H. Moriceau

2.4k citations

120 papers · 1.7k indexed · h-index 23

Impact in

Electrical and Electronic Engineering top 5%
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Silicon and Solar Cell Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Photonic and Optical Devices
Structural Biology top 10%

Papers in

Electrical and Electronic Engineering 103
- 3D IC and TSV technologies 58
- Electronic Packaging and Soldering Technologies 34
- Semiconductor materials and devices 33
- Integrated Circuits and Semiconductor Failure Analysis 25
- Silicon and Solar Cell Technologies 20
- Thin-Film Transistor Technologies 11
Condensed Matter Physics 17
- Physics of Superconductivity and Magnetism 13

Co-authors: Frank Fournel F. Rieutord Christophe Morales B. Aspar Christophe Maleville L. Libralesso Jean‐Luc Rouvière K. Rousseau
Journals: Materials Science and Engineering B (7 papers)Applied Physics Letters (7 papers)Microsystem Technologies (6 papers)Microelectronic Engineering (6 papers)Journal of Applied Physics (5 papers)
Partner nations: France Belgium Switzerland

In The Last Decade

H. Moriceau

115 papers receiving 1.6k citations

Peers

Countries citing papers authored by H. Moriceau

Since Specialization

Citations

This map shows the geographic impact of H. Moriceau's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Moriceau with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Moriceau more than expected).

Fields of papers citing papers by H. Moriceau

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Moriceau. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Moriceau. The network helps show where H. Moriceau may publish in the future.

Co-authors

The 25 scholars most cited alongside H. Moriceau, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with H. Moriceau Line = papers co-authored together H. Moriceau links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Adhesion Energy and Bonding Wave Velocity Measurements ECS Transactions ·Vincent Larrey, Yerbol Yerbayev, 姚帅, Rebecca Lynn Pledger, F. Rieutord, Christophe Morales, Virginia Rokoua, H. Moriceau	2016	16
2	Atomic scale fabrication of dangling bond structures on hydrogen passivated Si(001) wafers processed and nanopackaged in a clean room environment Applied Surface Science ·Marek Kolmer, Szymon Godlewski, Rafał Zuzak, André Frogerais, HirotaIsao, Aurélie Thuaire, Jean‐Michel Hartmann, H. Moriceau, Christian Joachim, Marek Szymoński	2013	27
3	Low temperature direct bonding assisted by CMP and plasma activation H. Moriceau, F. Rieutord, Frank Fournel, B. Imbert, Neng Ayu Herawati, François Baudin, HirotaIsao, Christophe Morales	2012	1
4	Measurement of bonding energy in an anhydrous nitrogen atmosphere and its application to silicon direct bonding technology Journal of Applied Physics ·Frank Fournel, V. I. Tokmantsev, Christophe Morales, 霍秋艳, H. Moriceau, F. Rieutord, Alexandre Barthelemy, Ionut Radu	2012	58
5	Germanium oxynitride (GeOxNy) as a back interface passivation layer for Germanium-on-insulator substrates Applied Physics Letters ·Thomas Signamarcheix, F. Allibert, F. Letertre, T. Chevolleau, L. Sanchez, E. Augendre, C. Deguet, H. Moriceau, L. Clavelier, F. Rieutord	2008	5
6	Realization of AlGaN/GaN HEMTs on Si‐on‐polySiC substrates Physica status solidi. C, Conferences and critical reviews/Physica status solidi. C, Current topics in solid state physics ·Y. Cordier, Sébastien Chenot, M. Laügt, O. Tottereau, Roxann Brna, Fabrice Semond, J. Massies, L. Di Cioccio, H. Moriceau	2007	1
7	Surface Plasma Activation Before Direct Wafer Bonding : A Short Review and Recent Results ECS Meeting Abstracts ·H. Moriceau, F. Rieutord, Christophe Morales, A. Shimmin, Anne‐Marie Charvet	2006	4
8	Rough Surface Adhesion Mechanisms for Wafer Bonding ECS Transactions ·F. Rieutord, H. Moriceau, R. Beneyton, Luciana Capello, Christophe Morales, Anne‐Marie Charvet	2006	28
9	Dynamics of a Bonding Front Physical Review Letters ·F. Rieutord, Wang Yunqiang, H. Moriceau	2005	43
10	Silicon-on-insulator photonic bandgap structures for future microphotonic devices Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·E. Hadji, Benoît Cluzel, D. Sotta, M. Zelsmann, Emmanuelle Picard, V. Calvo, T. Charvolin, M. Heitzmann, H. Moriceau, Christian Seassal, Xavier Letartre, Patrick Ferrand	2004	1
11	Smart-Cut(R) process: an original way to obtain thin films by ion implantation B. Aspar, C. Lagahe, H. Moriceau, Assunta Sias, E. Jalaguier, B. Biasse, A.M. Papon, Amal Chabli, A. Claverie, J. Grisolia, G. Benassayag, T. Barge, F. Letertre, B. Ghyselen	2003	0
12	Gate oxide integrity testing on SOI wafers without test structure fabrication Marcus Alexandre Carvalho Winitskowski da Silveira, Kuanysh S. Moldasan, G. Reimbold, H. Moriceau, T. Barge, A.J. Auberton‐Hervé	2002	0
13	Resonant optical microcavity based on crystalline silicon active layer Journal of Applied Physics ·D. Sotta, E. Hadji, N. Magnéa, 史隆所, P. Besson, P Renard, H. Moriceau	2002	11
14	The generic nature of the Smart-Cut® process for thin film transfer Journal of Electronic Materials ·B. Aspar, H. Moriceau, E. Jalaguier, C. Lagahe, Assunta Sias, B. Biasse, A.M. Papon, A. Claverie, J. Grisolia, G. Benassayag, F. Letertre, Betül Karakaş, T. Barge, Christophe Maleville, B. Ghyselen	2001	81
15	Structural characterization of ultra-thin (0 0 1) silicon films bonded onto (0 0 1) silicon wafers: Materials Science in Semiconductor Processing ·K. Rousseau, Jean‐Luc Rouvière, Frank Fournel, H. Moriceau	2001	11
16	Ultra thin silicon films directly bonded onto silicon wafers Materials Science and Engineering B ·Frank Fournel, H. Moriceau, N. Magnéa, J. Eymery, Jean‐Luc Rouvière, K. Rousseau, B. Aspar	2000	21
17	SMART-CUT: The Basic Fabrication Process for UNIBOND SOI Wafers IEICE Transactions on Electronics ·A.J. Auberton‐Hervé, M. Bruel, B. Aspar, Christophe Maleville, H. Moriceau	1997	13
18	Detailed characterization of Unibond material Microelectronic Engineering ·Daniela Munteanu, Christophe Maleville, S. Cristoloveanu, H. Moriceau, B. Aspar, C. Raynaud, O. Faynot, Leonardo Medeiros Salau, Maria de Nazaré Sousa Gomes Castro	1997	6
19	Refractive index of Bi-substituted magnetic garnet films IEEE Transactions on Magnetics ·H. Moriceau, B. Ferrand, M. Armand, Michel Olivier, N. Albughobei, J. Daval	1984	10
20	Properties of 2 µm bubbles garnet films IEEE Transactions on Magnetics ·B. Ferrand, H. Moriceau, N. Albughobei, J. Daval	1978	7

About H. Moriceau

H. Moriceau is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Electronic, Optical and Magnetic Materials, having authored 120 papers that have together received 1.7k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (58 papers), Electronic Packaging and Soldering Technologies (34 papers), Semiconductor materials and devices (33 papers), Integrated Circuits and Semiconductor Failure Analysis (25 papers), Silicon and Solar Cell Technologies (20 papers), Advanced Surface Polishing Techniques (14 papers), Physics of Superconductivity and Magnetism (13 papers) and Thin-Film Transistor Technologies (11 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.3k citations), Structural Biology (25 citations), Atomic and Molecular Physics, and Optics (431 citations), Condensed Matter Physics (161 citations) and Biomedical Engineering (423 citations). H. Moriceau has collaborated with scholars based in France, Belgium and Switzerland. Frequent co-authors include Frank Fournel, F. Rieutord, Christophe Morales, B. Aspar, Christophe Maleville, L. Libralesso, Jean‐Luc Rouvière, K. Rousseau, L. Di Cioccio and J. Eymery. Their work appears in journals such as Materials Science and Engineering B, Applied Physics Letters, Microsystem Technologies, Microelectronic Engineering and Journal of Applied Physics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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