L. Carbonell

1.0k total citations
52 papers, 836 citations indexed

About

L. Carbonell is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, L. Carbonell has authored 52 papers receiving a total of 836 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 31 papers in Electronic, Optical and Magnetic Materials and 11 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in L. Carbonell's work include Copper Interconnects and Reliability (31 papers), Semiconductor materials and devices (29 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). L. Carbonell is often cited by papers focused on Copper Interconnects and Reliability (31 papers), Semiconductor materials and devices (29 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). L. Carbonell collaborates with scholars based in Belgium, United States and France. L. Carbonell's co-authors include Karen Maex, Caroline M. Whelan, J. Van Aelst, Zs. Tôkei, Zsolt Tökei, Stefaan Decoutere, Brice De Jaeger, Shuzhen You, D. Wellekens and Jie Hu and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

L. Carbonell

51 papers receiving 813 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
L. Carbonell Belgium 14 691 320 183 155 138 52 836
Dipak Paramanik India 16 309 0.4× 135 0.4× 391 2.1× 106 0.7× 99 0.7× 39 648
Ningyang Liu China 13 210 0.3× 225 0.7× 178 1.0× 129 0.8× 381 2.8× 34 541
Ryota Ishii Japan 14 220 0.3× 207 0.6× 238 1.3× 162 1.0× 331 2.4× 41 580
M. Tłaczała Poland 14 481 0.7× 130 0.4× 233 1.3× 372 2.4× 321 2.3× 146 785
S. Nguyen United States 16 795 1.2× 466 1.5× 283 1.5× 83 0.5× 30 0.2× 56 964
Yann Lamy France 14 406 0.6× 156 0.5× 475 2.6× 260 1.7× 41 0.3× 38 922
Yunwei Ma United States 16 502 0.7× 398 1.2× 335 1.8× 84 0.5× 421 3.1× 27 817
J. Elders Netherlands 11 448 0.6× 132 0.4× 458 2.5× 109 0.7× 26 0.2× 16 775
H. Schellevis Netherlands 17 623 0.9× 61 0.2× 277 1.5× 119 0.8× 58 0.4× 63 877
E. Luna Mexico 13 215 0.3× 235 0.7× 321 1.8× 139 0.9× 347 2.5× 41 580

Countries citing papers authored by L. Carbonell

Since Specialization
Citations

This map shows the geographic impact of L. Carbonell's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L. Carbonell with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L. Carbonell more than expected).

Fields of papers citing papers by L. Carbonell

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L. Carbonell. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L. Carbonell. The network helps show where L. Carbonell may publish in the future.

Co-authorship network of co-authors of L. Carbonell

This figure shows the co-authorship network connecting the top 25 collaborators of L. Carbonell. A scholar is included among the top collaborators of L. Carbonell based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L. Carbonell. L. Carbonell is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Carbonell, L., et al.. (2013). Ultra-Low Copper Baths for Sub-35 nm Copper Interconnects. Journal of The Electrochemical Society. 160(12). D3255–D3259. 5 indexed citations
2.
Carbonell, L., Marc Schaekers, Karl Opsomer, et al.. (2013). Low temperature chemical vapour synthesis of Cu3Ge thin films for interconnect applications. Microelectronic Engineering. 120. 246–250. 6 indexed citations
3.
Carbonell, L., et al.. (2012). Ultra-Low Copper Baths for Sub-35nm Copper Interconnects. ECS Transactions. 41(35). 83–97. 3 indexed citations
4.
Swerts, Johan, Silvia Armini, L. Carbonell, et al.. (2011). Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 30(1). 14 indexed citations
5.
Croes, Kristof, Marianna Pantouvaki, L. Carbonell, et al.. (2011). Comparison between intrinsic and integrated reliability properties of low-k materials. 2F.3.1–2F.3.7. 10 indexed citations
6.
Carbonell, L., N. Heylen, Chao Zhao, et al.. (2010). Barrier and seed repair performance of thin RuTa films for Cu interconnects. Microelectronic Engineering. 88(5). 690–693. 6 indexed citations
7.
Li, Yunlong, Ivan Ciofi, L. Carbonell, et al.. (2007). Moisture Related Low-K Dielectric Reliability Before and After Thermal Annealing. 405–409. 8 indexed citations
8.
Demuynck, S., et al.. (2007). An investigation of ultra low-k dielectrics with high thermal stability for integration in memory devices. Microelectronic Engineering. 84(11). 2582–2586. 3 indexed citations
9.
Demuynck, S., Zs. Tôkei, Chao Zhao, et al.. (2007). Novel patterning shrink technique enabling sub-50 nm trench and contact integration. 43. 1–4. 1 indexed citations
10.
Travaly, Youssef, L. Carbonell, Zs. Tôkei, et al.. (2007). On a More Accurate Assessment of Scaled Copper/Low-k Interconnects Performance. IEEE Transactions on Semiconductor Manufacturing. 20(3). 333–340. 10 indexed citations
11.
Swinnen, Bart, Wouter Ruythooren, Piet De Moor, et al.. (2006). 3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias. 1–4. 161 indexed citations
12.
Carchon, G., L. Carbonell, S. Jenei, et al.. (2004). Wafer-level packaging technology for extended global wiring and inductors. 44. 103–106. 4 indexed citations
13.
Carbonell, L., et al.. (2003). Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 92. 281–286. 1 indexed citations
14.
Whelan, Caroline M., et al.. (2003). Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces. Microelectronic Engineering. 70(2-4). 551–557. 94 indexed citations
15.
Carbonell, L., et al.. (2003). The Impact of Annealing on the Corrosion Mechanism of Copper Films. MRS Proceedings. 781. 2 indexed citations
16.
Das, Abhishek, Quoc Toan Le, Yuki Furukawa, et al.. (2003). Characterisation of JSR’s spin-on hardmask FF-02. Microelectronic Engineering. 70(2-4). 308–313. 2 indexed citations
17.
Jenei, S., Stefaan Decoutere, Gillis Winderickx, et al.. (2001). High Q inductor add-on module in thick Cu/SiLK/sup TM/ single damascene. 107–109. 17 indexed citations
18.
Carbonell, L., Guido Mula, & S. Tatarenko. (1999). Influence of a compressive strain on the stoichiometry of the (001)CdTe surface during molecular beam epitaxy. Journal of Crystal Growth. 203(1-2). 61–66. 1 indexed citations
19.
Carbonell, L., et al.. (1999). Growth of ZnSe layers on β(2×4)As, (i×3)Te, and (4×2)Ga-terminated (001)GaAs substrates. Journal of Crystal Growth. 201-202. 502–505. 23 indexed citations
20.
Hartmann, Jean‐Michel, Alexandre Arnoult, L. Carbonell, V. H. Etgens, & S. Tatarenko. (1998). Reflection high-energy electron diffraction measurement of lattice-parameter oscillations during the homoepitaxial growth of CdTe. Physical review. B, Condensed matter. 57(24). 15372–15375. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Dipak Paramanik Breakdown of academic impact, for papers by Ningyang Liu Breakdown of academic impact, for papers by Ryota Ishii Breakdown of academic impact, for papers by M. Tłaczała Breakdown of academic impact, for papers by S. Nguyen Breakdown of academic impact, for papers by Yann Lamy Breakdown of academic impact, for papers by Yunwei Ma Breakdown of academic impact, for papers by J. Elders Breakdown of academic impact, for papers by H. Schellevis Breakdown of academic impact, for papers by E. Luna
Rankless by CCL
2026