S. Chéramy

1.2k citations

61 papers · 522 indexed · h-index 14

Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies 13
Electrical and Electronic Engineering top 10%
- 3D IC and TSV technologies 50
- Electronic Packaging and Soldering Technologies 36
- Semiconductor materials and devices 12
- Advanced Memory and Neural Computing 4
Hardware and Architecture top 10%
Electronic, Optical and Magnetic Materials
- Copper Interconnects and Reliability 10
Computer Networks and Communications
Biomedical Engineering
- Advanced Surface Polishing Techniques 5
Mechanical Engineering
- Heat Transfer and Optimization 4

Co-authors: A. Jouve N. Sillon A. Farcy David Henry Jean Charbonnier Frank Fournel Pascal Vivet N. Bresson
Cited by: Automotive Engineering Electrical and Electronic Engineering Hardware and Architecture
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Nuclear Science (2 papers)Microelectronic Engineering (1 paper)
Partner nations: France Switzerland United States

In The Last Decade

S. Chéramy

61 papers receiving 501 citations

Peers

Countries citing papers authored by S. Chéramy

Since Specialization

Citations

This map shows the geographic impact of S. Chéramy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Chéramy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Chéramy more than expected).

Fields of papers citing papers by S. Chéramy

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S. Chéramy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Chéramy. The network helps show where S. Chéramy may publish in the future.

Co-authorship network

The 25 scholars most cited alongside S. Chéramy, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with S. Chéramy Line = papers co-authored together S. Chéramy links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Charge Trapping and Transconductance Degradation in Irradiated 3-D Sequentially Integrated FDSOI MOSFETs IEEE Transactions on Nuclear Science ·Aabhas Rastogi,En Xia Zhang,Daniel M. Fleetwood,Ronald D. Schrimpf,Robert A. Reed,S. Moreau,S. Chéramy,P. Batude,Laurent Brunet,François Andrieu,Michael L. Alles	2021	8
2	How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing? HAL (Le Centre pour la Communication Scientifique Directe) ·Denis Dutoit,P. Coudrain,E. O. Chashhukhin,Pascal Vivet,Jean Charbonnier,Arnaud Garnier,Didier Lattard,S. Chéramy,Чебанов Виктор Сергеевич,А.Б. Полонский,Yvain Thonnart,F. Clermidy	2020	2
3	Characterization of Fine Pitch Hybrid Bonding Pads using Electrical Misalignment Test Vehicle SPIRE - Sciences Po Institutional REpository ·Clara E. Pablos-Puertas,Didier Lattard,Pascal Vivet,Wei-ke Chen,S. Chéramy,Édith Beigné,A. Farcy,구난희,Y. Henrion,E. Deloffre,Luis Humberto Villamizar Garcia	2019	17
4	Add-On Microchannels for Hotspot Thermal Management of Microelectronic Chips in Compact Applications IEEE Transactions on Components Packaging and Manufacturing Technology ·Marta Arrondo Turrado,María Alejandra Duarte Arguello,P. Coudrain,Diego Conca Carbonell,S. Chéramy,A. Souifi,Luc G. Fréchette	2018	7
5	Electrical Performance of High Density 10 µm Diameter 20 µm Pitch Cu-Pillar with Chip to Wafer Assembly Arnaud Garnier,L. Arnaud,符志华,A. Toffoli,S. Moreau,Aslam Nauman,S. Chéramy	2017	5
6	Generalized cost model for 3D systems รณภูมิ สามัคคีคารมย์,M. Vinet,S. Chéramy,S Bansal,Olivier Faynot,Thomas Signamarcheix,Amir Kamran Soltanzadeh	2017	4
7	1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy HAL (Le Centre pour la Communication Scientifique Directe) ·A. Jouve,V. Balan,N. Bresson,L. Matos,Frank Fournel,Rreze Kryeziu,Yerbol Yerbayev,Christelle L. Martinez Estrada,C. Beitia,L. Arnaud,S. Chéramy,S. Lhostis,A. Farcy,Stephanie D. Bower,A. I. Shugurov	2017	27
8	Thin micro-cold plate for hot-spot aware chip cooling HAL (Le Centre pour la Communication Scientifique Directe) ·Marta Arrondo Turrado,Diego Conca Carbonell,María Alejandra Duarte Arguello,P. Coudrain,S. Chéramy,A. Souifi,Luc G. Fréchette	2016	1
9	Towards high density 3D interconnections S. Chéramy,A. Jouve,Wei-ke Chen,Andrea Vissotski,P. Batude,M. Vinet	2016	1
10	A $4 \times 4 \times 2$ Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links IEEE Journal of Solid-State Circuits ·Pascal Vivet,Yvain Thonnart,R. Lemaire,I. Eardley,Édith Beigné,Christian Bernard,최정은,Didier Lattard,Ivan Miro-Panades,Denis Dutoit,Fabien Clermidy,S. Chéramy,栄三二ノ宮,Frédéric Pétrot,Éric Flamand,J. Michailos,J Rodney Turner,Oleg Rodionoviсh Podobin,Juergen Schloeffel	2016	25
11	Development of fine pitch interconnections for 3D integrated circuits Aslam Nauman,Arnaud Garnier,N. Bresson,F. Ponthenier,Dorothea Howe,F. Casset,A. Jouve,Didier Lattard,S. Chéramy	2016	5
12	Microchannel Design Study for 3D Microelectronics Cooling Using a Hybrid Analytical and Finite Element Method Marta Arrondo Turrado,Vincent Fiori,P. Coudrain,S. Lhostis,S. Chéramy,María Alejandra Duarte Arguello,B. Mathieu,A. Souifi,Luc G. Fréchette	2015	2
13	Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations IEEE Transactions on Components Packaging and Manufacturing Technology ·Rian Slenders,Vincent Fiori,A. Farcy,F. de Crécy,M. E. Bruim,A. Borbély,P. Coudrain,María Alejandra Duarte Arguello,Ferya Taş,Bastien Giraud,S. Chéramy,C. Tavernier,J. Michailos	2014	7
14	RF characterization of the substrate coupling noise between TSV and active devices in 3D integrated circuits Microelectronic Engineering ·R V Amruthashree,Aida Shikhaliyeva,T. Lacrevaz,A. Farcy,Y. 月 Xu 徐,Philip R. LeDuc,M. E. Bruim,S. Chéramy,N. Sillon,B. Fléchet	2014	3
15	Impact of integrating microchannel cooling within 3D microelectronic packages for portable applications European Microelectronics and Packaging Conference ·Marta Arrondo Turrado,Luc G. Fréchette,Susan Rachmawati,S. Lhostis,F. de Crécy,S. Chéramy,María Alejandra Duarte Arguello,Vincent Fiori	2013	2
16	Which interconnects for which 3D applications? Status and perspectives Yann Lamy,María Alejandra Duarte Arguello,Antero Iván Zamora Rojas,Philip R. LeDuc,S. Chéramy,C. Laviron	2013	3
17	Towards efficient and reliable 300mm 3D technology for wide I/O interconnects P. Coudrain,María Alejandra Duarte Arguello,A. B. Dehlsen,Yilber Hernández Gómez,武田和夫,Uo B,Igor Krychkov,A. Jouve,Маннаников Роман Сергеевич,T. Magis,P. Besson,Orbelina Eguizábal,J. LeVan,Ernesto Rodríguez Roche,C. Laviron,S. Chéramy,Ömer Ceran,李曉蓮,A. Farcy,Iratna Pangalih	2012	11
18	Electrical and morphological assessment of via middle and backside process technology for 3D integration María Alejandra Duarte Arguello,P. Coudrain,Yilber Hernández Gómez,武田和夫,Uo B,A. B. Dehlsen,A. Jouve,Iratna Pangalih,Thomas Frank,J. LeVan,S. Chéramy,N. Sillon	2012	11
19	TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration Hiroki Kanato,P. Ancey,Allan C. Zinn,Jean Charbonnier,S. Chéramy,Dra Wiwik Dwi Hastuti,A. Farcy,Yilber Hernández Gómez,Yueyang Zhao,David Henry,Philip R. LeDuc,李曉蓮,Ömer Ceran,N. Sillon	2010	4
20	Integration of a temporary carrier in a TSV process flow Jean Charbonnier,S. Chéramy,David Henry,DAVID M. MAGYAR,J.J. Brun,N. Sillon,A. Jouve,محدثه شاهرخآبادی,Anemari Monica Negru,N.V. Ivanuyshko–Nazarko,Hans M�ller,Dorey Lg	2009	48

About S. Chéramy

S. Chéramy is a scholar working on Automotive Engineering, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 61 papers that have together received 522 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (50 papers), Electronic Packaging and Soldering Technologies (36 papers), Additive Manufacturing and 3D Printing Technologies (13 papers), Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (10 papers), Advanced Surface Polishing Techniques (5 papers), Heat Transfer and Optimization (4 papers) and Advanced Memory and Neural Computing (4 papers). The work is most often cited by research in Automotive Engineering (104 citations), Electrical and Electronic Engineering (490 citations) and Hardware and Architecture (40 citations). S. Chéramy has collaborated with scholars based in France, Switzerland and United States. Frequent co-authors include A. Jouve, N. Sillon, A. Farcy, David Henry, Jean Charbonnier, Frank Fournel, Pascal Vivet, N. Bresson, Didier Lattard and J. Michailos. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Nuclear Science, Microelectronic Engineering, IEEE Design and Test and IEEE Journal of Solid-State Circuits.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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