S. Moreau

1.7k total citations
108 papers, 966 citations indexed

About

S. Moreau is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, S. Moreau has authored 108 papers receiving a total of 966 indexed citations (citations by other indexed papers that have themselves been cited), including 78 papers in Electrical and Electronic Engineering, 31 papers in Electronic, Optical and Magnetic Materials and 17 papers in Biomedical Engineering. Recurrent topics in S. Moreau's work include 3D IC and TSV technologies (59 papers), Electronic Packaging and Soldering Technologies (42 papers) and Copper Interconnects and Reliability (31 papers). S. Moreau is often cited by papers focused on 3D IC and TSV technologies (59 papers), Electronic Packaging and Soldering Technologies (42 papers) and Copper Interconnects and Reliability (31 papers). S. Moreau collaborates with scholars based in France, United States and Switzerland. S. Moreau's co-authors include L. Arnaud, S. Lhostis, D. Bouchu, C. Chappaz, E. Babin, H. Frémont, F. Lorut, Thomas Frank, Philip R. LeDuc and Aurélie Thuaire and has published in prestigious journals such as Nano Letters, Journal of Applied Physics and Analytica Chimica Acta.

In The Last Decade

S. Moreau

98 papers receiving 927 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. Moreau France 16 648 189 147 94 71 108 966
Hiroaki Kakinuma Japan 21 519 0.8× 40 0.2× 158 1.1× 5 0.1× 16 0.2× 96 1.2k
Keisuke Hirata Japan 16 289 0.4× 94 0.5× 26 0.2× 91 1.0× 44 0.6× 38 740
Haidong Liang China 18 357 0.6× 70 0.4× 679 4.6× 6 0.1× 5 0.1× 67 1.3k
Adele Moatti United States 12 163 0.3× 112 0.6× 115 0.8× 8 0.1× 8 0.1× 25 609
Jae Hong Park South Korea 16 191 0.3× 34 0.2× 381 2.6× 2 0.0× 29 0.4× 58 735
Nahyun Kim South Korea 15 138 0.2× 31 0.2× 185 1.3× 5 0.1× 65 0.9× 38 515
Rebecca S. Shawgo United States 8 333 0.5× 23 0.1× 733 5.0× 4 0.0× 13 0.2× 8 1.1k
Hirofumi Takahashi Japan 16 413 0.6× 296 1.6× 536 3.6× 4 0.0× 22 0.3× 61 1.2k
Ho-Sheng Lin United States 20 54 0.1× 19 0.1× 46 0.3× 105 1.1× 8 0.1× 41 1.1k
Kevin Brenner United States 15 395 0.6× 45 0.2× 254 1.7× 35 0.4× 3 0.0× 35 993

Countries citing papers authored by S. Moreau

Since Specialization
Citations

This map shows the geographic impact of S. Moreau's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Moreau with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Moreau more than expected).

Fields of papers citing papers by S. Moreau

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Moreau. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Moreau. The network helps show where S. Moreau may publish in the future.

Co-authorship network of co-authors of S. Moreau

This figure shows the co-authorship network connecting the top 25 collaborators of S. Moreau. A scholar is included among the top collaborators of S. Moreau based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Moreau. S. Moreau is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Moreau, S., et al.. (2025). A Power Grid Electromigration Test Chip for Lifetime Characterization and Model Calibration. IEEE Transactions on Device and Materials Reliability. 25(2). 253–262.
2.
Moreau, S., et al.. (2024). Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. SPIRE - Sciences Po Institutional REpository. 85–90. 2 indexed citations
3.
Vauche, Laura, et al.. (2024). Comparative Life Cycle Analysis of Redistribution Layer for 3D Integrations. SPIRE - Sciences Po Institutional REpository. 1–11.
4.
Kim, Chris, et al.. (2024). Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis. SPIRE - Sciences Po Institutional REpository. 1–6. 1 indexed citations
5.
Lhostis, S., S. Moreau, E. Deloffre, et al.. (2024). Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm. Journal of Electronic Materials. 53(8). 4421–4431. 1 indexed citations
6.
Lhostis, S., et al.. (2023). Reliability of the hybrid bonding level using submicrometric bonding pads. Microelectronics Reliability. 150. 115189–115189. 4 indexed citations
7.
Sukharev, Valeriy, et al.. (2023). Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. SPIRE - Sciences Po Institutional REpository. 124–132. 1 indexed citations
8.
Lhostis, S., et al.. (2023). RC delay mitigation for sub 700 nm hybrid bonding pitch. SPIRE - Sciences Po Institutional REpository. 396–403. 1 indexed citations
9.
Borel, S., et al.. (2023). Recent Progress in the Development of High-Density TSV for 3-Layers CMOS Image Sensors. SPIRE - Sciences Po Institutional REpository. 1156–1163. 6 indexed citations
10.
Moreau, S., et al.. (2022). Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements. ECS Journal of Solid State Science and Technology. 11(2). 24001–24001. 35 indexed citations
11.
Arnaud, L., et al.. (2021). 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. SPIRE - Sciences Po Institutional REpository. 1–4. 5 indexed citations
12.
Dulaurent, Sylvain, Neil Loftus, S. Moreau, et al.. (2018). Fully automated sample preparation procedure to measure drugs of abuse in plasma by liquid chromatography tandem mass spectrometry. Analytical and Bioanalytical Chemistry. 410(20). 5071–5083. 22 indexed citations
13.
14.
Rochcongar, Goulven, Hélène Pillet, Elena Bergamini, et al.. (2016). A new method for the evaluation of the end-to-end distance of the knee ligaments and popliteal complex during passive knee flexion. The Knee. 23(3). 420–425. 8 indexed citations
15.
Charbonnier, Jean, et al.. (2013). Bow management with temperature for thin chips integration. European Microelectronics and Packaging Conference. 1–4. 1 indexed citations
16.
Pouydebasque, A., S. Moreau, Christophe Bouvier, et al.. (2010). Varifocal liquid lenses with integrated actuator, high focusing power and low operating voltage fabricated on 200 mm wafers. Procedia Engineering. 5. 432–435. 4 indexed citations
17.
Babin, E., et al.. (2007). Séquelles otologiques dans les fentes palatovélaires. Analyse et prise en charge. Revue de Stomatologie et de Chirurgie Maxillo-faciale. 108(4). 357–368. 2 indexed citations
18.
19.
Chamouard, V., et al.. (2001). Stability and microbiological safety of clotting factor concentrates in CADD PRIZM VIP™ pump: a preliminary study. Journal de Pharmacie Clinique. 20(3). 2 indexed citations
20.
Babin, E., et al.. (2000). [Head and neck desmoid tumor in children: a case report and review of the literature].. PubMed. 117(2). 118–25. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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