Edward O. Shaffer

694 total citations
25 papers, 537 citations indexed

About

Edward O. Shaffer is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Edward O. Shaffer has authored 25 papers receiving a total of 537 indexed citations (citations by other indexed papers that have themselves been cited), including 15 papers in Electrical and Electronic Engineering, 13 papers in Mechanics of Materials and 11 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Edward O. Shaffer's work include Copper Interconnects and Reliability (11 papers), Electronic Packaging and Soldering Technologies (10 papers) and Metal and Thin Film Mechanics (5 papers). Edward O. Shaffer is often cited by papers focused on Copper Interconnects and Reliability (11 papers), Electronic Packaging and Soldering Technologies (10 papers) and Metal and Thin Film Mechanics (5 papers). Edward O. Shaffer collaborates with scholars based in United States, India and United Kingdom. Edward O. Shaffer's co-authors include P. H. Townsend, J. P. Godschalx, M. E. Mills, Steven J. Martin, Mónica Olvera de la Cruz, F. J. McGarry, Dilip Gersappe, David D. Hawn, Jang‐Hi Im and Nelson G. Rondan and has published in prestigious journals such as Physical Review Letters, Advanced Materials and Macromolecules.

In The Last Decade

Edward O. Shaffer

24 papers receiving 511 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Edward O. Shaffer United States 8 212 198 190 162 160 25 537
Jean Claude Wittmann France 4 271 1.3× 235 1.2× 210 1.1× 128 0.8× 129 0.8× 8 634
Andrew J. McKerrow United States 14 350 1.7× 65 0.3× 275 1.4× 145 0.9× 195 1.2× 39 657
Chang‐Chung Yang Taiwan 13 317 1.5× 225 1.1× 309 1.6× 143 0.9× 73 0.5× 15 641
Iwao Seo Japan 11 103 0.5× 125 0.6× 127 0.7× 200 1.2× 57 0.4× 24 399
S. J. Bai United States 12 164 0.8× 253 1.3× 98 0.5× 52 0.3× 57 0.4× 27 396
D. M. Lincoln United States 10 451 2.1× 712 3.6× 247 1.3× 98 0.6× 182 1.1× 14 1.2k
J. Gähde Germany 12 178 0.8× 215 1.1× 140 0.7× 70 0.4× 55 0.3× 26 455
John Busbee United States 10 146 0.7× 73 0.4× 143 0.8× 85 0.5× 100 0.6× 25 385
Michelle S. Meruvia Brazil 14 464 2.2× 344 1.7× 202 1.1× 138 0.9× 58 0.4× 31 680
Roland Himmelhuber United States 12 326 1.5× 345 1.7× 194 1.0× 90 0.6× 107 0.7× 30 694

Countries citing papers authored by Edward O. Shaffer

Since Specialization
Citations

This map shows the geographic impact of Edward O. Shaffer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Edward O. Shaffer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Edward O. Shaffer more than expected).

Fields of papers citing papers by Edward O. Shaffer

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Edward O. Shaffer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Edward O. Shaffer. The network helps show where Edward O. Shaffer may publish in the future.

Co-authorship network of co-authors of Edward O. Shaffer

This figure shows the co-authorship network connecting the top 25 collaborators of Edward O. Shaffer. A scholar is included among the top collaborators of Edward O. Shaffer based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Edward O. Shaffer. Edward O. Shaffer is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Harris, W. C., et al.. (2002). Development of TiSiN diffusion barriers for Cu/SiLK metallization schemes. 40–42. 1 indexed citations
2.
Shekhawat, Gajendra S., Oleg Kolosov, G. A. D. Briggs, et al.. (2002). Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration. 96–98. 4 indexed citations
3.
Shaffer, Edward O., David Price, R. A. Donaton, et al.. (2001). Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene. 60–62. 2 indexed citations
4.
Bian, Zailong, Guillermo M. Nuesca, Robert Geer, et al.. (2000). Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 18(5). 2463–2471. 3 indexed citations
5.
Bian, Zailong, Andreas Knorr, Alain E. Kaloyeros, et al.. (2000). Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 18(1). 252–261. 5 indexed citations
6.
Shekhawat, Gajendra S., Oleg Kolosov, G. A. D. Briggs, et al.. (2000). Nanoscale Elastic Imaging of Aluminum/Low-k Dielectric Interconnect Structures. MRS Proceedings. 612. 4 indexed citations
7.
Im, Jang‐Hi, et al.. (1999). On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications. Journal of Electronic Packaging. 122(1). 28–33. 30 indexed citations
8.
9.
Shaffer, Edward O., M. E. Mills, David D. Hawn, et al.. (1998). Adhesion Energy Measurements of Multilayer Low-K Dielectric Materials for ULSI Applications. MRS Proceedings. 511. 10 indexed citations
10.
Townsend, P. H., Steve Martin, J. P. Godschalx, et al.. (1997). Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric. MRS Proceedings. 476. 43 indexed citations
11.
Shaffer, Edward O., et al.. (1996). Designing reliable polymer coatings. Polymer Engineering and Science. 36(18). 2375–2381. 29 indexed citations
12.
Townsend, P. H., Edward O. Shaffer, M. E. Mills, J. Blackson, & Michael J. Radler. (1996). Interconnect Process Technology Using Perfluorocyclobutane (PFCB). MRS Proceedings. 443. 5 indexed citations
13.
14.
McGarry, F. J. & Edward O. Shaffer. (1994). A Method for Analyzing the Critical Adhesion Energy of Thin Film Coatings. MRS Proceedings. 356. 4 indexed citations
15.
Shaffer, Edward O., et al.. (1993). The effect of adhesive modulus on the performance of SMC lap shear joints. Journal of Adhesion Science and Technology. 7(11). 1171–1181. 10 indexed citations
16.
Radler, Michael J., Cyrus E. Crowder, Edward O. Shaffer, & P. H. Townsend. (1992). X-Ray Determination of Residual Stresses of Encapsulated Thin Aluminum Lines. MRS Proceedings. 264. 4 indexed citations
17.
Shaffer, Edward O., C. J. Carriere, & Robert A. Bubeck. (1992). Relative molecular weight distributions of cis‐polybenzoxazole/polyphosphoric acid rodlike liquid crystalline polymer solutions from dilute solution rheometry. Journal of Polymer Science Part B Polymer Physics. 30(3). 259–264. 2 indexed citations
18.
Shaffer, Edward O., P. H. Townsend, Michael J. Radler, & C. J. Carriere. (1991). Finite Element Analysis of the Mechanical Performance of Benzocyclobutene Structures in Multichip Modules.. MRS Proceedings. 239. 1 indexed citations
19.
Cruz, Mónica Olvera de la, Dilip Gersappe, & Edward O. Shaffer. (1990). Dynamics of DNA during pulsed-field gel electrophoresis. Physical Review Letters. 64(19). 2324–2327. 22 indexed citations
20.
Shaffer, Edward O. & Mónica Olvera de la Cruz. (1989). Dynamics of gel electrophoresis. Macromolecules. 22(3). 1351–1355. 45 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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