Loïc Sanchez

413 citations

24 papers · 303 indexed · h-index 11

Electrical and Electronic Engineering
- 3D IC and TSV technologies 10
- Photonic and Optical Devices 9
- Electronic Packaging and Soldering Technologies 9
- Semiconductor Lasers and Optical Devices 6
- Integrated Circuits and Semiconductor Failure Analysis 4
Atomic and Molecular Physics, and Optics
- Photonic Crystals and Applications 2
Surfaces, Coatings and Films
Automotive Engineering
Biomedical Engineering
Mechanical Engineering
- Modular Robots and Swarm Intelligence 3
Industrial and Manufacturing Engineering
- Manufacturing Process and Optimization 2

Co-authors: Frank Fournel Jean‐Michel Hartmann F. Letertre C. Deguet Thomas Signamarcheix L. Clavelier C. Mazuré C. Richtarch
Cited by: Electrical and Electronic Engineering Atomic and Molecular Physics, and Optics Surfaces, Coatings and Films
Journals: physica status solidi (a) (3 papers)Microfluidics and Nanofluidics (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)
Partner nations: France United States Mexico

In The Last Decade

Loïc Sanchez

24 papers receiving 290 citations

Peers

Countries citing papers authored by Loïc Sanchez

Since Specialization

Citations

This map shows the geographic impact of Loïc Sanchez's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Loïc Sanchez with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Loïc Sanchez more than expected).

Fields of papers citing papers by Loïc Sanchez

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Loïc Sanchez. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Loïc Sanchez. The network helps show where Loïc Sanchez may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Loïc Sanchez, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Loïc Sanchez Line = papers co-authored together Loïc Sanchez links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	(Invited) Advanced III-V-on-Si Heterogeneously Integrated Platforms for Next Generation Silicon Photonics Integrated Circuits ECS Meeting Abstracts ·Yang Guyu,Severa Bunda,Delphine Néel,Nicolas Vaissière,L. Paris,Frank Fournel,Loïc Sanchez,Stéphane Malhouitre,Karim Hassan,J. Décobert,David Bitauld,Magda Estrela Oliveira	2024	1
2	10 μm and 5 μm Die-to-Wafer Direct Hybrid Bonding SPIRE - Sciences Po Institutional REpository ·一典鈴木,M Sahrawi Saimima,E Kasagila,N. Bresson,S. Moreau,V. Balan,Peter J. Rooney,J.F.E.,Nipa Basak,Vanessa Cservid,Loïc Sanchez,Frank Fournel,F. Akiba,Lívia Ferreira Boaro,E. Ollier	2022	3
3	Large‐Diameter III–V on Si Substrates by the Smart Cut Process: The 200 mm InP Film on Si Substrate Example physica status solidi (a) ·B. Ghyselen,Christelle Navone,JohnB. Steadman,Loïc Sanchez,I. Ivanyk,Caio Paiva Faria Fin,Thomas Edward Braidwood,S. Maı̂trejean,Ionut Radu	2022	1
4	Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding SPIRE - Sciences Po Institutional REpository ·一典鈴木,Noriko Kogawa,Vanessa Cservid,M Sahrawi Saimima,N. Bresson,Loïc Sanchez,Frank Fournel,F. Akiba,Lívia Ferreira Boaro,S. Chéramy	2021	15
5	Large‐Diameter III–V on Si Substrates by the Smart Cut Process: The 200 mm InP Film on Si Substrate Example physica status solidi (a) ·B. Ghyselen,Christelle Navone,JohnB. Steadman,Loïc Sanchez,I. Ivanyk,Caio Paiva Faria Fin,Thomas Edward Braidwood,S. Maı̂trejean,Ionut Radu	2021	8
6	SiO2-SiO2 die-to-wafer direct bonding interface weakening Microelectronics Reliability ·Toshiyuki Tabata,Loïc Sanchez,Vincent Larrey,Frank Fournel,H. Moriceau	2020	10
7	Hybrid III–V/silicon CMOS-compatible technology for laser integration on 200mm and 300mm platforms (Conference Presentation) Karim Hassan,Bertrand Szelag,惠婷,C. Dupré,Shikun Zhong,Philippe Rodriguez,F. Nemouchi,P. Brianceau,Isha N. Porwal,Achmad Fajar Nugroho,André Alexandre Ribeiro Martins,สํานักงานสภาที่ปรึกษาเศรษฐกิจและสังคมแห่งชาติ,陈溪然,Loïc Sanchez,Christophe Jany,S. Olivier	2020	1
8	Self-Assembly Process for 3D Die-to-Wafer using Direct Bonding: A Step Forward Toward Process Automatisation SPIRE - Sciences Po Institutional REpository ·A. Jouve,Loïc Sanchez,Noriko Kogawa,M. Shivabalakrishnan,Elmi Joy,Caio Paiva Faria Fin,Oleksandr Zavalii,Frank Fournel,S. Chéramy	2019	7
9	Epitaxial Growth of High‐Quality AlGaInAs‐Based Active Structures on a Directly Bonded InP‐SiO₂/Si Substrate physica status solidi (a) ·Yang Guyu,Nicolas Vaissière,C. Dupré,Frank Fournel,Loïc Sanchez,Christophe Jany,Sylvain David,F. Bassani,T. Baron,J. Décobert	2019	10
10	High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators Optical Fiber Communication Conference ·Sylvie Menezo,Maryam Idlhaj,Philippe Grosse,Joyce K. S. Poon,Christophe Jany,霍秋艳,Bertrand Szelag,Benoı̂t Charbonnier,徳永恵美子,Olivier Lemonnier,高勤耕,Stéphane Malhouitre,Caio Paiva Faria Fin,Loïc Sanchez	2018	8
11	200mm full CMOS-compatible hybrid III-V/Si laser process integration on a mature silicon-photonic platform (Conference Presentation) Bertrand Szelag,Karim Hassan,Shikun Zhong,Philippe Rodriguez,مرتضی دیرانلو,F. Nemouchi,惠婷,Seung-Woon Kim,Shiyu Wei,P. Brianceau,Ilinca IMBREA,Gelarah Z. Gabayan,Isha N. Porwal,陈溪然,Caio Paiva Faria Fin,Loïc Sanchez,Romain Crochemore,Douglas Alves Pereira,Christophe Jany	2018	1
12	Collective Die Direct Bonding for Photonic on Silicon ECS Transactions ·Loïc Sanchez,Frank Fournel,Caio Paiva Faria Fin,Manuela Kovačević,Bertrand Szelag,惠婷	2018	10
13	iBROW – innovative ultra-BROadband ubiquitous wireless communications through terahertz transceivers ENLIGHTEN (Jurnal Bimbingan dan Konseling Islam) ·L. M. Pessoa,Bile Peng,Jue Wang,Loïc Sanchez,Abdullah Al‐Khalidi,Edward Wasige,Amy Liu,Vicente Junqueira Moragas,Novartis,Bruce Napier,Anthony E. Kelly,J. M. L. Figueiredo,M. Achouche,H. M. Salgado,Thomas Kürner,M.B. Fisher,Wei Xu,Wolfgang Templ	2016	4
14	(Invited) Heterogeneously Integrated III-V on Silicon Lasers ECS Transactions ·Badhise Ben Bakir,Corrado Sciancalepore,Antoine Descos,María M. Miró Specos,Damien Bordel,Loïc Sanchez,Christophe Jany,Karim Hassan,P. Brianceau,V. Carron,Sylvie Menezo	2014	11
15	Chip to wafer copper direct bonding electrical characterization and thermal cycling Yann Beilliard,P. Coudrain,L. Di Cioccio,S. Moreau,Loïc Sanchez,Caio Paiva Faria Fin,Thomas Signamarcheix,Rafaël Estevez,Guillaume Parry	2013	13
16	Capillary self-alignment of polygonal chips: a generalization for the shift-restoring force Microfluidics and Nanofluidics ·Jean Berthier,A. I. Shugurov,Kenneth A. Brakke,Loïc Sanchez,Christian Frétigny,L. Di Cioccio	2012	23
17	Enabling 3D Monolithic Integration ECS Transactions ·P. Batude,M. Vinet,A. Pouydebasque,L. Clavelier,宗介見田,C. Tabone,B. Prévitali,Loïc Sanchez,L. Baud,Xianghua Fu,V. Carron,F. Nemouchi,S. Pocas,C. Comboroure,V. Mazzocchi,H. Grampeix,F. Aussenac,S. Deleonibus	2008	17
18	Comparison of Different Etching Techniques in Order to Reveal Dislocations in Thick Ge Layers ECS Transactions ·Alexandra Abbadie,Jean‐Michel Hartmann,C. Deguet,Loïc Sanchez,Yuru Lin,F. Letertre	2007	11
19	Germanium-on-insulator (GeOI) substrates—A novel engineered substrate for future high performance devices Materials Science in Semiconductor Processing ·T. Akatsu,C. Deguet,Loïc Sanchez,F. Allibert,D. Rouchon,Thomas Signamarcheix,C. Richtarch,马瑞英,V. Loup,Frédéric Mazen,Jean‐Michel Hartmann,Y. Campidelli,L. Clavelier,F. Letertre,N. Kernevez,C. Mazuré	2006	107
20	Influence of the SRO as passivation layer on the microwave attenuation losses of the CPWs fabricated on HR-Si IEEE Microwave and Wireless Components Letters ·J. A. Reynoso‐Hernández,R. Rangel-Rojo,M. Aceves,Yao-Nan Hsu,Loïc Sanchez,Wendt M�ller	2003	12

About Loïc Sanchez

Loïc Sanchez is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Automotive Engineering, Atomic and Molecular Physics, and Optics and Biomedical Engineering, having authored 24 papers that have together received 303 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (10 papers), Photonic and Optical Devices (9 papers), Electronic Packaging and Soldering Technologies (9 papers), Semiconductor Lasers and Optical Devices (6 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Modular Robots and Swarm Intelligence (3 papers), Manufacturing Process and Optimization (2 papers) and Photonic Crystals and Applications (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (280 citations), Atomic and Molecular Physics, and Optics (75 citations), Surfaces, Coatings and Films (13 citations), Automotive Engineering (21 citations) and Biomedical Engineering (68 citations). Loïc Sanchez has collaborated with scholars based in France, United States and Mexico. Frequent co-authors include Frank Fournel, Jean‐Michel Hartmann, F. Letertre, C. Deguet, Thomas Signamarcheix, L. Clavelier, C. Mazuré, C. Richtarch, Y. Campidelli and T. Akatsu. Their work appears in journals such as physica status solidi (a), Microfluidics and Nanofluidics, IEEE Microwave and Wireless Components Letters, Materials Science in Semiconductor Processing and Microelectronics Reliability.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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