N. Bresson

565 citations

36 papers · 365 indexed · h-index 11

Impact in

Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Photonic and Optical Devices
Automotive Engineering
- Additive Manufacturing and 3D Printing Technologies

Papers in

Electrical and Electronic Engineering 35
- 3D IC and TSV technologies 21
- Electronic Packaging and Soldering Technologies 16
- Semiconductor materials and devices 16
- Advancements in Semiconductor Devices and Circuit Design 11
- Integrated Circuits and Semiconductor Failure Analysis 7
Industrial and Manufacturing Engineering 4

Co-authors: S. Cristoloveanu C. Mazuré F. Letertre Frank Fournel Hiroshi Iwai S. Moreau S. Chéramy S. Lhostis
Journals: Microelectronic Engineering (2 papers)Solid-State Electronics (2 papers)IEEE Transactions on Electron Devices (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Applied Physics Letters (1 paper)
Partner nations: France Japan United States

In The Last Decade

N. Bresson

36 papers receiving 344 citations

Peers

Countries citing papers authored by N. Bresson

Since Specialization

Citations

This map shows the geographic impact of N. Bresson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Bresson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Bresson more than expected).

Fields of papers citing papers by N. Bresson

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Bresson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Bresson. The network helps show where N. Bresson may publish in the future.

Co-authorship network

The 25 scholars most cited alongside N. Bresson, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with N. Bresson Line = papers co-authored together N. Bresson links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	One million quality factor integrated ring resonators in the mid‐infrared Nanophotonics ·George Gidudu, Si-ran Tao, 韦芦桂, WU Jing-ke, Vincent Reboud, N. Bresson, Jean-Michel Hartmann, V. Mathieu, Guanghui Ren, Andreas Boes, Arnan Mitchell, Christelle Monat, Christian Grillet	2025	2
2	Fine pitch Nb-Nb Direct Bonding for quantum applications SPIRE - Sciences Po Institutional REpository ·Juliana Kapetanov, Tomas L. Östberg, N. Bresson, Vanessa Nobrega da Silva, Frank Fournel, Christophe Morales, LI Ren-zhon, Candice Thomas, Jean Charbonnier	2024	2
3	Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications SPIRE - Sciences Po Institutional REpository ·Lucía Gil de Montes Garín, Stéphane Nicolas, N. Bresson, M. Assous, S. Borel	2023	13
4	10 μm and 5 μm Die-to-Wafer Direct Hybrid Bonding SPIRE - Sciences Po Institutional REpository ·一典鈴木, M Sahrawi Saimima, E Kasagila, N. Bresson, S. Moreau, V. Balan, Peter J. Rooney, J.F.E., Nipa Basak, Vanessa Cservid, Loïc Sanchez, Frank Fournel, F. Akiba, Lívia Ferreira Boaro, E. Ollier	2022	3
5	A simple test structure for the electrical characterization of front and back channels for advanced SOI technology development Solid-State Electronics ·Ach. Syaiful A'la, I. Ionica, F. Milési, N. Bresson, Sonny Carter, S. Cristoloveanu, S. Reboh	2021	1
6	3D interconnection using copper direct hybrid bonding for GaN on silicon wafer SPIRE - Sciences Po Institutional REpository ·Tomas L. Östberg, L. Arnaud, PETER C. DONSHIK, Yerbol Yerbayev, S. Moreau, Romain Crochemore, N. Bresson, Bernard Aventurier	2021	5
7	Towards $5\mu \mathrm{m}$ interconnection pitch with Die-to-Wafer direct hybrid bonding SPIRE - Sciences Po Institutional REpository ·一典鈴木, Noriko Kogawa, Vanessa Cservid, M Sahrawi Saimima, N. Bresson, Loïc Sanchez, Frank Fournel, F. Akiba, Lívia Ferreira Boaro, S. Chéramy	2021	15
8	Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation IEEE Transactions on Components Packaging and Manufacturing Technology ·Candice Thomas, Jean Charbonnier, Arnaud Garnier, N. Bresson, D. Bouchu, S. Moreau, Andreas Maier, M. Vinet	2021	6
9	Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields SPIRE - Sciences Po Institutional REpository ·A. Jouve, L. Sanchez, Noriko Kogawa, N. Bresson, Frank Fournel, F. Akiba, Lívia Ferreira Boaro	2019	7
10	Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development SPIRE - Sciences Po Institutional REpository ·一典鈴木, Paul Stewart, Tomas L. Östberg, Jibi Belghese, Elmi Joy, N. Bresson, G. Romano, Daniel Scevola, V. Balan, J. Dechamp, Marc Zussy, Yerbol Yerbayev, Noriko Kogawa, L. Sanchez, A. Jouve, Frank Fournel, S. Chéramy	2019	9
11	Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability L. Arnaud, S. Moreau, A. Jouve, Clara E. Pablos-Puertas, Didier Lattard, Frank Fournel, Nipa Basak, Rreze Kryeziu, V. Balan, N. Bresson, S. Lhostis, 구난희, E. Deloffre, Stephanie D. Bower, A. Farcy, 梁成功, H. M. Scott	2018	16
12	1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy HAL (Le Centre pour la Communication Scientifique Directe) ·A. Jouve, V. Balan, N. Bresson, L. Matos, Frank Fournel, Rreze Kryeziu, Yerbol Yerbayev, Christelle L. Martinez Estrada, C. Beitia, L. Arnaud, S. Chéramy, S. Lhostis, A. Farcy, Stephanie D. Bower, A. I. Shugurov	2017	27
13	Development of fine pitch interconnections for 3D integrated circuits Aslam Nauman, Arnaud Garnier, N. Bresson, F. Ponthenier, Dorothea Howe, F. Casset, A. Jouve, Didier Lattard, S. Chéramy	2016	5
14	Through Silicon Via technology using tungsten metallization G. Parès, N. Bresson, S. Minoret, V. Lapras, P. Brianceau, Yanlong Peng, Adda Mascaro-Blanco, N. Sillon	2011	23
15	Detailed Investigation of Geometrical Factor for Pseudo-MOS Transistor Technique IEEE Transactions on Electron Devices ·Kenji Komiya, N. Bresson, Zhenjiang Gong, S. Cristoloveanu, Yasuhisa Ōmura	2005	22
16	Integration of buried insulators with high thermal conductivity in SOI MOSFETs: Thermal properties and short channel effects Solid-State Electronics ·N. Bresson, S. Cristoloveanu, C. Mazuré, F. Letertre, Hiroshi Iwai	2005	47
17	Ultra-thin strained SOI substrate analysis by pseudo-MOS measurements Microelectronic Engineering ·C. Gallon, (unknown), N. Bresson, S. Cristoloveanu, F. Allibert, Darren Smeath, (unknown), D. Delille, (unknown), Jean‐Michel Hartmann, T. Ernst, F. Andrieu, Y. Campidelli, B. Ghyselen, Ian Cayrefourcq, Frank Fournel, N. Kernevez, T. Skotnicki	2005	4
18	Alternative dielectrics for advanced SOI MOSFETs: thermal properties and short channel effects N. Bresson, S. Cristoloveanu, سید غلامرضا اعتماد, C. Mazuré, F. Letertre, Hiroshi Iwai	2005	3
19	Charge trapping in irradiated SOI wafers measured by second harmonic generation IEEE Transactions on Nuclear Science ·Bongim Jun, Ronald D. Schrimpf, Daniel M. Fleetwood, Zoopah Inayat, Yossadara Luna-Téllez, Sergey N. Rashkeev, Yuru Lin, N. Bresson, Igor José Boruchok Gudeiki, S. Cristoloveanu, N. H. Tolk	2004	14
20	Innovating SOI films: impact of thickness and temperature Microelectronic Engineering ·N. Bresson, S. Cristoloveanu	2004	6

About N. Bresson

N. Bresson is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering, Automotive Engineering, General Materials Science and Electronic, Optical and Magnetic Materials, having authored 36 papers that have together received 365 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (16 papers), Semiconductor materials and devices (16 papers), Advancements in Semiconductor Devices and Circuit Design (11 papers), Integrated Circuits and Semiconductor Failure Analysis (7 papers), Copper Interconnects and Reliability (4 papers), Advanced Surface Polishing Techniques (4 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (341 citations), Automotive Engineering (37 citations), Electronic, Optical and Magnetic Materials (35 citations), Ceramics and Composites (9 citations) and Atomic and Molecular Physics, and Optics (47 citations). N. Bresson has collaborated with scholars based in France, Japan and United States. Frequent co-authors include S. Cristoloveanu, C. Mazuré, F. Letertre, Frank Fournel, Hiroshi Iwai, S. Cristoloveanu, S. Moreau, S. Chéramy, S. Lhostis and L. Arnaud. Their work appears in journals such as Microelectronic Engineering, Solid-State Electronics, IEEE Transactions on Electron Devices, IEEE Transactions on Components Packaging and Manufacturing Technology and Applied Physics Letters.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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