceuninck, L. De Schepper, Jeromy De Pledge, Ann Witvrouw, Karen Maex	1998	1
20	The thermally balanced bridge technique (TBBT): A new high resolution resistometric measurement technique for the study of electromigration-induced early resistance changes in metal stripes Microelectronics Reliability ·J. Van Olmen, W. De Ceuninck, L. De Schepper, A. Goldoni, Z. David Zuwiyya, F. Fantini	1997	4

About J. Van Olmen

J. Van Olmen is a scholar working on Electronic, Optical and Magnetic Materials, Instrumentation, Automotive Engineering, Electrical and Electronic Engineering and Surfaces, Coatings and Films, having authored 31 papers that have together received 499 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (12 papers), 3D IC and TSV technologies (12 papers), Copper Interconnects and Reliability (11 papers), Semiconductor materials and devices (7 papers), Additive Manufacturing and 3D Printing Technologies (6 papers), Semiconductor materials and interfaces (5 papers), Advancements in Photolithography Techniques (4 papers) and CCD and CMOS Imaging Sensors (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (478 citations), Electronic, Optical and Magnetic Materials (87 citations), Automotive Engineering (38 citations), Biomedical Engineering (113 citations) and Surfaces, Coatings and Films (18 citations). J. Van Olmen has collaborated with scholars based in Belgium, Netherlands and Austria. Frequent co-authors include Guruprasad Katti, Wim Dehaene, Michele Stucchi, K. De Meyer, Cedric Huyghebaert, Eric Beyne, Youssef Travaly, Anne Jourdain, Herbert Struyf and M. Van Hove. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, IEEE Electron Device Letters, Applied Optics and IEEE Transactions on Semiconductor Manufacturing.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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