King-Jien Chui

482 total citations
40 papers, 354 citations indexed

About

King-Jien Chui is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, King-Jien Chui has authored 40 papers receiving a total of 354 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 6 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in King-Jien Chui's work include Semiconductor materials and devices (22 papers), 3D IC and TSV technologies (21 papers) and Advancements in Semiconductor Devices and Circuit Design (13 papers). King-Jien Chui is often cited by papers focused on Semiconductor materials and devices (22 papers), 3D IC and TSV technologies (21 papers) and Advancements in Semiconductor Devices and Circuit Design (13 papers). King-Jien Chui collaborates with scholars based in Singapore, Taiwan and Japan. King-Jien Chui's co-authors include Kah‐Wee Ang, Yee‐Chia Yeo, Ganesh S. Samudra, Chih-Hang Tung, Narayanan Balasubramanian, Mingfu Li, Vladimir Bliznetsov, A. O. Adeyeye, Ming Fu Li and Anyan Du and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Electron Devices.

In The Last Decade

King-Jien Chui

36 papers receiving 346 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
King-Jien Chui Singapore	9	318	88	86	59	28	40	354
Jeffrey Lam Singapore	8	195 0.6×	78 0.9×	70 0.8×	37 0.6×	46 1.6×	76	261
H. Goebel Germany	10	313 1.0×	31 0.4×	76 0.9×	73 1.2×	34 1.2×	30	357
Wilfried Lerch Germany	9	293 0.9×	119 1.4×	46 0.5×	93 1.6×	13 0.5×	43	332
Matthias Wietstruck Germany	11	419 1.3×	46 0.5×	147 1.7×	89 1.5×	16 0.6×	95	478
Y. Le Tiec France	10	431 1.4×	62 0.7×	88 1.0×	70 1.2×	15 0.5×	23	468
Loïc Sanchez France	11	280 0.9×	75 0.9×	68 0.8×	46 0.8×	10 0.4×	24	303
C. Torregiani Belgium	10	229 0.7×	91 1.0×	38 0.4×	30 0.5×	11 0.4×	18	272
B. Roberds United States	9	461 1.4×	53 0.6×	84 1.0×	108 1.8×	41 1.5×	15	503
Dong Kyun Sohn Singapore	12	351 1.1×	114 1.3×	69 0.8×	68 1.2×	64 2.3×	46	386

Countries citing papers authored by King-Jien Chui

Since Specialization

Citations

This map shows the geographic impact of King-Jien Chui's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by King-Jien Chui with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites King-Jien Chui more than expected).

Fields of papers citing papers by King-Jien Chui

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by King-Jien Chui. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by King-Jien Chui. The network helps show where King-Jien Chui may publish in the future.

Co-authorship network of co-authors of King-Jien Chui

This figure shows the co-authorship network connecting the top 25 collaborators of King-Jien Chui. A scholar is included among the top collaborators of King-Jien Chui based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with King-Jien Chui. King-Jien Chui is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Li, Hongyu, et al.. (2024). Design and Fabrication of 2.5D Cryogenic Interposer With Integrated Superconducting TSVs and Resonators. 458–463.

Li, Hongyu, Chong Ser Choong, Ding Huang, et al.. (2023). Indium-based Flip-chip Interconnect for Cryogenic Packaging. 970–973.

Hu, Liangxing, Ding Huang, Chit Siong Lau, et al.. (2023). Room Temperature Plasma-Enhanced Niobium-Niobium Wafer Bonding for 3D Integration of Superconducting Interconnects for Quantum Processing. 404–408. 1 indexed citations

Chui, King-Jien, et al.. (2023). Demonstration and Challenges of Through Si Interposer (TSI) with 5-layer Frontside Cu Metal and 2-layer Backside Cu RDL. 1067–1070.

Li, Hongyu, et al.. (2022). 3D Cryogenic Interposer for Quantum Computing Application. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1546–1550. 5 indexed citations

Kawano, Masaya, et al.. (2022). Wafer Stacked Wide I/O DRAM with One-step TSV Technology. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 143–148. 2 indexed citations

Kawano, Masaya, et al.. (2021). One-step TSV process development for 4-layer wafer stacked DRAM. j90 c. 673–679. 3 indexed citations

Ji, Hongmiao & King-Jien Chui. (2021). Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding. 28–32. 8 indexed citations

Chui, King-Jien, et al.. (2020). A 2-tier Embedded 3D Capacitor with High Aspect Ratio TSV. 611–616. 2 indexed citations

10.

Chui, King-Jien, et al.. (2017). Under-Bump Metallization Contact Resistance ( $R_{c}$ ) Characterization at 10- $\mu \text{m}$ Polymer Passivation Opening. IEEE Transactions on Components Packaging and Manufacturing Technology. 7(10). 1592–1597. 6 indexed citations

11.

Chui, King-Jien, et al.. (2016). A Cost-Effective, CMP-Less, Via-Last TSV Process for High Density RDL Applications. 277–282. 5 indexed citations

12.

Ang, Kah‐Wee, King-Jien Chui, Chih-Hang Tung, et al.. (2007). Enhanced Carrier Transport in Strained Bulk N-MOSFETs with Silicon-Carbon Source/Drain Stressors. National University of Singapore. 1–2. 1 indexed citations

13.

Chui, King-Jien, A. O. Adeyeye, & Mo‐Huang Li. (2007). Effect of seed layer on the sensitivity of exchange biased planar Hall sensor. Sensors and Actuators A Physical. 141(2). 282–287. 5 indexed citations

14.

Chui, King-Jien, D. Tripathy, & A. O. Adeyeye. (2007). Temperature dependence of magnetotransport properties of Ni80Fe20∕Fe50Mn50∕Ni80Fe20 trilayers. Journal of Applied Physics. 101(9). 12 indexed citations

15.

Ang, Kah‐Wee, King-Jien Chui, Chih-Hang Tung, et al.. (2007). Strained Thin-Body p-MOSFET With Condensed Silicon-Germanium Source/Drain for Enhanced Drive Current Performance. IEEE Electron Device Letters. 28(6). 509–512. 13 indexed citations

16.

Ang, Kah‐Wee, King-Jien Chui, Chih-Hang Tung, et al.. (2007). Enhanced Strain Effects in 25-nm Gate-Length Thin-Body nMOSFETs With Silicon–Carbon Source/Drain and Tensile-Stress Liner. IEEE Electron Device Letters. 28(4). 301–304. 13 indexed citations

17.

Ang, Kah‐Wee, King-Jien Chui, Vladimir Bliznetsov, et al.. (2006). Thin body silicon-on-insulator N-MOSFET with silicon-carbon source/drain regions for performance enhancement. 497–500. 24 indexed citations

18.

Chui, King-Jien, Kah‐Wee Ang, Huiqi Wang, et al.. (2006). Source/drain germanium condensation for p-channel strained ultra-thin body transistors. 86. 493–496. 4 indexed citations

19.

Liow, Tsung-Yang, Rinus T. P. Lee, King-Jien Chui, et al.. (2006). Sub-30 nm Strained P-Channel FinFETs with Condensed SiGe Source/Drain Stressors. 3 indexed citations

20.

Chui, King-Jien, A. O. Adeyeye, & Mo‐Huang Li. (2006). Detection of a single magnetic dot using a Planar Hall sensor. Journal of Magnetism and Magnetic Materials. 310(2). e992–e993. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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