N. Ohashi

535 total citations
32 papers, 382 citations indexed

About

N. Ohashi is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, N. Ohashi has authored 32 papers receiving a total of 382 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 22 papers in Electronic, Optical and Magnetic Materials and 13 papers in Biomedical Engineering. Recurrent topics in N. Ohashi's work include Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (17 papers) and Advanced Surface Polishing Techniques (12 papers). N. Ohashi is often cited by papers focused on Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (17 papers) and Advanced Surface Polishing Techniques (12 papers). N. Ohashi collaborates with scholars based in Japan. N. Ohashi's co-authors include Seiichi Kondo, Yoshio Homma, N. Owada, J. Noguchi, K. Hinode, Hiroshi Yamaguchi, Ken’ichi Takeda, Yasushi Goto, S. Kondo and Hiroyuki Maruyama and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Transactions on Electron Devices and IEEE Transactions on Power Delivery.

In The Last Decade

N. Ohashi

32 papers receiving 347 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
N. Ohashi Japan	10	290	200	194	84	50	32	382
W. Cote United States	8	334 1.2×	118 0.6×	170 0.9×	71 0.8×	49 1.0×	15	411
N. Owada Japan	9	214 0.7×	126 0.6×	140 0.7×	77 0.9×	60 1.2×	24	306
Dominique Averty France	10	152 0.5×	127 0.6×	58 0.3×	181 2.2×	44 0.9×	31	305
S. G. Malhotra United States	8	230 0.8×	75 0.4×	194 1.0×	103 1.2×	85 1.7×	18	367
D. Canaperi United States	13	599 2.1×	151 0.8×	235 1.2×	85 1.0×	116 2.3×	45	677
James G. Ryan United States	10	224 0.8×	68 0.3×	142 0.7×	117 1.4×	66 1.3×	25	352
D. Jawarani United States	10	284 1.0×	67 0.3×	139 0.7×	80 1.0×	56 1.1×	38	336
L.J. Tang Singapore	11	349 1.2×	103 0.5×	89 0.5×	172 2.0×	71 1.4×	32	434
Trace Hurd United States	7	231 0.8×	59 0.3×	118 0.6×	67 0.8×	57 1.1×	16	274
Hideki Kitada Japan	12	469 1.6×	141 0.7×	96 0.5×	44 0.5×	67 1.3×	61	534

Countries citing papers authored by N. Ohashi

Since Specialization

Citations

This map shows the geographic impact of N. Ohashi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Ohashi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Ohashi more than expected).

Fields of papers citing papers by N. Ohashi

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Ohashi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Ohashi. The network helps show where N. Ohashi may publish in the future.

Co-authorship network of co-authors of N. Ohashi

This figure shows the co-authorship network connecting the top 25 collaborators of N. Ohashi. A scholar is included among the top collaborators of N. Ohashi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Ohashi. N. Ohashi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Kondo, S., N. Ohashi, Hosei Nagano, et al.. (2006). Direct CMP on Porous Low-k Film for Damage-less Cu Integration. 164–166. 12 indexed citations

Furuya, Akira, N. Ohtsuka, N. Ohashi, Seiichi Kondo, & Shinichi Ogawa. (2005). Low-resistivity atomic-layer-deposited-TaN with atomic-layer-deposited-TaN/physical-vapor-deposited-Ta multilayer structure for multilevel Cu damascene interconnect. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 24(1). 103–105. 3 indexed citations

Noguchi, J., et al.. (2005). Dependence of Time-Dependent Dielectric Breakdown Lifetime on NH₃-Plasma Treatment in Cu Interconnects. Japanese Journal of Applied Physics. 44(7R). 4859–4859. 2 indexed citations

Kondo, S., et al.. (2004). Enhancement in electrical via-yield of porous low-k/Cu integration by reducing CMP pressure. 130–132. 1 indexed citations

Ohashi, N., et al.. (2004). Damage-free CMP towards 32nm-node porous low-k (k = 1.6)/Cu integration. 68–69. 5 indexed citations

Namiki, A., et al.. (2004). Characterization of patterned low-k film delamination during CMP for the 32nm node Cu/ultra low-k (k=1.6-1.8) integration. 239–241. 2 indexed citations

Kageyama, Seiji, et al.. (2004). Suppression of Cu extrusion into porous-MSQ film during chip-reliability test. 27–29. 1 indexed citations

Ohashi, N., et al.. (2004). Low damage ashing using H/sub 2//He plasma for porous ultra low-k. 147–149. 3 indexed citations

Yamada, Y., N. Konishi, N. Ohashi, & T. Kimura. (2003). Improved Cu abrasive-free polishing at 0.13 μm manufacturing and beyond. 108–110. 3 indexed citations

10.

Hashimoto, Takashi, et al.. (2002). Copper Wires for High Speed Logic LSI Prepared by Low Pressure Long Throw Sputtering Method. MATERIALS TRANSACTIONS. 43(7). 1599–1604. 4 indexed citations

11.

Shinohe, Takashi, et al.. (2002). Design criteria for high frequency, ultra high di/dt MAGTs. 153–156. 3 indexed citations

12.

Yamaguchi, Hiroshi, N. Ohashi, T. Imai, et al.. (2002). A 7 level metallization with Cu damascene process using newly developed abrasive free polishing. 264–266. 7 indexed citations

13.

Noguchi, J., N. Ohashi, Hiroshi Ashihara, et al.. (2002). Impact of low-k dielectrics and barrier metals on TDDB lifetime of Cu interconnects. 355–359. 25 indexed citations

14.

Noguchi, J., et al.. (2001). Effect of NH/sub 3/-plasma treatment and CMP modification on TDDB improvement in Cu metallization. IEEE Transactions on Electron Devices. 48(7). 1340–1345. 37 indexed citations

15.

Kondo, Seiichi, et al.. (2000). Slurry Chemical Corrosion and Galvanic Corrosion during Copper Chemical Mechanical Polishing. Japanese Journal of Applied Physics. 39(11R). 6216–6216. 57 indexed citations

16.

Kondo, Seiichi, et al.. (2000). Abrasive-Free Polishing for Copper Damascene Interconnection. Journal of The Electrochemical Society. 147(10). 3907–3907. 75 indexed citations

17.

Hirasawa, Shigeki, et al.. (1997). Analysis of drying shrinkage and flow due to surface tension of spin-coated films on topographic substrates. IEEE Transactions on Semiconductor Manufacturing. 10(4). 438–444. 16 indexed citations

18.

Ohashi, N., et al.. (1996). Improved spin‐on glass process with multilevel metallization. Electronics and Communications in Japan (Part II Electronics). 79(1). 75–82. 1 indexed citations

19.

Suzuki, Masahito, et al.. (1989). Development of a Substation Digital Protection and Control System Using a Fiber-Optic Local Area Network. IEEE Power Engineering Review. 9(7). 51–52. 6 indexed citations

20.

Suzuki, Mamoru, et al.. (1989). Development of a substation digital protection and control system using fiber-optic local area network. IEEE Transactions on Power Delivery. 4(3). 1668–1675. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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