V. Balan

767 total citations
21 papers, 156 citations indexed

About

V. Balan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, V. Balan has authored 21 papers receiving a total of 156 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 4 papers in Mechanical Engineering. Recurrent topics in V. Balan's work include 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Advanced Surface Polishing Techniques (6 papers). V. Balan is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (7 papers) and Advanced Surface Polishing Techniques (6 papers). V. Balan collaborates with scholars based in France, Austria and Netherlands. V. Balan's co-authors include A. Jouve, S. Lhostis, Frank Fournel, A. Pradel, Tao Pan, Caroline Vigreux, M. I. Alonso, Andreu Llobera, L. Arnaud and Carlos Domı́nguez and has published in prestigious journals such as Journal of Non-Crystalline Solids, Microelectronic Engineering and Wireless Personal Communications.

In The Last Decade

V. Balan

18 papers receiving 148 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
V. Balan France 8 141 36 35 29 19 21 156
E. Deloffre France 11 196 1.4× 25 0.7× 58 1.7× 27 0.9× 25 1.3× 26 208
Siddharth Ravichandran United States 12 287 2.0× 50 1.4× 18 0.5× 19 0.7× 22 1.2× 24 327
D. Bouchu France 11 267 1.9× 39 1.1× 105 3.0× 33 1.1× 23 1.2× 33 294
Minseok Kang South Korea 11 262 1.9× 28 0.8× 23 0.7× 25 0.9× 6 0.3× 42 300
Bernhard Rebhan Austria 9 209 1.5× 34 0.9× 64 1.8× 17 0.6× 51 2.7× 26 237
T. Lacrevaz France 7 145 1.0× 33 0.9× 37 1.1× 36 1.2× 8 0.4× 37 172
Ricardo Cotrin Teixeira Brazil 7 140 1.0× 69 1.9× 11 0.3× 53 1.8× 6 0.3× 40 177
Ting-Yen Chiang United States 8 292 2.1× 21 0.6× 52 1.5× 51 1.8× 29 1.5× 11 317
El Mehdi Bazizi United States 8 228 1.6× 43 1.2× 12 0.3× 37 1.3× 5 0.3× 50 250
Dan Kinzer United States 11 318 2.3× 15 0.4× 20 0.6× 17 0.6× 21 1.1× 31 333

Countries citing papers authored by V. Balan

Since Specialization
Citations

This map shows the geographic impact of V. Balan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Balan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Balan more than expected).

Fields of papers citing papers by V. Balan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Balan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Balan. The network helps show where V. Balan may publish in the future.

Co-authorship network of co-authors of V. Balan

This figure shows the co-authorship network connecting the top 25 collaborators of V. Balan. A scholar is included among the top collaborators of V. Balan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with V. Balan. V. Balan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fournel, Frank, et al.. (2024). Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches. 1–3. 3 indexed citations
2.
Li, Suwen, et al.. (2024). Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bonding. SPIRE - Sciences Po Institutional REpository. 19–19. 4 indexed citations
3.
Balan, V., et al.. (2024). Wearable Self-Grounding Slit Antenna for Biomedical Applications. Wireless Personal Communications. 139(4). 2409–2425.
4.
5.
Bresson, N., S. Moreau, V. Balan, et al.. (2022). 10 μm and 5 μm Die-to-Wafer Direct Hybrid Bonding. SPIRE - Sciences Po Institutional REpository. 31–38. 3 indexed citations
6.
Jouve, A., Romain Crochemore, V. Balan, et al.. (2020). A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors. SPIRE - Sciences Po Institutional REpository. 201–209. 11 indexed citations
7.
Stewart, Paul, N. Bresson, G. Romano, et al.. (2019). Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. SPIRE - Sciences Po Institutional REpository. 1–5. 9 indexed citations
8.
Moreau, S., S. Lhostis, D. Bouchu, et al.. (2019). Robustness and reliability achievements for direct hybrid bonding integration: a review. SPIRE - Sciences Po Institutional REpository. 11–11. 2 indexed citations
9.
Arnaud, L., S. Moreau, A. Jouve, et al.. (2018). Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. 4D.4–1. 16 indexed citations
10.
Perrot, C., V. Balan, Nan-Rong Chiou, et al.. (2017). Chemical/mechanical balance management through pad microstructure in CMP. Microelectronic Engineering. 195. 36–40. 7 indexed citations
11.
Jouve, A., V. Balan, N. Bresson, et al.. (2017). 1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy. HAL (Le Centre pour la Communication Scientifique Directe). 1–2. 27 indexed citations
12.
Moreau, S., D. Bouchu, V. Balan, et al.. (2016). Mass Transport-Induced Failure of Hybrid Bonding-Based Integration for Advanced Image Sensor Applications. 1940–1945. 11 indexed citations
13.
Rebhan, Bernhard, S. Lhostis, E. Deloffre, et al.. (2015). 200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS. 1–4. 16 indexed citations
14.
Balan, V., et al.. (2012). CMP Process Optimization for Bonding Applications. 1–7. 4 indexed citations
15.
Balan, V., et al.. (2012). CMP Evaluation of Reusable Polishing Pad using Auxiliary Plate. 1–6.
16.
Poiroux, T., M. Vinet, F. Nemouchi, et al.. (2009). Highly performant FDSOI pMOSFETs with metallic source/drain. 87. 88–89. 3 indexed citations
17.
Fick, Jochen, et al.. (2004). Photoluminescence and waveguiding in sputtered films of Er-doped chalcogenide glasses. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5451. 327–327. 4 indexed citations
18.
Kern, Pierre, V. Balan, Caroline Vigreux, et al.. (2003). Singlemode planar optics for thermal infrared wavelengths astronomical interferometry. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 4838. 1344–1344.
19.
Balan, V., Caroline Vigreux, A. Pradel, et al.. (2003). Chalcogenide glass-based rib ARROW waveguide. Journal of Non-Crystalline Solids. 326-327. 455–459. 20 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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