Wenqi Zhang
- Automotive Engineering top 2%
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis 20
- Additive Manufacturing Materials and Processes 15
- Welding Techniques and Residual Stresses 15
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- 3D IC and TSV technologies 27
- Electronic Packaging and Soldering Technologies 24
- Semiconductor materials and devices 22
- Advancements in Semiconductor Devices and Circuit Design 12
- Polymers and Plastics top 10%
- Materials Chemistry top 10%
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- Laser-Matter Interactions and Applications 13
Wenqi Zhang
175 papers receiving 2.1k citations
Peers
Comparison fields: 5 of 99
- Automotive Engineering 363
- Mechanical Engineering 782
- Electrical and Electronic Engineering 1.1k
- Polymers and Plastics 188
- Materials Chemistry 518
Countries citing papers authored by Wenqi Zhang
This map shows the geographic impact of Wenqi Zhang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenqi Zhang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenqi Zhang more than expected).
Fields of papers citing papers by Wenqi Zhang
This network shows the impact of papers produced by Wenqi Zhang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenqi Zhang. The network helps show where Wenqi Zhang may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Wenqi Zhang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 2 | |
| 2 | 2024 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 4 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 33 | |
| 7 | 2024 | 3 | |
| 8 | 2023 | 1 | |
| 9 | 2023 | 10 | |
| 10 | 2023 | 5 | |
| 11 | 2023 | 8 | |
| 12 | 2022 | 25 | |
| 13 | 2017 | 23 | |
| 14 | Conformal barrier/seed layers deposition for voids free copper electroplating in high aspect ratio TSV | 2015 | 2 |
| 15 | Characterisation of Dynamic Mechanical Properties of Resistance Welding Machines | 2005 | 1 |
| 16 | 2003 | 48 | |
| 17 | High-power output from a compact OPCPA laser system | 2003 | 17 |
| 18 | Stimulated Radiation in High Harmonic Generation | 2000 | 1 |
| 19 | Cold welding - theoretical modeling of the weld formation | 1997 | 45 |
| 20 | Cold welding - experimental investigation of the surface preparation methods | 1997 | 42 |
About Wenqi Zhang
Wenqi Zhang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Structural Biology, having authored 195 papers that have together received 2.2k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (27 papers), Electronic Packaging and Soldering Technologies (24 papers), Semiconductor materials and devices (22 papers), Advanced Welding Techniques Analysis (20 papers), Additive Manufacturing Materials and Processes (15 papers), Welding Techniques and Residual Stresses (15 papers), Laser-Matter Interactions and Applications (13 papers) and Advancements in Semiconductor Devices and Circuit Design (12 papers). The work is most often cited by research in Automotive Engineering (363 citations), Mechanical Engineering (782 citations) and Electrical and Electronic Engineering (1.1k citations). Wenqi Zhang has collaborated with scholars based in China, Hong Kong and Taiwan. Frequent co-authors include Niels Bay, Haihong Zhu, Xiaoyan Zeng, Shasha Zhang, Huanqing Yang, Qingbin Cai, Zhichao Lin, Xiangning Xu, Hongye Dong and Cheng Mu. Their work appears in journals such as Welding Journal, Applied Surface Science, Journal of Alloys and Compounds, Small Methods and Materials Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.