A. Jouve

616 citations

30 papers · 294 indexed · h-index 11

Impact in

Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Electrical and Electronic Engineering
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Advancements in Photolithography Techniques

Papers in

Automotive Engineering 8
- Additive Manufacturing and 3D Printing Technologies 8
Electrical and Electronic Engineering 29
- 3D IC and TSV technologies 28
- Electronic Packaging and Soldering Technologies 19
- Semiconductor materials and devices 6
- Advancements in Photolithography Techniques 4
- Integrated Circuits and Semiconductor Failure Analysis 2

Co-authors: S. Chéramy N. Sillon David Henry Frank Fournel S. Lhostis J.J. Brun V. Balan N. Bresson
Journals: Journal of Instrumentation (1 paper)SPIRE - Sciences Po Institutional REpository (8 papers)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)HAL (Le Centre pour la Communication Scientifique Directe) (1 paper)
Partner nations: France United States Austria

In The Last Decade

A. Jouve

29 papers receiving 272 citations

Peers

Countries citing papers authored by A. Jouve

Since Specialization

Citations

This map shows the geographic impact of A. Jouve's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Jouve with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Jouve more than expected).

Fields of papers citing papers by A. Jouve

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by A. Jouve. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Jouve. The network helps show where A. Jouve may publish in the future.

Co-authorship network

The 25 scholars most cited alongside A. Jouve, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with A. Jouve Line = papers co-authored together A. Jouve links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	A new method for structural diagnostics with muon tomography and deep learning Journal of Instrumentation ·L. Pezzotti, Donato Michele Cifarelli, 三枝好恵, Tatsuhiko EGASHIRA, Alessandro Souza, Frontini Mariana, Martine Broda, I. Gnesi, A. Jouve, Alessio Marrani	2025	0
2	A reliable copper-free wafer level hybrid bonding technology for high-performance medical imaging sensors SPIRE - Sciences Po Institutional REpository ·A. Jouve, Jibi Belghese, Romain Crochemore, Yerbol Yerbayev, Jamie Campbell, Tomas L. Östberg, V. Balan, Frank Fournel, 一典鈴木, Thomas Edward Braidwood, Thomas E. Shifflett, N. Schramma, Simran Yadav, A. Faes, Jens Hofrichter	2020	11
3	Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields SPIRE - Sciences Po Institutional REpository ·A. Jouve, L. Sanchez, Noriko Kogawa, N. Bresson, Frank Fournel, F. Akiba, Lívia Ferreira Boaro	2019	7
4	Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development SPIRE - Sciences Po Institutional REpository ·一典鈴木, Paul Stewart, Tomas L. Östberg, Jibi Belghese, Elmi Joy, N. Bresson, G. Romano, Daniel Scevola, V. Balan, J. Dechamp, Marc Zussy, Yerbol Yerbayev, Noriko Kogawa, L. Sanchez, A. Jouve, Frank Fournel, S. Chéramy	2019	9
5	Robustness and reliability achievements for direct hybrid bonding integration: a review SPIRE - Sciences Po Institutional REpository ·S. Moreau, 구난희, S. Lhostis, D. Bouchu, Y. Henrion, L. Arnaud, A. Jouve, V. Balan, Frank Fournel, M. Aryana Bryan, S. Chéramy, L. Di Cioccio	2019	2
6	Self-Assembly Process for 3D Die-to-Wafer using Direct Bonding: A Step Forward Toward Process Automatisation SPIRE - Sciences Po Institutional REpository ·A. Jouve, Loïc Sanchez, Noriko Kogawa, M. Shivabalakrishnan, Elmi Joy, Caio Paiva Faria Fin, Oleksandr Zavalii, Frank Fournel, S. Chéramy	2019	7
7	Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability L. Arnaud, S. Moreau, A. Jouve, Clara E. Pablos-Puertas, Didier Lattard, Frank Fournel, Nipa Basak, Rreze Kryeziu, V. Balan, N. Bresson, S. Lhostis, 구난희, E. Deloffre, Stephanie D. Bower, A. Farcy, 梁成功, H. M. Scott	2018	16
8	1μm Pitch direct hybrid bonding with <300nm wafer-to-wafer overlay accuracy HAL (Le Centre pour la Communication Scientifique Directe) ·A. Jouve, V. Balan, N. Bresson, L. Matos, Frank Fournel, Rreze Kryeziu, Yerbol Yerbayev, Christelle L. Martinez Estrada, C. Beitia, L. Arnaud, S. Chéramy, S. Lhostis, A. Farcy, Stephanie D. Bower, A. I. Shugurov	2017	27
9	Towards high density 3D interconnections S. Chéramy, A. Jouve, Wei-ke Chen, Andrea Vissotski, P. Batude, M. Vinet	2016	1
10	Development of fine pitch interconnections for 3D integrated circuits Aslam Nauman, Arnaud Garnier, N. Bresson, F. Ponthenier, Dorothea Howe, F. Casset, A. Jouve, Didier Lattard, S. Chéramy	2016	5
11	Towards high density 3D interconnections S. Chéramy, A. Jouve, L. Arnaud, C. Fenouillet-Béranger, P. Batude, M. Vinet	2016	2
12	200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS Bernhard Rebhan, О К Малышева, Masaaki MATSUNAGA, Joanne Mullins Olson, Muhammad Farukh, S. Lhostis, E. Deloffre, A. Jouve, V. Balan, L. Chitu	2015	16
13	Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement A. Jouve, Svetlana Ptushkina, Arnaud Garnier, Y. Xu, 武田和夫, Maxime Argoud, Ernesto Rodríguez Roche, L. Baud, J. Dechamp, 符志华, S. Chéramy, Geoff O'Dea, K. Kondo	2015	1
14	Underfilling techniques comparison in 3D CtW stacking approach Arnaud Garnier, A. Jouve, 符志华, S. Chéramy	2014	8
15	Innovative wafer-level encapsulation & underfill material for silicon interposer application Kirsten Rae T. Ong, A. Jouve, S. Joblot, Yann Lamy, A. Schreiner, Pierre Montméat, Barkah Zudhi Bardani, Maxime Argoud, Frank Fournel, Antero Iván Zamora Rojas, S. Chéramy	2013	14
16	Towards efficient and reliable 300mm 3D technology for wide I/O interconnects P. Coudrain, María Alejandra Duarte Arguello, A. B. Dehlsen, Yilber Hernández Gómez, 武田和夫, Uo B, Igor Krychkov, A. Jouve, Маннаников Роман Сергеевич, T. Magis, P. Besson, Orbelina Eguizábal, J. LeVan, Ernesto Rodríguez Roche, C. Laviron, S. Chéramy, Ömer Ceran, 李曉蓮, A. Farcy, Iratna Pangalih	2012	11
17	Electrical and morphological assessment of via middle and backside process technology for 3D integration María Alejandra Duarte Arguello, P. Coudrain, Yilber Hernández Gómez, 武田和夫, Uo B, A. B. Dehlsen, A. Jouve, Iratna Pangalih, Thomas Frank, J. LeVan, S. Chéramy, N. Sillon	2012	11
18	Integration of a temporary carrier in a TSV process flow Jean Charbonnier, S. Chéramy, David Henry, DAVID M. MAGYAR, J.J. Brun, N. Sillon, A. Jouve, محدثه شاهرخآبادی, Anemari Monica Negru, N.V. Ivanuyshko–Nazarko, Hans M�ller, Dorey Lg	2009	48
19	Temporary bonding for Chips In Wafer processing Jean-Charles Souriau, A. Jouve, N. Sillon	2009	4
20	Overcoming pattern collapse of ultra high resolution dense lines obtained with EUV resists Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·A. Jouve, Julia Simon, J. Foucher, David Tormey, J.H. Tortai, Harun H. Solak	2005	12

About A. Jouve

A. Jouve is a scholar working on Automotive Engineering, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Hardware and Architecture, having authored 30 papers that have together received 294 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (28 papers), Electronic Packaging and Soldering Technologies (19 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Copper Interconnects and Reliability (7 papers), Semiconductor materials and devices (6 papers), Advanced Surface Polishing Techniques (5 papers), Advancements in Photolithography Techniques (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). The work is most often cited by research in Automotive Engineering (80 citations), Electrical and Electronic Engineering (289 citations), Electronic, Optical and Magnetic Materials (44 citations), Biomedical Engineering (62 citations) and Hardware and Architecture (6 citations). A. Jouve has collaborated with scholars based in France, United States and Austria. Frequent co-authors include S. Chéramy, N. Sillon, David Henry, Frank Fournel, S. Lhostis, J.J. Brun, V. Balan, N. Bresson, A. Farcy and L. Arnaud. Their work appears in journals such as Journal of Instrumentation, SPIRE - Sciences Po Institutional REpository, Additional Conferences (Device Packaging HiTEC HiTEN & CICMT), Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE and HAL (Le Centre pour la Communication Scientifique Directe).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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