S. Chéramy

1.2k total citations
61 papers, 522 citations indexed

About

S. Chéramy is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, S. Chéramy has authored 61 papers receiving a total of 522 indexed citations (citations by other indexed papers that have themselves been cited), including 60 papers in Electrical and Electronic Engineering, 13 papers in Automotive Engineering and 10 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in S. Chéramy's work include 3D IC and TSV technologies (50 papers), Electronic Packaging and Soldering Technologies (36 papers) and Additive Manufacturing and 3D Printing Technologies (13 papers). S. Chéramy is often cited by papers focused on 3D IC and TSV technologies (50 papers), Electronic Packaging and Soldering Technologies (36 papers) and Additive Manufacturing and 3D Printing Technologies (13 papers). S. Chéramy collaborates with scholars based in France, Switzerland and United States. S. Chéramy's co-authors include A. Jouve, A. Farcy, N. Sillon, David Henry, Jean Charbonnier, Frank Fournel, Pascal Vivet, N. Bresson, Didier Lattard and Arnaud Garnier and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, IEEE Electron Device Letters and IEEE Transactions on Nuclear Science.

In The Last Decade

S. Chéramy

61 papers receiving 501 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
S. Chéramy France 14 490 104 71 42 41 61 522
W.C. Chiou Taiwan 11 467 1.0× 50 0.5× 75 1.1× 37 0.9× 49 1.2× 22 517
Scott Pozder United States 14 580 1.2× 102 1.0× 51 0.7× 46 1.1× 71 1.7× 25 607
Suresh Ramalingam United States 13 513 1.0× 63 0.6× 117 1.6× 30 0.7× 50 1.2× 38 563
M. J. Interrante United States 6 463 0.9× 77 0.7× 71 1.0× 33 0.8× 52 1.3× 7 487
P. Coudrain France 12 423 0.9× 36 0.3× 69 1.0× 31 0.7× 62 1.5× 46 487
Moongon Jung United States 14 440 0.9× 59 0.6× 53 0.7× 87 2.1× 37 0.9× 23 466
C. T. Wang Taiwan 10 338 0.7× 31 0.3× 62 0.9× 32 0.8× 37 0.9× 13 379
Yoichiro Kurita Japan 9 374 0.8× 47 0.5× 67 0.9× 21 0.5× 37 0.9× 32 387
A. Sharma United States 6 327 0.7× 47 0.5× 46 0.6× 21 0.5× 29 0.7× 8 362
Dimitrios Velenis Belgium 15 789 1.6× 99 1.0× 133 1.9× 68 1.6× 90 2.2× 86 836

Countries citing papers authored by S. Chéramy

Since Specialization
Citations

This map shows the geographic impact of S. Chéramy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Chéramy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Chéramy more than expected).

Fields of papers citing papers by S. Chéramy

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Chéramy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Chéramy. The network helps show where S. Chéramy may publish in the future.

Co-authorship network of co-authors of S. Chéramy

This figure shows the co-authorship network connecting the top 25 collaborators of S. Chéramy. A scholar is included among the top collaborators of S. Chéramy based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Chéramy. S. Chéramy is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, En Xia, Daniel M. Fleetwood, Ronald D. Schrimpf, et al.. (2021). Charge Trapping and Transconductance Degradation in Irradiated 3-D Sequentially Integrated FDSOI MOSFETs. IEEE Transactions on Nuclear Science. 68(5). 707–715. 8 indexed citations
2.
Dutoit, Denis, P. Coudrain, Pascal Vivet, et al.. (2020). How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing?. HAL (Le Centre pour la Communication Scientifique Directe). 52. 15.3.1–15.3.4. 2 indexed citations
3.
Coudrain, P., et al.. (2018). Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 9(3). 434–445. 7 indexed citations
4.
Jouve, A., V. Balan, N. Bresson, et al.. (2017). 1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy. HAL (Le Centre pour la Communication Scientifique Directe). 1–2. 27 indexed citations
5.
6.
Vinet, M., et al.. (2017). Generalized cost model for 3D systems. 1–3. 4 indexed citations
7.
Vivet, Pascal, Yvain Thonnart, R. Lemaire, et al.. (2016). A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. IEEE Journal of Solid-State Circuits. 52(1). 33–49. 25 indexed citations
8.
Chéramy, S., et al.. (2016). Towards high density 3D interconnections. 1–2. 1 indexed citations
9.
Coudrain, P., et al.. (2016). Thin micro-cold plate for hot-spot aware chip cooling. HAL (Le Centre pour la Communication Scientifique Directe). 1–8. 1 indexed citations
10.
Garnier, Arnaud, N. Bresson, F. Ponthenier, et al.. (2016). Development of fine pitch interconnections for 3D integrated circuits. 1–6. 5 indexed citations
11.
Chéramy, S., A. Jouve, L. Arnaud, et al.. (2016). Towards high density 3D interconnections. 2. 1–5. 2 indexed citations
12.
Fiori, Vincent, P. Coudrain, S. Lhostis, et al.. (2015). Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method. 2 indexed citations
13.
Fiori, Vincent, A. Farcy, F. de Crécy, et al.. (2014). Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(8). 1284–1292. 7 indexed citations
14.
Lacrevaz, T., A. Farcy, Philip R. LeDuc, et al.. (2014). RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits. Microelectronic Engineering. 130. 74–81. 3 indexed citations
15.
Fréchette, Luc G., et al.. (2013). Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications. European Microelectronics and Packaging Conference. 1–8. 2 indexed citations
16.
Lamy, Yann, et al.. (2013). Which interconnects for which 3D applications? Status and perspectives. 16. 1–6. 3 indexed citations
17.
Coudrain, P., A. Jouve, T. Magis, et al.. (2012). Towards efficient and reliable 300mm 3D technology for wide I/O interconnects. 330–335. 11 indexed citations
18.
19.
Ancey, P., Jean Charbonnier, S. Chéramy, et al.. (2010). TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration. 1–4. 4 indexed citations
20.
Charbonnier, Jean, S. Chéramy, David Henry, et al.. (2009). Integration of a temporary carrier in a TSV process flow. 99. 865–871. 48 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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